Works matching DE "MICROELECTRONIC packaging"

Results: 165

Chipmakers to compete with assembly houses for SiP.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 51
Publication type:: Article

System-on-a-chip challenged by stacked system-in-a-package technology*.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 48

By:

Asakura, Hiroshi

Publication type:

Article

Advanced IC packaging: Markets and trends.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 44

By:

Winkler, Sandra

Publication type:

Article

Wafer-level packaging gains momentum.

Published in:

Solid State Technology, 1999, v. 42, n. 4, p. 45

By:

Elenius, Peter

Publication type:

Article

Assembly & packaging challenges.

Published in:

Solid State Technology, 1998, v. 41, n. 3, p. 90

By:

Chi Shih Chang;
Bracken, Ronald C.;
Oscilowski, Alex

Publication type:

Article

Three-Dimensional Simulation of Microchip Encapsulation Process.

Published in:

Polymer Engineering & Science, 2000, v. 40, n. 3, p. 776, doi. 10.1002/pen.11207

By:

Han, Ruihua;
Shi, Linhuo

Publication type:

Article

GOOD VIBRATIONS.

Published in:

Electronics Systems & Software, 2005, v. 3, n. 4, p. 40

By:

Collins, Luke

Publication type:

Article

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09649-w

By:

Zhang, Zhen;
Li, Jinglong;
Liu, Tao;
Tian, Wenhuai;
Li, Zhipeng

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Solid-state diffusion studies of lead-free solders on gold and in polymer films.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7679, doi. 10.1007/s10854-022-07917-3

By:

Gupte, Omkar;
Murtagian, Gregorio;
Kathaperumal, Mohanalingam;
Tummala, Rao;
Smet, Vanessa

Publication type:

Article

Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2360, doi. 10.1007/s10854-021-07435-8

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20640, doi. 10.1007/s10854-021-06573-3

By:

He, Xu;
Wang, Shaobing;
Wang, Yuexing;
Liu, Lu;
Dong, Yawei;
Yao, Yao

Publication type:

Article

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article

Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8371, doi. 10.1007/s10854-018-8848-z

By:

Shi, Qi-Yuan;
Liu, Zhi-Quan;
Wu, Di;
Zhang, Hao;
Ni, Ding-Rui;
Suganuma, Katsuaki

Publication type:

Article

Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8116, doi. 10.1007/s10854-017-6518-1

By:

Sharma, Ashutosh;
Kumar, Santosh;
Jung, Do-Hyun;
Jung, Jae

Publication type:

Article

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 6, p. 4613, doi. 10.1007/s10854-016-6099-4

By:

Cheng, Pi-Ying;
Lai, Po-Ying;
Ye, Zheng-Jie;
Hsieh, Cheng-Li;
Ye, Jiun-Ming

Publication type:

Article

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 7183, doi. 10.1007/s10854-015-3343-2

By:

Jiu, Jinting;
Zhang, Hao;
Koga, Shunsuke;
Nagao, Shijo;
Izumi, Yasuha;
Suganuma, Katsuaki

Publication type:

Article

Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1739, doi. 10.1007/s10854-012-0656-2

By:

Fallahi, H.;
Nurulakmal, M.;
Fallahi, A.;
Abdullah, Jamaluddin

Publication type:

Article

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8

By:

Sekhar, V. N.;
Chai, T. C.;
Balakumar, S.;
Lu Shen;
Sinha, S. K.;
Tay, A. A. O.;
Seung Wook Yoon

Publication type:

Article

Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2271, doi. 10.1007/s00170-023-12097-3

By:

Liu, Huifang;
Zhao, Dingrui;
Chen, Xi;
Chang, Yunlong;
Yu, Xingfu;
Li, An

Publication type:

Article

Improved tri-layered interfacial stress model with the effect of different temperatures in the layers.

Published in:

Archive of Applied Mechanics, 2011, v. 81, n. 5, p. 561, doi. 10.1007/s00419-010-0437-4

By:

Sujan, D.;
Murthy, M.;
Seetharamu, K.

Publication type:

Article

High-Strength Welding of Silica Glass Using Double-Pulse Femtosecond Laser under Non-Optical Contact Conditions.

