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Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives.
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- Polymer Composites, 2024, v. 45, n. 7, p. 5781, doi. 10.1002/pc.28188
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- Article
A Novel Hydrophobic Polyimide Film with Sag Structure Derived from Multi‐Hybrid Strategy.
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- Macromolecular Rapid Communications, 2024, v. 45, n. 3, p. 1, doi. 10.1002/marc.202300510
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- Article
The Crystallization Behavior of a Na 2 O-GeO 2 -P 2 O 5 Glass System: A (Micro)Structural, Electrical, and Dielectric Study.
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- Materials (1996-1944), 2024, v. 17, n. 2, p. 306, doi. 10.3390/ma17020306
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- Article
Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
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- Materials (1996-1944), 2023, v. 16, n. 24, p. 7652, doi. 10.3390/ma16247652
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Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties.
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- Micromachines, 2023, v. 14, n. 11, p. 2079, doi. 10.3390/mi14112079
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Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2271, doi. 10.1007/s00170-023-12097-3
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- Article
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging.
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- Micromachines, 2023, v. 14, n. 8, p. 1538, doi. 10.3390/mi14081538
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Thermally Conductive and Electrically Insulating Epoxy Composites Filled with Network-like Alumina In Situ Coated Graphene.
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- Nanomaterials (2079-4991), 2023, v. 13, n. 15, p. 2243, doi. 10.3390/nano13152243
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Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.
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- Materials (1996-1944), 2023, v. 16, n. 13, p. 4614, doi. 10.3390/ma16134614
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- Article
The Influence of CaF 2 Doping on the Sintering Behavior and Microwave Dielectric Properties of CaO-B 2 O 3 -SiO 2 Glass-Ceramics for LTCC Applications.
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- Crystals (2073-4352), 2023, v. 13, n. 5, p. 748, doi. 10.3390/cryst13050748
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- Article
Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties.
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- Polymers (20734360), 2023, v. 15, n. 4, p. 973, doi. 10.3390/polym15040973
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- Article
Research Progress on Bonding Wire for Microelectronic Packaging.
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- Micromachines, 2023, v. 14, n. 2, p. 432, doi. 10.3390/mi14020432
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- Article
Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09649-w
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- Article
Voids formation and Cu<sub>3</sub>Sn growth mechanisms in Cu/Cu<sub>3</sub>Sn/Cu<sub>6</sub>Sn<sub>5</sub> system under air in Cu/SnAg joints for microelectronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3
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Rational Design of Fluorinated Phthalonitrile/Hollow Glass Microsphere Composite with Low Dielectric Constant and Excellent Heat Resistance for Microelectronic Packaging.
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- Nanomaterials (2079-4991), 2022, v. 12, n. 22, p. 3973, doi. 10.3390/nano12223973
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Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.
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- Micromachines, 2022, v. 13, n. 8, p. 1307, doi. 10.3390/mi13081307
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Design and Evaluation of a Cyanate Ester Containing Oxaspirocyclic Structure for Electronic Packaging.
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- Advances in Polymer Technology, 2022, p. 1, doi. 10.1155/2022/8218905
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- Article
Interfacial reactions between pure indium solder and Au/Ni metallization.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2
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Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method.
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- Mathematics (2227-7390), 2022, v. 10, n. 11, p. 1913, doi. 10.3390/math10111913
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A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics.
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- Journal of Materials Science, 2022, v. 57, n. 19, p. 8597, doi. 10.1007/s10853-022-07187-8
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Solid-state diffusion studies of lead-free solders on gold and in polymer films.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7679, doi. 10.1007/s10854-022-07917-3
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- Article
Low-Temperature Cu/SiO 2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.
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- Materials (1996-1944), 2022, v. 15, n. 5, p. 1888, doi. 10.3390/ma15051888
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Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers.
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- Polymers (20734360), 2022, v. 14, n. 5, p. N.PAG, doi. 10.3390/polym14051014
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Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2360, doi. 10.1007/s10854-021-07435-8
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- Article
温度冲击下多器件组装PCB板热应力及寿命分析.
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- Nonferrous Metals Engineering, 2022, v. 12, n. 2, p. 14, doi. 10.3969/j.issn.2095-1744.2022.02.003
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Effects of W contents on the solid-state interfacial reactions of Sn/Co-W.
