Works about MICROELECTRONICS

Results: 2055

The impact of airborne molecular bases on DUV photoresists.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 63

By:

Ruede, David;
Ereken, Monique;
Borgers, Tom

Publication type:

Article

Europe.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

Better EDA tool integration needed for growing SoC market.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 58

By:

Raisanen, Walfred

Publication type:

Article

Suppliers' successes with 300mm tools and materials.

Published in:: Solid State Technology, 2001, v. 44, n. 5, p. 91
Publication type:: Article

Analyzing and characterizing 193nm resist shrinkage.

Published in:

Solid State Technology, 2001, v. 44, n. 5, p. 52

By:

Su, Bo;
Eytan, Guy;
Padmanaban, Munirathna;
Romano, Andrew

Publication type:

Article

A view into Selete's 300mm program.

Published in:

Solid State Technology, 2000, v. 43, n. 12, p. 30

By:

Burggraaf, Pieter

Publication type:

Article

PEB process in a CA resist.

Published in:

Solid State Technology, 2000, v. 43, n. 8, p. 95

By:

Hinsberg, William;
Hoffnagle, John;
Houle, Frances

Publication type:

Article

Space charge effects in e-beam projection lithography.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 241

By:

Mkrtchyan, Masis;
Liddle, J. Alexander;
Harriott, Lloyd R.;
Munro, Eric

Publication type:

Article

Cu contamination control for advanced interconnect manufacturing.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 137

By:

Dornisch, Dieter;
Li, Guangming;
Brongo, Maureen

Publication type:

Article

Wacker Siltronic introduces fLASH wafer.

Published in:

Solid State Technology, 2000, v. 43, n. 1, p. 20

By:

Villeneuve, Meg

Publication type:

Article

Environmentally friendly single-wafer spin cleaning.

Published in:

Solid State Technology, 1999, v. 42, n. 11, p. 73

By:

Hattori, Takeshi

Publication type:

Article

CMP being applied to 5-layer MEMS technology.

Published in:

Solid State Technology, 1999, v. 42, n. 11, p. 22

By:

Burggraaf, Pieter

Publication type:

Article

The `bottom line' of automated wafer-level tracking.

Published in:

Solid State Technology, 1999, v. 42, n. 7, p. 141

By:

Bailey, Tim;
Clark, Jeff

Publication type:

Article

MEMS program at Singapore's Institute of Microelectronics.

Published in:

Solid State Technology, 1998, v. 41, n. 11, p. 28

By:

Lim, Jason

Publication type:

Article

Effects of Oxidation and Particle Shape on Critical Volume Fractions of Silver-Coated Copper Powders in Conductive Adhesives for Microelectronic Applications.

Published in:

Polymer Engineering & Science, 2004, v. 44, n. 11, p. 2075, doi. 10.1002/pen.20212

By:

Yung-Sen Lin;
Sheng-Shiang Chiu

Publication type:

Article

Draft Angle and Surface Roughness Effects on Stereolithography Molds.

Published in:

Polymer Engineering & Science, 2000, v. 40, n. 7, p. 1581, doi. 10.1002/pen.11288

By:

Cedorge, Thomas;
Colton, Jonathan

Publication type:

Article

Cross-sectional indentation technique for thick film interfacial adhesion characterisation.

Published in:

Surface Engineering, 2009, v. 25, n. 2, p. 97, doi. 10.1179/026708408X347641

By:

Lee, C. Y.;
Dupeux, M.;
Tuan, W. H.

Publication type:

Article

Current developments in ionised physical vapour deposition by magnetron sputtering — state of the art — prospects for the future in terms of applications.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 319, doi. 10.1179/174329408X3268

By:

Tessier, P. Y.

Publication type:

Article

Status of technology of carbon nitride films: challenges and opportunties.

Published in:

Surface Engineering, 2006, v. 22, n. 5, p. 321, doi. 10.1179/174329406X150206

By:

Rodil, S. E.

Publication type:

Article

Status of pulsed laser deposition: challenges and opportunities.

Published in:

Surface Engineering, 2006, v. 22, n. 2, p. 81, doi. 10.1179/174329406X98502

By:

Kuppusami, P.;
Raghunathan, V. S.

Publication type:

Article

Inorganic materials and coatings produced by EBPVD.

Published in:

Surface Engineering, 2006, v. 22, n. 1, p. 35, doi. 10.1179/174329406X85029

By:

Movchan, B. A.

Publication type:

Article

Battery-aware power savings.

Published in:

Electronics Systems & Software, 2006, v. 4, n. 2, p. 10, doi. 10.1049/ess:20060201

By:

Lahiri, Anirban;
Basu, Anupam;
Choudhury, Monojit;
Mitra, Srobona

Publication type:

Article

A Bio‐Based Allylphenol (Eugenol)‐Functionalized Fluorinated Maleimide with Low Dielectric Constant and Low Water Uptake.

