Works matching DE "METALLIZING"

Results: 76

Laser acoustic method for the inspection of flaws in metals and the metallized coatings of dielectrics.

Published in:

Russian Journal of Nondestructive Testing, 2011, v. 47, n. 2, p. 118, doi. 10.1134/S1061830911020069

By:

Golenishchev-Kutuzov, V.;
Kalimullin, R.;
Migachev, S.;
Petrushenko, Yu.;
Khasanov, A.

Publication type:

Article

Specific features of implosion of metallized fiber arrays.

Published in:

Plasma Physics Reports, 2017, v. 43, n. 2, p. 141, doi. 10.1134/S1063780X17020106

By:

Mitrofanov, K.;
Aleksandrov, V.;
Gritsuk, A.;
Grabovski, E.;
Frolov, I.;
Laukhin, Ya.;
Breshkov, S.

Publication type:

Article

Two- and three-dimensional extended solids and metallization of compressed XeF2.

Published in:

Nature Chemistry, 2010, v. 2, n. 9, p. 784, doi. 10.1038/nchem.724

By:

Minseob Kim;
Debessai, Mathew;
Choong-Shik Yoo

Publication type:

Article

A three-electrode electric arc metallising gun – innovation project.

Published in:

Welding International, 2016, v. 30, n. 7, p. 560, doi. 10.1080/09507116.2015.1099893

By:

Litovchenko, N. N.

Publication type:

Article

Effect of the discharge velocity of the heterophase flow on the physical–mechanical properties of the electric metallizing flow.

Published in:

Welding International, 2014, v. 28, n. 6, p. 491, doi. 10.1080/09507116.2013.840040

By:

Litovchenko, N.N.;
Petryakov, B.I.;
Tolkachev, A.A.;
Blokhin, S.A.

Publication type:

Article

Metal–carbothermal methods of reducing the degree of oxidation of dispersed metal in electric arc metallizing.

Published in:

Welding International, 2013, v. 27, n. 5, p. 423, doi. 10.1080/09507116.2012.715930

By:

Solov'ev, R.Yu.;
Vorob'ev, P.A.;
Litovchenko, N.N.

Publication type:

Article

Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections.

Published in:

Welding International, 2012, v. 26, n. 1, p. 51, doi. 10.1080/09507116.2011.592714

By:

Temnykh, V.I.;
Kazakov, V.S.;
Mityaev, A.E.;
Temnykh, E.V.

Publication type:

Article

A model of heating a flux-cored wire in arc metallizing and analysis of the structure of the coating.

Published in:

Welding International, 2010, v. 24, n. 7, p. 546, doi. 10.1080/09507110903569115

By:

Korobov, Yu.S.;
Belozertsev, A.A.;
Filippov, M.A.;
Shumyakov, V.I.

Publication type:

Article

Reliability Assessment of Metallized Film Capacitors using Reduced Degradation Test Sample.

Published in:

Quality & Reliability Engineering International, 2013, v. 29, n. 2, p. 259, doi. 10.1002/qre.1307

By:

Sun, Quan;
Tang, Yanzhen;
Feng, Jing;
Jin, Tongdan

Publication type:

Article

FAILURE ANALYSIS OF MULTILEVEL METALLIZED LSI USING OPTICAL BEAM INDUCED CURRENT.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 239, doi. 10.1002/qre.4680080311

By:

Mitsuhashi, J.;
Komori, S.;
Tsubouchi, N.

Publication type:

Article

A FAILURE ANALYSIS METHODOLOGY FOR REVEALING ESD DAMAGE TO INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 165, doi. 10.1002/qre.4680010306

By:

Taylor, R. G.;
Woodhouse, J.;
Feasey, P. R.

Publication type:

Article

Modeling of Transient Currents in Polyethylene Terephtalate.

Published in:

International Journal of Polymer Analysis & Characterization, 2007, v. 12, n. 5, p. 359, doi. 10.1080/10236660701485019

By:

Saidi-Amroun, N.;
Berdous, S.;
Saidi, M.;
Bendaoud, M.

