Application of Mechatronical CAD in the Product Development Process.
- Published in:
- Computer-Aided Design & Applications, 2009, v. 6, n. 2, p. 269, doi. 10.3722/cadaps.2009.269-279
- By:
- Publication type:
- Article
Works matching DE "MICROELECTRONICS"
Results: 2003
1
2
Fibre Computer Enables More Accurate Recognition of Human Activity.
- Published in:
- Nano-Micro Letters, 2025, v. 17, n. 1, p. 1, doi. 10.1007/s40820-025-01809-x
- By:
- Publication type:
- Article
3
Investigation on Structural, Morphological and Electrical Properties of Novel PVDF/ZnSb Polymer Nanocomposites for Flexible Energy Storage Applications.
- Published in:
- Polymer-Plastics Technology & Materials, 2025, v. 64, n. 10, p. 1621, doi. 10.1080/25740881.2025.2475079
- By:
- Publication type:
- Article
4
CUATRO DECADAS DE INVESTIGACIONES EN ÓPTICA EN LA CUJAE.
- Published in:
- Revista Cubana de Física, 2018, v. 35, n. 1, p. 54
- By:
- Publication type:
- Article
5
EL ICTP Y LA TWAS IMPULSAN LA MICROELECTRÓNICA EN CUBA.
- Published in:
- 2013
- By:
- Publication type:
- Course Review
6
A Plot for a Science Fiction Fable.
- Published in:
- Teachers College Record, 1981, v. 82, n. 3, p. 523, doi. 10.1177/016146818108200309
- By:
- Publication type:
- Article
7
The impact of airborne molecular bases on DUV photoresists.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 63
- By:
- Publication type:
- Article
8
Europe.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 24
- Publication type:
- Article
9
Better EDA tool integration needed for growing SoC market.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 58
- By:
- Publication type:
- Article
10
Suppliers' successes with 300mm tools and materials.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 91
- Publication type:
- Article
11
Analyzing and characterizing 193nm resist shrinkage.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 52
- By:
- Publication type:
- Article
12
A view into Selete's 300mm program.
- Published in:
- Solid State Technology, 2000, v. 43, n. 12, p. 30
- By:
- Publication type:
- Article
13
PEB process in a CA resist.
- Published in:
- Solid State Technology, 2000, v. 43, n. 8, p. 95
- By:
- Publication type:
- Article
14
Space charge effects in e-beam projection lithography.
- Published in:
- Solid State Technology, 2000, v. 43, n. 7, p. 241
- By:
- Publication type:
- Article
15
Cu contamination control for advanced interconnect manufacturing.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 137
- By:
- Publication type:
- Article
16
Wacker Siltronic introduces fLASH wafer.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 20
- By:
- Publication type:
- Article
17
Environmentally friendly single-wafer spin cleaning.
- Published in:
- Solid State Technology, 1999, v. 42, n. 11, p. 73
- By:
- Publication type:
- Article
18
CMP being applied to 5-layer MEMS technology.
- Published in:
- Solid State Technology, 1999, v. 42, n. 11, p. 22
- By:
- Publication type:
- Article
19
The `bottom line' of automated wafer-level tracking.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 141
- By:
- Publication type:
- Article
20
MEMS program at Singapore's Institute of Microelectronics.
- Published in:
- Solid State Technology, 1998, v. 41, n. 11, p. 28
- By:
- Publication type:
- Article
21
MICROELECTRONICS AND THE FUTURE OF SERVICE EMPLOYMENT.
- Published in:
- Service Industries Journal, 1981, v. 1, n. 2, p. 4, doi. 10.1080/02642068100000007
- By:
- Publication type:
- Article
22
Cross-sectional indentation technique for thick film interfacial adhesion characterisation.
- Published in:
- Surface Engineering, 2009, v. 25, n. 2, p. 97, doi. 10.1179/026708408X347641
- By:
- Publication type:
- Article
23
Current developments in ionised physical vapour deposition by magnetron sputtering — state of the art — prospects for the future in terms of applications.
- Published in:
- Surface Engineering, 2008, v. 24, n. 5, p. 319, doi. 10.1179/174329408X3268
- By:
- Publication type:
- Article
24
Status of technology of carbon nitride films: challenges and opportunties.
- Published in:
- Surface Engineering, 2006, v. 22, n. 5, p. 321, doi. 10.1179/174329406X150206
- By:
- Publication type:
- Article
25
Status of pulsed laser deposition: challenges and opportunities.
- Published in:
- Surface Engineering, 2006, v. 22, n. 2, p. 81, doi. 10.1179/174329406X98502
- By:
- Publication type:
- Article
26
Inorganic materials and coatings produced by EBPVD.
- Published in:
- Surface Engineering, 2006, v. 22, n. 1, p. 35, doi. 10.1179/174329406X85029
- By:
- Publication type:
- Article
27
Battery-aware power savings.
