Works matching DE "METALS at low temperatures"
1
- ChemSusChem, 2025, v. 18, n. 13, p. 1, doi. 10.1002/cssc.202402342
- Morales, Carlos;
- Tschammer, Rudi;
- Pożarowska, Emilia;
- Kosto, Julia;
- Villar‐Garcia, Ignacio J.;
- Pérez‐Dieste, Virginia;
- Favaro, Marco;
- Starr, David E.;
- Kapuścik, Paulina;
- Mazur, Michał;
- Wojcieszak, Damian;
- Domaradzki, Jarosław;
- Alvarado, Carlos;
- Wenger, Christian;
- Henkel, Karsten;
- Flege, Jan Ingo
- Article
2
- International Journal of Nanoscience, 2010, v. 9, n. 6, p. 591, doi. 10.1142/S0219581X10007319
- Article
3
- Journal of Materials Science Letters, 2003, v. 22, n. 24, p. 1751, doi. 10.1023/B:JMSL.0000005412.91868.71
- Won-Bae Lee;
- Eui-Han Yoon;
- Seung-Boo Jung
- Article
4
- Electronics (2079-9292), 2023, v. 12, n. 2, p. 365, doi. 10.3390/electronics12020365
- Mu, Kuiyuan;
- Nikawa, Makoto;
- Yamashita, Minoru
- Article
5
- Fatigue & Fracture of Engineering Materials & Structures, 2013, v. 36, n. 12, p. 1258, doi. 10.1111/ffe.12062
- Wang, Y. Q.;
- Liu, X. Y.;
- Hu, Z. W.;
- Shi, Y. J.
- Article
6
- European Physical Journal B: Condensed Matter, 2017, v. 90, n. 8, p. 1, doi. 10.1140/epjb/e2017-80367-1
- Swift, Michael;
- Van de Walle, Chris
- Article
7
- Asia-Pacific Journal of Chemical Engineering, 2020, v. 15, n. 1, p. N.PAG, doi. 10.1002/apj.2389
- Wang, Limin;
- Bu, Yufan;
- Tang, Chunli;
- Lv, Cheng;
- Chen, Xun;
- Che, Defu
- Article
8
- Journal of Metallurgy, 2012, p. 1, doi. 10.1155/2012/258021
- Pirizadhejrandoost, Somayeh;
- Bakhshzad Mahmoudi, Mehdi;
- Ahmadi, Elnaz;
- Moradshahi, Masoud
- Article
9
- Modern Physics Letters B, 2015, v. 29, n. 6/7, p. -1, doi. 10.1142/S0217984915400370
- Nishida, Masayuki;
- Jing, Tian;
- Muslih, M. Refai;
- Doi, Taisei;
- Matsue, Tatsuya;
- Hanabusa, Takao
- Article
10
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, v. 34, n. 6, p. N.PAG, doi. 10.1142/S021797922050037X
- Kim, Kwangson;
- Kang, Yongrim;
- Mun, Myonghua;
- Jong, Kumhyok;
- Chae, Chunghyok
- Article
11
- Plasma Chemistry & Plasma Processing, 2017, v. 37, n. 4, p. 979, doi. 10.1007/s11090-017-9818-6
- Sabat, K.;
- Paramguru, R.;
- Mishra, B.
- Article
12
- Plasma Chemistry & Plasma Processing, 2011, v. 31, n. 4, p. 595, doi. 10.1007/s11090-011-9301-8
- Kahraman, Fatih;
- Karadeniz, Süleyman
- Article
13
- Welding International, 2013, v. 27, n. 3, p. 190, doi. 10.1080/09507116.2011.600029
- Mirski, Zbigniew;
- Granat, Kazimierz;
- Drzeniek, Hubert;
- Piwowarczyk, Tomasz;
- Wojdat, Tomasz
- Article
14
- Physics of Atomic Nuclei, 2023, v. 86, n. 8, p. 1907, doi. 10.1134/S1063778823080082
- Krayushkin, A. V.;
- Tupotilov, I. A.
- Article
15
- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 228, doi. 10.1007/s11664-023-10763-6
- Ma, Limin;
- Wang, Yuchen;
- Jia, Qiang;
- Zhang, Hongqiang;
- Wang, Yishu;
- Li, Dan;
- Zou, Guisheng;
- Guo, Fu
- Article
16
- Science & Technology of Welding & Joining, 2016, v. 21, n. 2, p. 114, doi. 10.1179/1362171815Y.0000000072
- Wolcott, P. J.;
- Sridharan, N.;
- Babu, S. S.;
- Miriyev, A.;
- Frage, N.;
- Dapino, M. J.
