Works matching DE "MICROELECTRONIC packaging"

Results: 166

Electric field-assisted soldering of glass and copper with Zn-10Al-12Sn solder.

Published in:

2025

By:

Zhao, Ruoxuan;
Hu, Lifang;
Zheng, Zhi;
Hou, Zhiyong;
Liu, Wenbin;
Mi, Xiaoyue;
Li, Jiapeng

Publication type:

Conference Paper/Materials

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8

By:

Sekhar, V. N.;
Chai, T. C.;
Balakumar, S.;
Lu Shen;
Sinha, S. K.;
Tay, A. A. O.;
Seung Wook Yoon

Publication type:

Article

Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development.

Published in:

2019

By:

Chou, Tzu-Ting;
Song, Rui-Wen;
Duh, Jenq-Gong

Publication type:

Abstract

Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method.

Published in:

Mathematics (2227-7390), 2022, v. 10, n. 11, p. 1913, doi. 10.3390/math10111913

By:

Vallepuga-Espinosa, José;
Cifuentes-Rodríguez, Jaime;
Gutiérrez-Posada, Víctor;
Ubero-Martínez, Iván

Publication type:

Article

Evolution of Non-Conventional MOS Device Structures: A Review.

Published in:

IUP Journal of Telecommunications, 2018, v. 10, n. 2, p. 48

By:

Kaur, Navneet;
Rattan, Munish;
Gill, Sandeep Singh

Publication type:

Article

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273

By:

Mitić, Vojislav V.;
Fleshman, Collin;
Duh, Jenq-Gong;
Ilić, Ivana D.;
Lazović, Goran

Publication type:

Article

Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, v. 34, n. 8, p. N.PAG, doi. 10.1142/S0217979220500642

By:

Zhao, Meng;
Zhang, Liang;
Sun, Lei;
Xiong, Ming-yue;
Jiang, Nan;
Xu, Kai-kai

Publication type:

Article

Effect of packaging conditions and temperature on viability of microencapsulated bifidobacteria during storage.

Published in:

Journal of the Science of Food & Agriculture, 2004, v. 84, n. 2, p. 134, doi. 10.1002/jsfa.1616

By:

Hung-Chi Hsiao;
Wen-Chian Lian;
Cheng-Chun Chou

Publication type:

Article

Distributions, sources, and ecological risks of hexachlorocyclohexanes in the sediments from Haihe Plain, Northern China.

Published in:

Environmental Science & Pollution Research, 2013, v. 20, n. 4, p. 2009, doi. 10.1007/s11356-012-1226-0

By:

Xu, Fu-Liu;
Kong, Xiang-Zhen;
He, Wei;
Qin, Ning;
Zhu, Ying;
Tao, Shu

Publication type:

Article

Improved Long-range Order of Silicious MCM-41 by Gradual Heating of Synthesis Gel.

Published in:

Chemistry Letters, 2004, v. 33, n. 3, p. 266, doi. 10.1246/cl.2004.266

By:

Sinha, A. K.;
Seelan, S.;
Akita, T.;
Tsubota, S.;
Haruta, M.

Publication type:

Article

Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5486, doi. 10.1007/s11664-024-11235-1

By:

Lebda, H. I.;
Habashy, D. M.;
Mousa, M. M.

Publication type:

Article

The coupling effects of thermal cycling and high current density on Sn58Bi solder joints.

Published in:

Journal of Materials Science, 2013, v. 48, n. 6, p. 2318, doi. 10.1007/s10853-012-7011-0

By:

Zuo, Yong;
Ma, Limin;
Liu, Sihan;
Wang, Ting;
Guo, Fu;
Wang, Xitao

Publication type:

Article

Fracture behavior of Cu-cored solder joints.

Published in:

Journal of Materials Science, 2011, v. 46, n. 21, p. 6897, doi. 10.1007/s10853-011-5654-x

By:

Yunsung Kim;
Hyelim Choi;
Hyoungjoo Lee;
Dongjun Shin;
Jeongtak Moon;
Choe, Heeman

Publication type:

Article

Effect of anorthite and diopside on dielectric properties of Al2O3/glass composite based on high strength of LTCC substrate.