- Published in:
- Electronics Systems & Software, 2006, v. 4, n. 2, p. 10, doi. 10.1049/ess:20060201
- By:
- Publication type:
- Article
28
Estructuras hexaquirales con coeficiente de Poisson negativo bajo carga uniaxial en el plano.
- Published in:
- Ingeniería y Desarrollo, 2012, v. 30, n. 1, p. 45
- By:
- Publication type:
- Article
29
Hydrophobic Metal−Organic Frameworks and Derived Composites for Microelectronics Applications.
- Published in:
- Chemistry - A European Journal, 2021, v. 27, n. 67, p. 16543, doi. 10.1002/chem.202100241
- By:
- Publication type:
- Article
30
Solution Layer Deposition: A Technique for the Growth of Ultra-Pure Manganese Oxides on Silica at Room Temperature.
- Published in:
- Angewandte Chemie, 2016, v. 128, n. 9, p. 3079, doi. 10.1002/ange.201509715
- By:
- Publication type:
- Article
31
Self-Healable Electrically Conducting Wires for Wearable Microelectronics.
- Published in:
- Angewandte Chemie, 2014, v. 126, n. 36, p. 9680, doi. 10.1002/ange.201405145
- By:
- Publication type:
- Article
32
Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3
- By:
- Publication type:
- Article
33
Ultra-low temperature co-fired CaV<sub>2</sub>O<sub>6</sub>-glass composite ceramic substrate for microelectronics.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7637, doi. 10.1007/s10854-019-01079-5
- By:
- Publication type:
- Article
34
Trap density simulations on CZTSSe solar cells with AMPS-1D.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15445, doi. 10.1007/s10854-018-9075-3
- By:
- Publication type:
- Article
35
The free-standing multilayer thick films of 0.7Pb(Zr<sub>0.46</sub>Ti<sub>0.54</sub>)O<sub>3</sub>-0.1Pb(Zn<sub>1/3</sub>Nb<sub>2/3</sub>)O<sub>3</sub>-0.2Pb(Ni<sub>1/3</sub>Nb<sub>2/3</sub>)O<sub>3</sub> with low co-fired temperature.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 14, p. 11664, doi. 10.1007/s10854-018-9263-1
- By:
- Publication type:
- Article
36
Nanoscale polysilicon in sensors of physical values at cryogenic temperatures.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8364, doi. 10.1007/s10854-018-8847-0
- By:
- Publication type:
- Article
37
Synthesis of 3D porous flower-like NiO/Ni<sub>6</sub>MnO<sub>8</sub> composites for supercapacitor with enhanced performance.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7510, doi. 10.1007/s10854-018-8742-8
- By:
- Publication type:
- Article
38
Isovalent doping and the C<sub>i</sub>O<sub>i</sub> defect in germanium.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 4261, doi. 10.1007/s10854-017-8372-6
- By:
- Publication type:
- Article
39
Effect of mixed oxide/fluoride bonding on the dielectric properties of oxyfluoride glasses.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18986, doi. 10.1007/s10854-017-7852-z
- By:
- Publication type:
- Article
40
Effect of interfacial dissolution on electromigration failures at metals interface.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15149, doi. 10.1007/s10854-017-7391-7
- By:
- Publication type:
- Article
41
Lithium barrier materials for on-chip Si-based microbatteries.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 19, p. 14605, doi. 10.1007/s10854-017-7325-4
- By:
- Publication type:
- Article
42
Completely biodegradable banana fiber-wheat gluten composites for dielectric applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12383, doi. 10.1007/s10854-017-7058-4
- By:
- Publication type:
- Article
43
Embedded nonlinear passive components on flexible substrates for microelectronics applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 11550, doi. 10.1007/s10854-017-6954-y
- By:
- Publication type:
- Article
44
In situ preparation of high quality BaTiO dielectric films on Si at 350-500 °C.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 337, doi. 10.1007/s10854-016-5528-8
- By:
- Publication type:
- Article
45
Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn-0.5Cu solders for microelectronic applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 1060, doi. 10.1007/s10854-016-5629-4
- By:
- Publication type:
- Article
46
Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11548, doi. 10.1007/s10854-016-5285-8
- By:
- Publication type:
- Article
47
High thermal conductivity epoxies containing substituted biphenyl mesogenic.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2754, doi. 10.1007/s10854-015-4087-8
- By:
- Publication type:
- Article
48
Infrared study of defects in nitrogen-doped electron irradiated silicon.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 2054, doi. 10.1007/s10854-015-3991-2
- By:
- Publication type:
- Article
49
Extended semiconducting behaviour of $$\hbox {Ba}_{0.85}\hbox {Sr}_{0.15}\hbox {Ti}_{0.9}\hbox {Fe}_{0.1}\hbox {O}_3$$ thick films in large temperature range.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 2096, doi. 10.1007/s10854-015-3996-x
- By:
- Publication type:
- Article
50
Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 982, doi. 10.1007/s10854-015-3842-1
- By:
- Publication type:
- Article