Published in:

Macromolecular Chemistry & Physics, 2018, v. 219, n. 20, p. N.PAG, doi. 10.1002/macp.201800252

By:

Fang, Linxuan;
Zhou, Junfeng;
Wang, Jiajia;
Sun, Jing;
Fang, Qiang

Publication type:

Article

A New Four-Arm Organosiloxane with Thermopolymerizable Trifluorovinyl ether Groups: Synthesis and Conversion to the Polymer with both Low Dielectric Constant and Low Water Uptake.

Published in:

Macromolecular Chemistry & Physics, 2017, v. 218, n. 13, p. n/a, doi. 10.1002/macp.201700010

By:

Xin, Yumeng;
Wang, Jiajia;
Jin, Kaikai;
Luo, Yijie;
Zhou, Junfeng;
Wang, Yuanqiang;
Sun, Jing;
Zheng, Shijun;
Fang, Qiang

Publication type:

Article

Tuning Block Polymer Structure, Properties, and Processability for the Design of Efficient Nanostructured Materials Systems.

Published in:

Macromolecular Chemistry & Physics, 2017, v. 218, n. 5, p. n/a, doi. 10.1002/macp.201600513

By:

Morris, Melody A.;
Gartner, Thomas E.;
Epps, Thomas H.

Publication type:

Article

New Fluoropolymers Having Both Low Water Uptake and a Low Dielectric Constant.

Published in:

Macromolecular Chemistry & Physics, 2015, v. 216, n. 23, p. 2302, doi. 10.1002/macp.201500394

By:

He, Fengkai;
Jin, Kaikai;
Wang, Jiajia;
Luo, Yijie;
Sun, Jing;
Fang, Qiang

Publication type:

Article

Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 1, p. n/a, doi. 10.1002/adfm.201604281

By:

Nan, Kewang;
Luan, Haiwen;
Yan, Zheng;
Ning, Xin;
Wang, Yiqi;
Wang, Ao;
Wang, Juntong;
Han, Mengdi;
Chang, Matthew;
Li, Kan;
Zhang, Yutong;
Huang, Wen;
Xue, Yeguang;
Huang, Yonggang;
Zhang, Yihui;
Rogers, John A.

Publication type:

Article

Spin-Structured Multilayers: A New Class of Materials for Precision Spintronics.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 41, p. 7423, doi. 10.1002/adfm.201603191

By:

Schlage, Kai;
Bocklage, Lars;
Erb, Denise;
Comfort, Jade;
Wille, Hans‐Christian;
Röhlsberger, Ralf

Publication type:

Article

Toward Flexible Spintronics: Perpendicularly Magnetized Synthetic Antiferromagnetic Thin Films and Nanowires on Polyimide Substrates.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 26, p. 4704, doi. 10.1002/adfm.201505138

By:

Vemulkar, T.;
Mansell, R.;
Fernández‐Pacheco, A.;
Cowburn, R. P.

Publication type:

Article

Silicon-Modified Rare-Earth Transitions-A New Route to Near- and Mid-IR Photonics.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 12, p. 1986, doi. 10.1002/adfm.201504662

By:

Lourenço, Manon A.;
Hughes, Mark A.;
Lai, Khue T.;
Sofi, Imran M.;
Ludurczak, Willy;
Wong, Lewis;
Gwilliam, Russell M.;
Homewood, Kevin P.

Publication type:

Article

Manipulation of Electric Field Effect by Orbital Switch.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 5, p. 753, doi. 10.1002/adfm.201504036

By:

Cui, Bin;
Song, Cheng;
Mao, Haijun;
Yan, Yinuo;
Li, Fan;
Gao, Shuang;
Peng, Jingjing;
Zeng, Fei;
Pan, Feng

Publication type:

Article

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 28, p. 4430, doi. 10.1002/adfm.201500990

By:

Zhang, Yong;
Han, Haoxue;
Wang, Nan;
Zhang, Pengtu;
Fu, Yifeng;
Murugesan, Murali;
Edwards, Michael;
Jeppson, Kjell;
Volz, Sebastian;
Liu, Johan

Publication type:

Article

Materials and Wireless Microfluidic Systems for Electronics Capable of Chemical Dissolution on Demand.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 9, p. 1338, doi. 10.1002/adfm.201403573

By:

Lee, Chi Hwan;
Jeong, Jae‐Woong;
Liu, Yuhao;
Zhang, Yihui;
Shi, Yan;
Kang, Seung‐Kyun;
Kim, Jeonghyun;
Kim, Jae Soon;
Lee, Na Yeon;
Kim, Bong Hoon;
Jang, Kyung‐In;
Yin, Lan;
Kim, Min Ku;
Banks, Anthony;
Paik, Ungyu;
Huang, Yonggang;
Rogers, John A.

Publication type:

Article

Microflotronics: A Flexible, Transparent, Pressure-Sensitive Microfluidic Film.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 39, p. 6195, doi. 10.1002/adfm.201401527

By:

Li, Ruya;
Nie, Baoqing;
Digiglio, Philip;
Pan, Tingrui

Publication type:

Article

Tunable Assembly of sp3 Cross-Linked 3D Graphene Monoliths: A First-Principles Prediction.