Published in:

Journal of Materials Science, 2008, v. 43, n. 12, p. 4009, doi. 10.1007/s10853-007-2231-4

By:

Kim, Jinho;
Hwang, Seongjin;
Sung, Wookyung;
Kim, Hyungsun

Publication type:

Article

A comparison of impression and compression creep behavior of polycrystalline Sn.

Published in:

Journal of Materials Science, 2007, v. 42, n. 13, p. 5182, doi. 10.1007/s10853-006-0542-5

By:

Park, C.;
Long, X.;
Haberman, S.;
Ma, S.;
Dutta, I.;
Mahajan, R.;
Jadhav, S. G.

Publication type:

Article

Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging.

Published in:

Journal of Materials Science, 2007, v. 42, n. 2, p. 615, doi. 10.1007/s10853-006-1148-7

By:

Murali, S.;
Srikanth, N.;
Wong, Y. M.;
Vath III, Charles J.

Publication type:

Article

Thermal and Thermo-mechanical Analysis for Design Evaluation of an Automotive Radar Module.

Published in:

Quality & Reliability Engineering International, 2004, v. 20, n. 7, p. 709, doi. 10.1002/qre.594

By:

Lindgren, Mats;
Belov, Ilja;
Leisner, Peter

Publication type:

Article

PLASTIC-STRAIN OF ALUMINIUM INTERCONNECTIONS DURING PULSED OPERATION OF IGBT MULTICHIP MODULES.

Published in:

Quality & Reliability Engineering International, 1996, v. 12, n. 4, p. 297, doi. 10.1002/(SICI)1099-1638(199607)12:4<297::AID-QRE21>3.0.CO;2-C

By:

Ciappa, Mauro;
Malberti, Paolo

Publication type:

Article

New Physics-of-Failure Software for Microelectronic Packages.

Published in:: Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 247
Publication type:: Article

DoD/NASA MCM RELTECH Programme.

Published in:: Quality & Reliability Engineering International, 1992, v. 8, n. 6, p. 568
Publication type:: Article

Technical Activities of the CALCE Center for Electronics Packaging Announced.

Published in:: Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 190
Publication type:: Article

Design and control of a novel linear wire bonding head.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9

By:

Li Fang;
Yue Hong Yin;
Chen, Zhao Neng

Publication type:

Article

Automated defect recognition of C-SAM images in IC packaging using Support Vector Machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 11/12, p. 1191, doi. 10.1007/s00170-003-1942-1

By:

Zhang, Y. L.;
Guo, N.;
Du, H.;
Li, W. H.

Publication type:

Article

Effect of carbon nanotubes and zinc oxide on electrical and mechanical properties of polyvinyl alcohol matrix composite by electrospinning method.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-79477-x

By:

Shah, Shehryar Ali;
Ali, Hamza;
Inayat, Muhammad Imran;
E. Mahmoud, Emad;
AL Garalleh, Hakim;
Ahmad, Bakhtiyar

Publication type:

Article

The Influence of CaF 2 Doping on the Sintering Behavior and Microwave Dielectric Properties of CaO-B 2 O 3 -SiO 2 Glass-Ceramics for LTCC Applications.

Published in:

Crystals (2073-4352), 2023, v. 13, n. 5, p. 748, doi. 10.3390/cryst13050748

By:

Dong, Chao;
Wang, Hua;
Yan, Tingnan;
Zhao, Jianwei;
Xu, Jiwen;
Wang, Dawei

Publication type:

Article

Study of adhesion failure due to molding compound additives at chip surface in electronic devices.

Published in:

Journal of Adhesion Science & Technology, 2001, v. 15, n. 9, p. 1039, doi. 10.1163/156856101317035477

By:

Scandurra, Antonino;
Zafarana, Roberto;
Tenya, Yuichi;
Pignataro, Salvatore

Publication type:

Article

High-Contrast Laser Marking of Microelectronic Packaging Modules.