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- Journal of Materials Science, 2022, v. 57, n. 2, p. 1403, doi. 10.1007/s10853-021-06614-6
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Research on Machinability of Laser Modified AlN Substrates.
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- China Mechanical Engineering, 2021, v. 32, n. 23, p. 2817, doi. 10.3969/j.issn.1004-132X.2021.23.005
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Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging.
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- Metals (2075-4701), 2021, v. 11, n. 12, p. 1941, doi. 10.3390/met11121941
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The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.
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- Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273
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Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps.
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- Materials (1996-1944), 2021, v. 14, n. 21, p. 6394, doi. 10.3390/ma14216394
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Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 4, p. 183, doi. 10.4071/imaps.1501802
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A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process.
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- Metals (2075-4701), 2021, v. 11, n. 10, p. 1664, doi. 10.3390/met11101664
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Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20640, doi. 10.1007/s10854-021-06573-3
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Etching characteristics of si wafer thinning in HF/H<sub>2</sub>O binary solution for microelectronic and nanopackaging applications.
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- Digest Journal of Nanomaterials & Biostructures (DJNB), 2021, v. 16, n. 3, p. 809, doi. 10.15251/djnb.2021.163.809
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Effect of Carbon Nanotube on Microstructure and Hardness of Sn96.5Ag3.0Cu0.5 Solder for Microelectronic Packaging.
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- International Review of Mechanical Engineering, 2021, v. 15, n. 7, p. 346, doi. 10.15866/ireme.v15i7.20148
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- Article
Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology.
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- Materials (1996-1944), 2021, v. 14, n. 12, p. 3205, doi. 10.3390/ma14123205
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A comparison of thermally conductive polyamide 6‐boron nitride composites produced via additive layer manufacturing and compression molding.
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- Polymer Composites, 2021, v. 42, n. 6, p. 2751, doi. 10.1002/pc.26010
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Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4
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- Article
Recent Trends in Noble Metal Nanoparticles for Colorimetric Chemical Sensing and Micro-Electronic Packaging Applications.
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- Metals (2075-4701), 2021, v. 11, n. 2, p. 329, doi. 10.3390/met11020329
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Investigation of packaging adhesive properties by molecular dynamics and experiments.
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- Journal of Applied Polymer Science, 2021, v. 138, n. 1, p. 1, doi. 10.1002/app.49613
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OPTIMISATION OF A MICROELECTRONIC ASSEMBLY PACKAGE USING RESPONSE SURFACE METHODOLOGY.
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- Nigerian Journal of Technology, 2020, v. 39, n. 4, p. 1058, doi. 10.4314/njt.v39i4.12
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多向复合超声换能器有限元分析与试验.
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- Piezoelectrics & Acoustooptics, 2020, v. 42, n. 5, p. 640, doi. 10.11977/j.issn.1004-2474.2020.05.013
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Effects of processing parameters on phase, morphology, mechanical and corrosion properties of W–Cu nanocomposite powder prepared by electroless copper plating.
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- Applied Physics A: Materials Science & Processing, 2020, v. 126, n. 8, p. N.PAG, doi. 10.1007/s00339-020-03793-y
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Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.
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- Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892
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Analysis of Influence Factors and Laws of Micro Dispensing Method Based on Surface Tensions.
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- China Mechanical Engineering, 2020, v. 31, n. 9, p. 1057, doi. 10.3969/j.issn.1004-132X.2020.09.007
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- Article
Nanoindentation of Graphene Reinforced Epoxy Resin as a Conductive Ink for Microelectronic Packaging Application.
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- International Journal of Nanoelectronics & Materials, 2020, v. 13, p. 407
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STRENGTH ANALYSIS OF SOLDER JOINTS USED IN MICROELECTRONICS PACKAGING.
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- Maintenance & Reliability / Eksploatacja i Niezawodność, 2020, v. 22, n. 2, p. 297, doi. 10.17531/ein.2020.2.12.
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- Article
Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.
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- Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892
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- Article
Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, v. 34, n. 8, p. N.PAG, doi. 10.1142/S0217979220500642
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Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6
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