Works matching DE "MICROELECTROMECHANICAL systems"
1
- Computer-Aided Design & Applications, 2017, v. 14, n. 6, p. 815, doi. 10.1080/16864360.2017.1287756
- Fan Yang;
- Qikai Xie;
- Xiaolong Zhang;
- Xiaolin Chen
- Article
2
- International Journal of Fluid Power, 2012, v. 13, n. 3, p. 15, doi. 10.1080/14399776.2012.10781057
- Honkakorpi, Janne;
- Vihonen, Jouni;
- Mattila, Juho
- Article
3
- Computer-Aided Design & Applications, 2009, v. 6, n. 3, p. 375, doi. 10.3722/cadaps.2009.375-386
- Xiaolin Chen;
- Wei Cui;
- Wei Xue
- Article
4
- Computer-Aided Design & Applications, 2004, v. 1, n. 1-4, p. 137, doi. 10.1080/16864360.2004.10738252
- Jianhua Li;
- Shuming Gao;
- Yusheng Liu
- Article
5
- International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 11, p. 5891, doi. 10.1007/s00170-025-15870-8
- Bahador, Amirabbas;
- Du, Chunling;
- Jin, Yicheng
- Article
6
- Applied Sciences (2076-3417), 2025, v. 15, n. 11, p. 6023, doi. 10.3390/app15116023
- Luo, Qunling;
- Guo, Zhiqiang;
- Lin, Danping;
- Chang, Boxue;
- Ruan, Yinlan
- Article
7
- Thermal Science, 2025, v. 29, n. 2B, p. 905, doi. 10.2298/TSCI240627206G
- GURANOV, Iva I.;
- MILIĆEV, Snežana S.;
- STEVANOVIĆ, Nevena D.
- Article
8
- Gazi Journal of Engineering Sciences (GJES) / Gazi Mühendislik Bilimleri Dergisi, 2025, v. 11, n. 1, p. 153, doi. 10.30855/gmbd.070525N10
- Dilmaca, Hasan;
- Ilci, Veli;
- Kaya, Emirhan
- Article
9
- Sensors (14248220), 2025, v. 25, n. 10, p. 3125, doi. 10.3390/s25103125
- Winkler, Julian;
- Badri-Hoeher, Sabah
- Article
10
- Sensors (14248220), 2025, v. 25, n. 10, p. 3120, doi. 10.3390/s25103120
- Sadurska, Weronika Lidia;
- Imboden, Matthias;
- Burger, Jürgen;
- Dommann, Alex Jean
- Article
11
- Sensors (14248220), 2025, v. 25, n. 10, p. 3034, doi. 10.3390/s25103034
- Previati, Giorgio;
- Stabile, Pietro;
- Ballo, Federico
- Article
12
- Defence Technology, 2025, v. 48, p. 104, doi. 10.1016/j.dt.2025.01.009
- Hao'nan Guo;
- Yunbo Shi;
- Rui Zhao;
- Yu'nan Chen;
- Peng Zhang;
- Liang Chen;
- Tao Guo
- Article
13
- 2025
- Shi, Yuxing;
- Ye, Peng;
- Wang, Chuang;
- Yang, Kuojun;
- Guo, Jinhong
- Correction Notice
14
- Biosensors (2079-6374), 2025, v. 15, n. 5, p. 325, doi. 10.3390/bios15050325
- Jiang, Xinyu;
- Sang, Brian;
- Wen, Haoran;
- Junek, Gregory;
- Park, Jin-Woo;
- Ayazi, Farrokh
- Article
15
- Klinik Psikofarmakoloji Bulteni, 2012, v. 22, n. 2, p. 115, doi. 10.5455/bcp.20120621044747
- Cetin, Mesut;
- Gumru, Salih;
- Aricioglu, Feyza
- Article
16
- Soft Materials, 2022, v. 20, n. 2, p. 161, doi. 10.1080/1539445X.2021.1933034
- Akulova, Viktoryia;
- Salamianski, Aliaksandr;
- Chishankov, Ignat;
- Agabekov, Vladimir
- Article
17
- Revista Cubana de Física, 2011, v. 28, n. 1, p. 60
- Article
18
- Solid State Technology, 2001, v. 44, n. 10, p. 24
- Article
19
- Solid State Technology, 2001, v. 44, n. 6, p. 135
- Article
20
- Solid State Technology, 2001, v. 44, n. 3, p. 54
- Article
21
- Solid State Technology, 2000, v. 43, n. 5, p. 42
- Article
22
- Solid State Technology, 2000, v. 43, n. 3, p. 22
- Article
23
- Solid State Technology, 1999, v. 42, n. 8, p. 73
- Article
24
- Solid State Technology, 1999, v. 42, n. 7, p. 62
- Article
25
- Solid State Technology, 1998, v. 41, n. 11, p. 28
- Article
26
- Solid State Technology, 1998, v. 41, n. 12, p. 16
- Article
27
- CEE: Chemical Engineering Education, 2015, v. 49, n. 2, p. 111
- LO, ROGER C.;
- BHATIA, HINA;
- VENKATRAMAN, RAHUL;
- JANG, LARRY K.