Published in:

Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 175, doi. 10.2961/jlmn.2015.02.0013

By:

Liu, N.;
Moumanis, Kh.;
Carrier, D.;
Bilodeau, M.;
Pomerleau, V.;
Foisy, B.;
Dubowski, J. J.

Publication type:

Article

Testing Mobile Memories.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 9, p. 12

By:

Gusinow, Kurt

Publication type:

Article

Effect of Carbon Nanotube on Microstructure and Hardness of Sn96.5Ag3.0Cu0.5 Solder for Microelectronic Packaging.

Published in:

International Review of Mechanical Engineering, 2021, v. 15, n. 7, p. 346, doi. 10.15866/ireme.v15i7.20148

By:

Fatihah, I. A.;
Omar, G.;
Hamid, H. A.;
Salim, M. A.

Publication type:

Article

Materials Science and Engineering Ph.D.

Published in:

Journal of the Idaho Academy of Science, 2011, v. 47, n. 4, p. 4

By:

Pene, Matt

Publication type:

Article

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5503, doi. 10.1007/s11664-017-5591-9

By:

Haseeb, A.;
Arafat, M.;
Tay, S.;
Leong, Y.

Publication type:

Article

Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4421, doi. 10.1007/s11664-014-3375-z

By:

Elmer, John;
Li, Yan;
Barth, Holly;
Parkinson, Dilworth;
Pacheco, Mario;
Goyal, Deepak

Publication type:

Article

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 4, p. 947, doi. 10.1007/s11664-013-2967-3

By:

Siow, Kim

Publication type:

Article

Copper Wire Bonding Concerns and Best Practices.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1

By:

Chauhan, Preeti;
Zhong, Z.;
Pecht, Michael

Publication type:

Article

Critical Current Density for Inhibiting (Cu,Ni)Sn Formation on the Ni Side of Cu/Solder/Ni Joints.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2653, doi. 10.1007/s11664-010-1299-9

By:

Wu, W.;
Chung, H.;
Chen, B.;
Ho, C.

Publication type:

Article

Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0

By:

Wei Zhou;
Lijuan Liu;
Baoling Li;
Qinggong Song;
Ping Wu

Publication type:

Article

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8

By:

Made, Riko I.;
Gan, Chee Lip;
Yan, Li Ling;
Aibin Yu;
Yoon, Seung Wook;
Lau, John H.;
Chengkuo Lee

Publication type:

Article

Thermal Stability Study of Cu(MoN x ) Seed Layer on Barrierless Si.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3

By:

Chu, J.P.;
Lin, C.H.;
Leau, W.K.;
John, V.S.

Publication type:

Article

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6

By:

Shih, T. I.;
Duh, J. G.

Publication type:

Article

Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1040, doi. 10.1007/s11664-005-0093-6

By:

Pan, D.;
Dutta, I.;
Jadhav, S. G.;
Raiser, G. F.;
Ma, S.

Publication type:

Article

Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z

By:

Islam, M. N.;
Sharif, Ahmed;
Chan, Y. C.

Publication type:

Article

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09649-w

By:

Zhang, Zhen;
Li, Jinglong;
Liu, Tao;
Tian, Wenhuai;
Li, Zhipeng

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Solid-state diffusion studies of lead-free solders on gold and in polymer films.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7679, doi. 10.1007/s10854-022-07917-3

By:

Gupte, Omkar;
Murtagian, Gregorio;
Kathaperumal, Mohanalingam;
Tummala, Rao;
Smet, Vanessa

Publication type:

Article

Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2360, doi. 10.1007/s10854-021-07435-8

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20640, doi. 10.1007/s10854-021-06573-3

By:

He, Xu;
Wang, Shaobing;
Wang, Yuexing;
Liu, Lu;
Dong, Yawei;
Yao, Yao

Publication type:

Article

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article