Oxygen-Free Highly Conductive Graphene Papers.
- Published in:
- Advanced Functional Materials, 2014, v. 24, n. 31, p. 4878, doi. 10.1002/adfm.201304284
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- Publication type:
- Article
Works matching DE "MICROELECTRONIC materials"
Results: 24
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Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6194, doi. 10.1007/s10854-015-3202-1
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- Publication type:
- Article
3
Failure analysis of EOS-induced damage at final electrical testing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 596, doi. 10.1007/s10854-013-1521-7
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- Publication type:
- Article
4
Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 3, p. 94, doi. 10.4071/imaps.459344
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- Publication type:
- Article
5
Hyperbranched‐polysiloxane‐based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties.
- Published in:
- Journal of Applied Polymer Science, 2019, v. 136, n. 31, p. N.PAG, doi. 10.1002/app.47771
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- Publication type:
- Article
6
Enhanced piezoelectric properties of randomly oriented and aligned electrospun PVDF fibers by regulating the surface morphology.
- Published in:
- Journal of Applied Polymer Science, 2019, v. 136, n. 6, p. N.PAG, doi. 10.1002/app.47049
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- Publication type:
- Article
7
HIGH PERFORMANCE MULTIFUNCTIONAL POLYMERIC MATERIALS FOR MEDICINE, PHARMACY, MICROELECTRONICS, ENERGY/INFORMATION STORAGE, ENVIRONMENTAL PROTECTION.
- Published in:
- Environmental Engineering & Management Journal (EEMJ), 2013, v. 12, n. 3, p. 556
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- Publication type:
- Article
8
The coupling effects of thermal cycling and high current density on Sn58Bi solder joints.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 6, p. 2318, doi. 10.1007/s10853-012-7011-0
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- Publication type:
- Article
9
Alloy development for highly conductive thermal management materials using copper-diamond composites fabricated by field assisted sintering technology.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 3, p. 1262, doi. 10.1007/s10853-012-6868-2
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- Publication type:
- Article
10
Rolled‐Up Self‐Assembly of Compact Magnetic Inductors, Transformers, and Resonators.
- Published in:
- Advanced Electronic Materials, 2018, v. 4, n. 11, p. N.PAG, doi. 10.1002/aelm.201800298
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- Publication type:
- Article
11
SURFACE ENGINEERING.
- Published in:
- Advanced Materials & Processes, 2016, v. 174, n. 10, p. 15
- Publication type:
- Article
12
New materials lead to thermally stable circuits.
- Published in:
- Advanced Materials & Processes, 2012, v. 170, n. 7, p. 4
- Publication type:
- Article
13
Safety Analysis of Industrial Wastewater Pilot Plant for the Removal of Pollutants from Microelectronic Industry Effluents.
- Published in:
- CET Journal - Chemical Engineering Transactions, 2020, v. 82, p. 325, doi. 10.3303/CET2082055
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- Publication type:
- Article
14
Ga-Based Alloys in Microelectronic Interconnects: A Review.
- Published in:
- Materials (1996-1944), 2018, v. 11, n. 8, p. 1384, doi. 10.3390/ma11081384
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- Publication type:
- Article
15
Electrophysical Properties of the PMN–PT–PS Solid Solution.
- Published in:
- Materials (1996-1944), 2018, v. 11, n. 8, p. 1292, doi. 10.3390/ma11081292
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- Publication type:
- Article
16
High-Level Modeling and Simulation Tool for Sensor Conditioning Circuit Based on Artificial Neural Networks.
- Published in:
- Sensors (14248220), 2019, v. 19, n. 8, p. 1814, doi. 10.3390/s19081814
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- Publication type:
- Article
17
A Review of Nanoporous Metals in Interconnects.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2018, v. 70, n. 10, p. 2192, doi. 10.1007/s11837-018-3081-z
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- Publication type:
- Article
18
Economic Assessment for Recycling Critical Metals From Hard Disk Drives Using a Comprehensive Recovery Process.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2017, v. 69, n. 9, p. 1546, doi. 10.1007/s11837-017-2399-2
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- Publication type:
- Article
19
High-Temperature Characterization of Silicon Dioxide Films with Wafer Curvature.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2015, v. 67, n. 12, p. 2902, doi. 10.1007/s11837-015-1600-8
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- Publication type:
- Article
20
AATCC Review Research Bulletins.
- Published in:
- AATCC Review, 2019, v. 19, n. 2, p. 49
- Publication type:
- Article
21
Crackings in Microelectronic Packaging.
- Published in:
- Electrotehnica, Electronica, Automatica, 2015, v. 63, n. 2, p. 15
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- Publication type:
- Article
22
Local thermoelectric effects in wide-gap semiconductors.
- Published in:
- Semiconductors, 2017, v. 51, n. 7, p. 883, doi. 10.1134/S1063782617070296
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- Publication type:
- Article
23
Determination of the minority carrier lifetime in crystalline silicon thin-film material.
- Published in:
- Progress in Photovoltaics, 2014, v. 22, n. 2, p. 180, doi. 10.1002/pip.2242
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- Publication type:
- Article
24
Modification and Machining on Back Surface of a Silicon Substrate by Femtosecond Laser Pulses at 1552 nm.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2014, v. 9, n. 2, p. 98, doi. 10.2961/jlmn.2014.02.0004
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- Publication type:
- Article