- Article
28
- CEE: Chemical Engineering Education, 2006, v. 40, n. 2, p. 126
- Article
29
- R&D Management, 2013, v. 43, n. 2, p. 162, doi. 10.1111/radm.12008
- Burger, Norbert;
- Staake, Thorsten;
- Fleisch, Elgar;
- Hierold, Christofer
- Article
30
- Journal of Electronic Materials, 2025, v. 54, n. 5, p. 3708, doi. 10.1007/s11664-025-11764-3
- Yang, Zhen;
- Meng, Ziqin;
- Huang, Jiabao;
- Cao, Jian;
- Zhang, He;
- Sun, Xuecheng;
- Lei, Chong
- Article
31
- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2910, doi. 10.1007/s11664-024-11044-6
- Patel, Raju;
- Adhikari, Manoj Singh;
- Bansal, Deepak;
- Johar, Arun
- Article
32
- Aeronautical Journal, 2009, v. 113, n. 1144, p. 371, doi. 10.1017/S0001924000003043
- Article
33
- Surface Engineering, 2023, v. 39, n. 1, p. 25, doi. 10.1080/02670844.2023.2189648
- Liu, Hao;
- Di, Yuelan;
- Wang, Haidou;
- Zhao, Yuncai
- Article
34
- Surface Engineering, 2013, v. 29, n. 10, p. 761, doi. 10.1179/1743294413Y.0000000212
- Wu, P. P.;
- Jiang, L.;
- Sun, Y.;
- Peng, Q. J.;
- Yu, Y. D.;
- Ge, H. L.
- Article
35
- Surface Engineering, 2004, v. 20, n. 3, p. 181, doi. 10.1179/026708404225010720
- Jones, A. N.;
- Ahmed, W.;
- Hassan, I. U.;
- Sein, H.;
- Rego, C. A.
- Article
36
- Electronics Systems & Software, 2005, v. 3, n. 5, p. 22
- Lavu, Srikanth;
- Desmulliez, Marc;
- Begbie, Mark;
- Ball, George;
- De Wolf, Ingrid
- Article
37
- Computing & Control Engineering, 2005, v. 16, n. 5, p. 4
- Article
38
- Angewandte Chemie, 2015, v. 127, n. 4, p. 1201, doi. 10.1002/ange.201409837
- Jie, Wenjing;
- Chen, Xi;
- Li, Dian;
- Xie, Lu;
- Hui, Yeung Yu;
- Lau, Shu Ping;
- Cui, Xiaodong;
- Hao, Jianhua
- Article
39
- Angewandte Chemie, 2013, v. 125, n. 26, p. 6863, doi. 10.1002/ange.201300755
- Kolasinski, Kurt W.;
- Barclay, William B.
- Article
40
- Natural Computing, 2013, v. 12, n. 2, p. 235, doi. 10.1007/s11047-012-9356-3
- Article
41
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 18997, doi. 10.1007/s10854-018-0025-x
- Zhang, Shaoda;
- Chen, Changsong;
- Bin, Wu;
- Zheng, Xingyu;
- San, Haisheng;
- Hofmann, Werner
- Article
42
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11367, doi. 10.1007/s10854-018-9224-8
- Potrepka, D. M.;
- Rivas, M.;
- Yu, H.;
- Aindow, M.;
- Fox, G. R.;
- Polcawich, R. G.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 1, p. 217, doi. 10.1007/s10854-017-7908-0
- Joyce, Robin;
- George, Minu;
- Bhanuprakash, Lokasani;
- Panwar, Deepak Kumar;
- Bhatia, Ravi Raj;
- Varghese, Soney;
- Akhtar, Jamil
- Article
44
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 15877, doi. 10.1007/s10854-017-7482-5
- Toprak, Alperen;
- Tigli, Onur
- Article
45
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8784, doi. 10.1007/s10854-017-6605-3
- Roshanghias, Ali;
- Bruckner, Gudrun;
- Binder, Alfred
- Article
46
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8002, doi. 10.1007/s10854-017-6504-7
- Stanimirović, Ivanka;
- Stanimirović, Zdravko
- Article
47
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4788, doi. 10.1007/s10854-016-4359-y
- Tang, JiaLin;
- Niu, Dongwei;
- Yang, Yixi;
- Zhou, Dong;
- Yang, Chengtao
- Article
48
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3493, doi. 10.1007/s10854-015-4183-9
- Yang, Zhen;
- Lei, Chong;
- Sun, Xue-cheng;
- Zhou, Yong;
- Liu, Yan
- Article
49
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9821, doi. 10.1007/s10854-015-3655-2
- Manimaran, Ezhil;
- Navaneetha, Emerson
- Article
50
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 8147, doi. 10.1007/s10854-015-3475-4
- Asikuzun, E.;
- Ozturk, O.;
- Arda, L.;
- Akcan, D.;
- Senol, S.;
- Terzioglu, C.
- Article