Publication type:

Article

Theoretikal Justification Of Geometrical Dimensions, Grade Angle, And Guantity Of Screw Lines During Cylinder Liner Metallization.

Published in:

Astra Salvensis, 2017, p. 505

By:

ZAMAIDINOV, Airat Almazovich;
SUBAEVA, Asiyа Kamilevna;
SUBAEV, Marat Irfanovich;
SALAKHUTDINOV, Ilmaz Rifkatovich

Publication type:

Article

Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.

Published in:

Journal of Adhesion Science & Technology, 2003, v. 17, n. 15, p. 2085, doi. 10.1163/156856103322584227

By:

Hsieh, J. H.;
Tzong-Ming Wu;
Tong, J. Z.;
Yang, S.

Publication type:

Article

Al/PET adhesion: role of an excimer laser pretreatment of PET prior to aluminum thermal evaporation.

Published in:

Journal of Adhesion Science & Technology, 2003, v. 17, n. 3, p. 353, doi. 10.1163/156856103762864660

By:

Petit, S.;
Laurens, P.;
Barthes-Labrousse, M. G.;
Amouroux, J.;
Aréfi-Khonsari, F.

Publication type:

Article

High-efficiency rear-passivated screen- printed silicon solar cells.

Published in:

Photovoltaics International, 2011, n. 13, p. 77

By:

Duliweber, Thorsten;
Gatz, Sebastian;
Falcon, Tom;
Hannebauer, Helge

Publication type:

Article

Cell Processing: Tool Order News Focus.

Published in:: Photovoltaics International, 2009, n. 4, p. 56
Publication type:: Article

Quantitative electron spectroscopic imaging studies of microelectronic metallization layers.

Published in:

Journal of Microscopy, 1999, v. 194, n. 1, p. 71, doi. 10.1046/j.1365-2818.1999.00476.x

By:

MARIEN;
PLITZKO;
SPOLENAK;
KELLER;
MAYER;
Plitzko

Publication type:

Article

Metallization and APPJ treatment of bismaleimide.

Published in:

High Performance Polymers, 2017, v. 29, n. 7, p. 816, doi. 10.1177/0954008316659123

By:

Bhattacharyya, A. S.;
Kumar, S.;
Sharma, A.;
Kumar, D.;
Patel, S. B.;
Paul, D.;
Dutta, P. P.;
Bhattacharjee, G.

Publication type:

Article

Significance of Nano Grain Sized Pt (100 Å) Along with Ti-W/Al-Cu Multi Level Metallisation to VLSI Substrate.

Published in:

Journal of Active & Passive Electronic Devices, 2010, v. 5, n. 3/4, p. 221

By:

Uma, V.;
Chandramani, R.

Publication type:

Article

Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 8, p. 4891, doi. 10.1007/s11664-017-5477-x

By:

Wang, C.;
Dai, T.;
Lu, Y.;
Shi, Z.;
Ruan, J.;
Guo, Y.;
Liu, X.

Publication type:

Article

Cyclic Thermal Stress-Induced Degradation of Cu Metallization on SiN Substrate at −40°C to 300°C.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 1, p. 482, doi. 10.1007/s11664-014-3357-1

By:

Lang, Fengqun;
Yamaguchi, Hiroshi;
Nakagawa, Hiroshi;
Sato, Hiroshi

Publication type:

Article

Improved Thermal Stability Observed in Ni-Based Ohmic Contacts to n-Type SiC for High-Temperature Applications.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 4, p. 400, doi. 10.1007/s11664-010-1449-0

By:

Virshup, Ariel;
Liu, Fang;
Lukco, Dorothy;
Buchholt, Kristina;
Spetz, Anita;
Porter, Lisa

Publication type:

Article

Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 2, p. 213, doi. 10.1007/s11664-010-1447-2

By:

Kumar, Aditya;
Chen, Zhong

Publication type:

Article

Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 2, p. 239, doi. 10.1007/s11664-010-1439-2

By:

Geissler, Ute;
Funck, Jürgen;
Schneider-Ramelow, Martin;
Engelmann, Hans-Jürgen;
Rooch, Ingrid;
Müller, Wolfgang;
Reichl, Herbert

Publication type:

Article

Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2528, doi. 10.1007/s11664-010-1376-0

By:

Tsai, M.;
Lin, Y.;
Ke, J.;
Kao, C.