Published in:

Photonics, 2024, v. 11, n. 10, p. 945, doi. 10.3390/photonics11100945

By:

Gao, Zheng;
He, Jiahua;
Jia, Xianshi;
Yi, Zhaoxi;
Li, Cheng;
Zhang, Shifu;
Wang, Cong;
Duan, Ji'an

Publication type:

Article

Improvement of the hydrothermal stability of MCM-48 mesoporous molecular sieves.

Published in:

Research on Chemical Intermediates, 2008, v. 34, n. 2/3, p. 267, doi. 10.1163/156856708783623500

By:

Lingzhi Wang;
Yaofeng Shao;
Jinlong Zhang;
Anpo, Masakazu

Publication type:

Article

Effect of packaging conditions and temperature on viability of microencapsulated bifidobacteria during storage.

Published in:

Journal of the Science of Food & Agriculture, 2004, v. 84, n. 2, p. 134, doi. 10.1002/jsfa.1616

By:

Hung-Chi Hsiao;
Wen-Chian Lian;
Cheng-Chun Chou

Publication type:

Article

Effect of Carbon Nanotube on Microstructure and Hardness of Sn96.5Ag3.0Cu0.5 Solder for Microelectronic Packaging.

Published in:

International Review of Mechanical Engineering, 2021, v. 15, n. 7, p. 346, doi. 10.15866/ireme.v15i7.20148

By:

Fatihah, I. A.;
Omar, G.;
Hamid, H. A.;
Salim, M. A.

Publication type:

Article

Intelligent diagnosis of flip chip solder bumps using high-frequency ultrasound and a naive Bayes classifier.

Published in:

Insight: Non-Destructive Testing & Condition Monitoring, 2018, v. 60, n. 5, p. 264, doi. 10.1784/insi.2018.60.5.264

By:

Lei Su;
Guanglan Liao;
Tielin Shi;
Yichun Zhang

Publication type:

Article

Decision Analysis in Microelectric Reliability: Optimal Design and Packaging of a Diode Array.

Published in:

Operations Research, 1981, v. 29, n. 2, p. 229, doi. 10.1287/opre.29.2.229

By:

Ronen, Boaz;
Pliskin, Joseph S.

Publication type:

Article

多向复合超声换能器有限元分析与试验.

Published in:

Piezoelectrics & Acoustooptics, 2020, v. 42, n. 5, p. 640, doi. 10.11977/j.issn.1004-2474.2020.05.013

By:

高昌彬;
薛进学;
马文举;
隆志力;
赵恒

Publication type:

Article

Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy.

Published in:

International Journal of Damage Mechanics, 2004, v. 13, n. 3, p. 225, doi. 10.1177/1056789504042594

By:

Shen, Y.-L.;
Abell, K. C. R.;
Garrett, S. E.

Publication type:

Article

Comparison of Fundamental Frequency and Sweep Resistance of Different Wire Loops Using Finite Element Model.

Published in:

International Journal of Structural Stability & Dynamics, 2015, v. 15, n. 1, p. -1, doi. 10.1142/S0219455414500321

By:

Chen, Yun;
Wang, Fuliang

Publication type:

Article

OPTIMISATION OF A MICROELECTRONIC ASSEMBLY PACKAGE USING RESPONSE SURFACE METHODOLOGY.

Published in:

Nigerian Journal of Technology, 2020, v. 39, n. 4, p. 1058, doi. 10.4314/njt.v39i4.12

By:

Ekpu, M.

Publication type:

Article

Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy.

Published in:

Journal of Adhesion Science & Technology, 2011, v. 25, n. 18, p. 2475, doi. 10.1163/016942411X580153

By:

Lee, Jong-Bum;
Lee, Jong-Gun;
Ha, Sang-Su;
Jung, Seung-Boo

Publication type:

Article

Recent Advances in Nano-conductive Adhesives.

Published in:

Journal of Adhesion Science & Technology, 2008, v. 22, n. 8/9, p. 815, doi. 10.1163/156856108X305471

By:

Lu, Daoqiang Daniel;
Li, Yi Grace;
Wong, C. P.