- Article
17
- Angewandte Chemie, 2021, v. 133, n. 11, p. 6043, doi. 10.1002/ange.202014241
- Hu, Xiaofei;
- Matios, Edward;
- Zhang, Yiwen;
- Wang, Chuanlong;
- Luo, Jianmin;
- Li, Weiyang
- Article
18
- Angewandte Chemie, 2018, v. 130, n. 52, p. 17340, doi. 10.1002/ange.201810251
- Rivero‐Crespo, Miguel A.;
- Mon, Marta;
- Ferrando‐Soria, Jesús;
- Lopes, Christian W.;
- Boronat, Mercedes;
- Leyva‐Pérez, Antonio;
- Corma, Avelino;
- Hernández‐Garrido, Juan C.;
- López‐Haro, Miguel;
- Calvino, Jose J.;
- Ramos‐Fernandez, Enrique V.;
- Armentano, Donatella;
- Pardo, Emilio
- Article
19
- 2017
- Kassner, M.;
- Smith, K.;
- Campbell, C.
- Erratum
20
- Journal of Materials Science, 2017, v. 52, n. 10, p. 5894, doi. 10.1007/s10853-017-0825-z
- Zhou, Yi;
- Deng, Jie;
- Lan, Li;
- Wang, Jianli;
- Yuan, Shandong;
- Gong, Maochu;
- Chen, Yaoqiang
- Article
21
- Journal of Materials Science, 2015, v. 50, n. 17, p. 5904, doi. 10.1007/s10853-015-9141-7
- Wang, L.;
- Zhu, C.;
- Bao, D.;
- Tian, Z.;
- Yuan, S.
- Article
22
- Journal of Materials Science, 2008, v. 43, n. 1, p. 207, doi. 10.1007/s10853-007-2139-z
- Article
23
- Journal of Materials Science, 2007, v. 42, n. 8, p. 2766, doi. 10.1007/s10853-006-1420-x
- Deng, Shiqiang;
- Ye, Lin;
- Friedrich, Klaus
- Article
24
- Materials Science, 2014, v. 50, n. 3, p. 350, doi. 10.1007/s11003-014-9726-3
- Ostash, O.;
- Andreiko, I.;
- Holovatyuk, Yu.;
- Semenets', O.;
- Koval'chuk, L.
- Article
25
- Materials Science, 2012, v. 48, n. 3, p. 259, doi. 10.1007/s11003-012-9501-2
- Andreiko, I.;
- Holovatyuk, Yu.;
- Koval'chuk, L.;
- Semenets', O.;
- Ostash, O.
- Article
26
- Materials Science, 2008, v. 44, n. 4, p. 524, doi. 10.1007/s11003-009-9112-8
- Ostash, O. P.;
- Andreiko, I. M.;
- Kulyk, V. V.;
- Uzlov, I. H.;
- Uzlov, K. I.;
- Babachenko, O. I.
- Article
27
- Communications Physics, 2024, v. 7, n. 1, p. 1, doi. 10.1038/s42005-024-01874-5
- Xu, Yuanji;
- Wang, Yue-Chao;
- Jin, Xintao;
- Liu, Haifeng;
- Liu, Yu;
- Song, Haifeng;
- Tian, Fuyang
- Article
28
- Technical Physics Letters, 2018, v. 44, n. 12, p. 1052, doi. 10.1134/S1063785018120258
- Article
29
- Catalysts (2073-4344), 2024, v. 14, n. 8, p. 534, doi. 10.3390/catal14080534
- Liu, Zi-Zhang;
- Fan, Ruo-Yao;
- Yu, Ning;
- Zhou, Ya-Nan;
- Zhang, Xin-Yu;
- Dong, Bin;
- Yan, Zi-Feng
- Article
30
- Coatings (2079-6412), 2024, v. 14, n. 4, p. 492, doi. 10.3390/coatings14040492
- Yu, Jianjian;
- Zhang, Ping;
- Ying, Puyou;
- Lin, Changhong;
- Yang, Tao;
- Wu, Jianbo;
- Li, Chen;
- Huang, Min;
- Levchenko, Vladimir
- Article
31
- Nano Research, 2024, v. 17, n. 10, p. 8819, doi. 10.1007/s12274-024-6742-y
- Chen, Zhitao;
- Liu, Huitian;
- Nei, Jean;
- Liu, Nian
- Article
32
- International Review of Mechanical Engineering, 2020, v. 14, n. 3, p. 169, doi. 10.15866/ireme.v14i3.17084
- Cione, Francisco Carlos;
- Betini, Evandro Giuseppe;
- Boato, Marcos Galante;
- de Souza, Armando Cirilo;
- Rossi, Jesualdo Luiz
- Article
33
- Journal of Molecular Modeling, 2019, v. 25, n. 1, p. 1, doi. 10.1007/s00894-018-3869-3