Publication type:

Article

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1624, doi. 10.1007/s11664-008-0515-3

By:

YI-SHAO LAI;
YING-TA CHIU;
JIUNN CHEN

Publication type:

Article

Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1648, doi. 10.1007/s11664-008-0503-7

By:

JUN-HO LEE;
JUN SUK OH;
PYONG CHAN LEE;
DONG OUK KIM;
YOUNGKWAN LEE;
JAE-DO NAM

Publication type:

Article

Nanometer-thin pure boron CVD layers as material barrier to Au or Cu metallization of Si.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7123, doi. 10.1007/s10854-021-05422-7

By:

Shivakumar, D. Thammaiah;
Knežević, Tihomir;
Nanver, Lis K.

Publication type:

Article

High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 3, p. 1785, doi. 10.1007/s10854-017-8087-8

By:

Chen, Chuantong;
Suganuma, Katsuaki;
Iwashige, Tomohito;
Sugiura, Kazuhiko;
Tsuruta, Kazuhiro

Publication type:

Article

An ultra-light and high electromagnetic shielding effectiveness material based on melamine foam with its skeleton metallized.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 1159, doi. 10.1007/s10854-014-2520-z

By:

Xu, Yu;
Li, Ying;
Xu, Wenjiao;
Bao, Jianjun

Publication type:

Article

Gold/silicon nanocomposites: synthesis, characterization, and application in detection of dopamine.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 690, doi. 10.1007/s10854-010-0197-5

By:

Hui-Juan Yu;
Xin-Tian Li;
Hong Fang;
Qi-Yu Chen;
Fan Jiang;
Guang Shao

Publication type:

Article

Investigation of asymmetrical coupled microstrip lines with finite metallization thickness.

Published in:

Microwave & Optical Technology Letters, 2001, v. 28, n. 1, p. 45, doi. 10.1002/1098-2760(20010105)28:1<45::AID-MOP13>3.0.CO;2-8

By:

Yun, Nam-Il;
Hong, Ic-Pyo;
Park, Han-Kyu

Publication type:

Article

Relation between surface preconditioning and metal deposition in direct galvanic metallization of insulating surfaces.

Published in:

Journal of Solid State Electrochemistry, 2004, v. 8, n. 3, p. 201, doi. 10.1007/s10008-003-0426-4

By:

T. T. Mai;
J. W. Schultze;
G. Staikov

Publication type:

Article

Study of steel production with the use of hot-briquetted iron in the cold charge.

Published in:

Metallurgist, 2007, v. 51, n. 3-4, p. 148, doi. 10.1007/s11015-007-0027-z

By:

Timofeeva, A.;
Timofeev, E.

Publication type:

Article

Application of high-speed gas-flame technology for hardening the surfaces of machines and robots of automatic gas-flame spraying.

Published in:

Physical Sciences & Technology, 2021, v. 8, n. 1/2, p. 47, doi. 10.26577/phst.2021.v8.i1.06

By:

Bazarbekov, Sh. A.

Publication type:

Article

Analysis of Finline Structures with Consideration of Metallization Thickness and Substrate Mounting Grooves.

Published in:

Turkish Journal of Electrical Engineering & Computer Sciences, 2007, v. 15, n. 1, p. 17

By:

Ouadi, Abderrahmane;
Bourdoucen, Hadj

Publication type:

Article

The nitridoborate nitrides Mg3[BN2]N and Ca3[BN2]N - electronic structure and chemical bonding.

Published in:

Zeitschrift für Naturforschung B: A Journal of Chemical Sciences, 2017, v. 72, n. 6, p. 433, doi. 10.1515/znb-2017-0035

By:

Matar, Samir F.;
Al Alam, Adel F.;
Pöttgen, Rainer

Publication type:

Article

Possible Relation between Optical Breakdown and Metallization of Extremely Pure Transparent Dielectrics.