Publication type:

Article

Study of adhesion failure due to molding compound additives at chip surface in electronic devices.

Published in:

Journal of Adhesion Science & Technology, 2001, v. 15, n. 9, p. 1039, doi. 10.1163/156856101317035477

By:

Scandurra, Antonino;
Zafarana, Roberto;
Tenya, Yuichi;
Pignataro, Salvatore

Publication type:

Article

Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.

Published in:

Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 4, p. 183, doi. 10.4071/imaps.1501802

By:

Reddy, Vishnu V. B.;
Williamson, Jaimal;
Sitaraman, Suresh K.

Publication type:

Article

A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 39, doi. 10.4071/imaps.763387

By:

Dreissigacker, Marc;
Hoelck, Ole;
Bauer, Joerg;
Braun, Tanja;
Becker, Karl-Friedrich;
Schneider-Ramelow, Martin;
Lang, Klaus-Dieter

Publication type:

Article

Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging--A Critical Review.

Published in:

Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 2, p. 63, doi. 10.4071/imaps.654289

By:

Thanu, Dinesh P. R.;
Boxi Liu;
Cartas, Marco Aurelio

Publication type:

Article

Design and Process of 3D MEMS System-in-Package (SiP).

Published in:

Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 1, p. 10, doi. 10.4071/1551-4897-7.1.10

By:

Lau, John H.

Publication type:

Article

Ultrasoft and High Magnetic Moment CoFe Films Directly Electrodeposited from a B-Reducer Contained Solution.

Published in:

Research Letters in Physical Chemistry, 2008, p. 1, doi. 10.1155/2008/342976

By:

Baoyu Zong;
Guchang Han;
Jinjun Qiu;
Zaibing Guo;
Li Wang;
Wee-Kay Yeo;
Bo Liu

Publication type:

Article

Investigation of packaging adhesive properties by molecular dynamics and experiments.

Published in:

Journal of Applied Polymer Science, 2021, v. 138, n. 1, p. 1, doi. 10.1002/app.49613

By:

Cao, Kaicong;
Zhou, Wu;
Chen, Lili;
He, Jiangbo;
Zhan, Li;
Chen, Qing;
Yu, Huijun;
He, Xiaoping

Publication type:

Article

Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.

Published in:

Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892

By:

Hu, Junfeng;
Zhao, Xinying

Publication type:

Article

Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.

Published in:

Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892

By:

Hu, Junfeng;
Zhao, Xinying

Publication type:

Article

Design and control of a novel linear wire bonding head.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9

By:

Li Fang;
Yue Hong Yin;
Chen, Zhao Neng

Publication type:

Article

Automated defect recognition of C-SAM images in IC packaging using Support Vector Machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 11/12, p. 1191, doi. 10.1007/s00170-003-1942-1

By:

Zhang, Y. L.;
Guo, N.;
Du, H.;
Li, W. H.

Publication type:

Article

可调控热膨胀力学超材料设计制备与表征评测研究进展.

Published in:

Acta Materiae Compositae Sinica, 2024, v. 41, n. 9, p. 4589, doi. 10.13801/j.cnki.fhclxb.20240826.002

By:

赵淳铮;
王昕;
李振;
李秉洋;
金峰;
王鹏飞;
卢天健;
张瑞

Publication type:

Article

Materials Technology for Environmentally Green Micro-electronic Packaging.

Published in:

Intel Technology Journal, 2008, v. 12, n. 1, p. 1, doi. 10.1535/itj.1201.01

By:

Renavikar, Mukul P.;
Patel, Neha;
Dani, Ashay;
Wakharkar, Vijay;
Arrigotti, George;
Vasudevan, Vasu;
Bchir, Omar;
Alur, Amruthavalli P.;
Gurumurthy, Charan K.;
Stage, Roger W.

Publication type:

Article

Future Package Technologies for Wireless Communication Systems.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 353, doi. 10.1535/itj.0904.08

By:

Telesphor Kamgaing;
Kinya Ichikawa;
Xiang Yin Zeng;
Kyu-Pyung Hwang;
Yongki Min;
Jiro Kubota

Publication type:

Article