- Samanta, Bipasa;
- Sengupta, Turbasu;
- Pal, Sourav
- Article
34
- Advances in Applied Ceramics: Structural, Functional & Bioceramics, 2020, v. 119, n. 2, p. 75, doi. 10.1080/17436753.2019.1692173
- Biesuz, Mattia;
- Taveri, Gianmarco;
- Duff, Andrew I.;
- Olevsky, Eugene;
- Zhu, Degui;
- Hu, Chunfeng;
- Grasso, Salvatore
- Article
35
- Advances in Applied Ceramics: Structural, Functional & Bioceramics, 2018, v. 117, n. 3, p. 147, doi. 10.1080/17436753.2017.1386425
- Wang, Junkai;
- Zhang, Yuanzhuo;
- Zhang, Haijun;
- Han, Lei;
- Bi, Yubao;
- Wang, Huifang;
- Song, Shupeng;
- Zhang, Shaowei
- Article
36
- Advances in Applied Ceramics: Structural, Functional & Bioceramics, 2016, v. 115, n. 4, p. 190, doi. 10.1080/17436753.2015.1104054
- Article
37
- Journal of Electronic Materials, 2020, v. 49, n. 8, p. 4830, doi. 10.1007/s11664-020-08208-5
- Wen, Z. F.;
- Sun, Y.;
- Zhang, A. B.;
- Wang, B. L.;
- Wang, J.;
- Du, J. K.
- Article
38
- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2954, doi. 10.1007/s11664-020-07994-2
- Yang, Zong-Ren;
- Liu, Chia-Jyi
- Article
39
- Journal of Electronic Materials, 2018, v. 47, n. 7, p. 4140, doi. 10.1007/s11664-018-6313-7
- Asha, B.;
- Harsha, Cirandur Sri;
- Padma, R.;
- Rajagopal Reddy, V.
- Article
40
- Journal of Electronic Materials, 2016, v. 45, n. 10, p. 5006, doi. 10.1007/s11664-016-4672-5
- Zhang, Yong;
- Sun, Huajun;
- Chen, Wen
- Article
41
- Journal of Electronic Materials, 2014, v. 43, n. 10, p. 3844, doi. 10.1007/s11664-014-3235-x
- Vlachos, N.;
- Hatzikraniotis, E.;
- Mihailescu, C.N.;
- Giapintzakis, J.;
- Kyratsi, Th.
- Article
42
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 780, doi. 10.1007/s11664-013-2957-5
- Lee, Hsin-Ying;
- Ye, Wan-Yi;
- Lin, Yung-Hao;
- Lou, Li-Ren;
- Lee, Ching-Ting
- Article
43
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2398, doi. 10.1007/s11664-011-1750-6
- Morisada, Y.;
- Nagaoka, T.;
- Fukusumi, M.;
- Kashiwagi, Y.;
- Yamamoto, M.;
- Nakamoto, M.;
- Kakiuchi, H.;
- Yoshida, Y.
- Article
44
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1394, doi. 10.1007/s11664-011-1594-0
- Alarifi, Hani;
- Hu, Anming;
- Yavuz, Mustafa;
- Zhou, Y.
- Article
45
- Journal of Electronic Materials, 2011, v. 40, n. 5, p. 547, doi. 10.1007/s11664-010-1444-5
- Zhou, Chen;
- Sakamoto, Jeffery;
- Morelli, Donald
- Article
46
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 218, doi. 10.1007/s11664-007-0165-x
- Article
47
- Philosophical Magazine, 2006, v. 86, n. 6-8, p. 753, doi. 10.1080/14786430500333349
- Article
48
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 6, p. 1, doi. 10.1007/s10854-024-12176-5
- Feng, Tianshi;
- Pati, Bhabana;
- Chung, Ka Man;
- Pei, Yu;
- Chen, Renkun
- Article
49
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22330, doi. 10.1007/s10854-021-06719-3
- Snini, K.;
- Abidi, R.;
- Ekicibil, A.;
- Ellouze, M.;
- El Mir, L.
- Article
50
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 8, p. 9872, doi. 10.1007/s10854-021-05646-7
- Verma, Mukesh Kumar;
- Singh, Devinder
- Article