Published in:

Doklady Physics, 2003, v. 48, n. 1, p. 5, doi. 10.1134/1.1545365

By:

Karpenko, S. V.;
Savintsev, A. P.;
Temrokov, A. I.

Publication type:

Article

1D electro-elastic fields in piezoelectrics excited by intrinsic strains.

Published in:

Crystallography Reports, 2009, v. 54, n. 6, p. 950, doi. 10.1134/S106377450906008X

By:

Alshits, V. I.;
Nowacki, J. P.;
Radowicz, A.

Publication type:

Article

REASERCHES REGARDING THE ADHESION STRENGTH EVOLUTION OF THE LAYERS DEPOSITED BY METALLIZATION.

Published in:

Annals of DAAAM & Proceedings, 2010, p. 1045

By:

Roata, I. C.;
Iovanas, R.;
Iovanas, D. M.;
Trif, N. I.;
Iovanas, R. F.;
Petre, D.

Publication type:

Article

Finite Element Method Applied in Modelling Perturbations on Printed Circuit Boards.

Published in:

International Review of Electrical Engineering, 2008, v. 3, n. 2, p. 273

By:

Lascu, M.;
Lascu, D.

Publication type:

Article

From Japan: Simplified interconnect processing for cost-sensitive chips.

Published in:

Solid State Technology, 1999, v. 42, n. 7, p. 99

By:

Asahina, Michio

Publication type:

Article

Development of electrospun metallic hybrid nanofibers via metallization.

Published in:

Polymers for Advanced Technologies, 2010, v. 21, n. 10, p. 746, doi. 10.1002/pat.1490

By:

Wei, Kai;
Ohta, Tomohiro;
Kim, Byoung‐Suhk;
Kim, Kwan‐Woo;
Lee, Keun‐Hyung;
Khil, Myung Seob;
Kim, Hak‐Yong;
Kim, Ick‐Soo

Publication type:

Article

The structure of acoustic modes in piezoelectric plates with free and metallized surfaces.

Published in:

Journal of Communications Technology & Electronics, 2012, v. 57, n. 7, p. 738, doi. 10.1134/S1064226912070017

By:

Anisimkin, V.;
Voronova, N.;
Zemlyanitsyn, M.;
Pyataikin, I.;
Shikhabudinov, A.

Publication type:

Article

DYNAMIC ANALYSIS OF MULTILAYERED MICROWAVE CIRCUITS INCLUDING METALLIZATION EFFECTS.

Published in:

International Journal of Modelling & Simulation, 2008, v. 28, n. 4, p. 462, doi. 10.1080/02286203.2008.11442499

By:

Tounsi, M.L.;
Touhami, R.;
Yagoub, M. C. E.

Publication type:

Article

Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength.

Published in:

Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 12, p. 1, doi. 10.1007/s00339-017-1374-7

By:

Domke, Matthias;
Egle, Bernadette;
Stroj, Sandra;
Bodea, Marius;
Schwarz, Elisabeth;
Fasching, Gernot

Publication type:

Article

Inherent diode isolation in programmable metallization cell resistive memory elements.

Published in:

Applied Physics A: Materials Science & Processing, 2011, v. 102, n. 4, p. 817, doi. 10.1007/s00339-011-6292-5

By:

Puthentheradam, Sarath;
Schroder, Dieter;
Kozicki, Michael

Publication type:

Article

OBJECTIVE SETTING FUNCTION TO FORM THE RECONDITIONING METALLIZATION CRANKSHAFT.

Published in:

Fiability & Durability / Fiabilitate si Durabilitate, 2015, n. 1, p. 23

By:

AMZA, GHEORGHE

Publication type:

Article

Formation technology of through metallized holes to sources of high-power GaN/SiC high electron mobility transistors.

Published in:

Semiconductors, 2012, v. 46, n. 9, p. 1216, doi. 10.1134/S1063782612090175

By:

Osipov, K.;
Velikovskiy, L.

Publication type:

Article