Published in:

Advanced Functional Materials, 2014, v. 23, n. 47, p. 5846, doi. 10.1002/adfm.201301077

By:

Jiang, Xue;
Zhao, Jijun;
Li, Yan‐Ling;
Ahuja, Rajeev

Publication type:

Article

A Negative Conductivity Material Makes a dc Invisibility Cloak Hide an Object at a Distance.

Published in:

Advanced Functional Materials, 2014, v. 23, n. 35, p. 4306, doi. 10.1002/adfm.201300226

By:

Yang, Fan;
Mei, Zhong Lei;
Yang, Xin Yu;
Jin, Tian Yu;
Cui, Tie Jun

Publication type:

Article

Synthesis and characterization of lead-free double perovskite Mg2LaVO6.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7691, doi. 10.1007/s10854-022-07919-1

By:

Behera, S.;
Parida, B. N.;
Parida, R. K.;
Padhee, R.

Publication type:

Article

Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 861, doi. 10.1007/s10854-020-04864-9

By:

Kumaresan, Vigneshwarram;
Sreekantan, Srimala;
Devarajan, Mutharasu;
Mohamed, Khairudin

Publication type:

Article

Heterostructure device based on Brilliant Green nanoparticles–PVA/p-Si interface for analog–digital converting dual-functional sensor applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 3256, doi. 10.1007/s10854-020-02874-1

By:

Nawar, Ahmed M.;
El-Mahalawy, Ahmed M.

Publication type:

Article

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3

By:

El-Daly, A. A.;
Zohdy, K. M.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Ultra-low temperature co-fired CaV2O6-glass composite ceramic substrate for microelectronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7637, doi. 10.1007/s10854-019-01079-5

By:

Sasidharanpillai, Arun;
Thomas, Sebastian Mailadil;
Lee, Younki;
Kim, Hyo Tae

Publication type:

Article

Trap density simulations on CZTSSe solar cells with AMPS-1D.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15445, doi. 10.1007/s10854-018-9075-3

By:

Conde, J.;
Zuñiga, I.;
Vilchis, H.;
Hérnandez-Como, N.;
Pola-Albores, F.;
Pantoja, J.

Publication type:

Article

The free-standing multilayer thick films of 0.7Pb(Zr0.46Ti0.54)O3-0.1Pb(Zn1/3Nb2/3)O3-0.2Pb(Ni1/3Nb2/3)O3 with low co-fired temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 14, p. 11664, doi. 10.1007/s10854-018-9263-1

By:

Gao, Jifeng;
Ma, Weibing;
Yang, Yixuan;
Guo, Jingdong;
Zhao, Huaidang;
Ma, Minjie

Publication type:

Article

Nanoscale polysilicon in sensors of physical values at cryogenic temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8364, doi. 10.1007/s10854-018-8847-0

By:

Druzhinin, Anatoly;
Ostrovskii, Igor;
Khoverko, Yuriy;
Rogacki, Krzysztof;
Kogut, Igor;
Golota, Victor

Publication type:

Article

Synthesis of 3D porous flower-like NiO/Ni6MnO8 composites for supercapacitor with enhanced performance.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7510, doi. 10.1007/s10854-018-8742-8

By:

Zhang, Junjie;
Hu, Ruirui;
Dai, Peng;
Bai, Zhiman;
Yu, Xinxin;
Wu, Mingzai;
Li, Guang

Publication type:

Article

Isovalent doping and the CiOi defect in germanium.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 4261, doi. 10.1007/s10854-017-8372-6

By:

Christopoulos, S.-R. G.;
Sgourou, E. N.;
Vovk, R. V.;
Chroneos, A.;
Londos, C. A.

Publication type:

Article

Effect of mixed oxide/fluoride bonding on the dielectric properties of oxyfluoride glasses.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18986, doi. 10.1007/s10854-017-7852-z

By:

Danewalia, Satwinder;
Gupta, Nidhi;
Aggarwal, Sofia;
Singh, K.

Publication type:

Article

Effect of interfacial dissolution on electromigration failures at metals interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15149, doi. 10.1007/s10854-017-7391-7

By:

Lin, E.;
Hsu, Y.;
Chuang, Y.;
Liu, C.

Publication type:

Article

Lithium barrier materials for on-chip Si-based microbatteries.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 19, p. 14605, doi. 10.1007/s10854-017-7325-4

By:

Janski, R.;
Fugger, M.;
Forster, M.;
Sorger, M.;
Dunst, A.;
Hanzu, I.;
Sternad, M.;
Wilkening, M.

Publication type:

Article

Completely biodegradable banana fiber-wheat gluten composites for dielectric applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12383, doi. 10.1007/s10854-017-7058-4

By:

Bhuvaneswari, H.;
Vinayaka, D.;
Ilangovan, Manikandan;
Reddy, Narendra

Publication type:

Article