Works matching DE "METAL oxide semiconductor field"
1
- Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.821
- Yaguchi, Toshie;
- Wakui, Akiko;
- Ito, Katsuji;
- Asakura, Hiroyuki;
- Nagakubo, Yasuhira;
- Li, Meng;
- Shan, Zhiwei
- Article
2
- 2019
- Wang, Jinguo;
- Lian, Guoda;
- Kim, Moon J.
- Abstract
3
- Sensors & Materials, 2018, v. 30, n. 1, p. 129, doi. 10.18494/SAM.2018.1643
- Byoung-Soo Choi;
- Sang-Hwan Kim;
- Jimin Lee;
- Chang-Woo Oh;
- Sang-Ho Seo;
- Jang-Kyoo Shin
- Article
4
- Sensors & Materials, 2017, v. 29, n. 6, p. 611, doi. 10.18494/SAM.2017.1458
- Huimin Lu;
- Yujie Li;
- Seiichi Serikawa;
- Hyoungseop Kim;
- Yun Li
- Article
5
- Sensors & Materials, 2016, v. 28, n. 12, p. 1273, doi. 10.18494/sam.2016.1368
- Lan Zhang;
- Jian Lu;
- Hirofumi Nogami;
- Hironao Okada;
- Toshihiro Itoh
- Article
6
- Electronics (2079-9292), 2023, v. 12, n. 11, p. 2486, doi. 10.3390/electronics12112486
- Huang, Yufei;
- Li, Shuhui;
- Yang, Yaguang;
- Chen, Chengying
- Article
7
- Electronics (2079-9292), 2021, v. 10, n. 6, p. 735, doi. 10.3390/electronics10060735
- Pezzimenti, Fortunato;
- Bencherif, Hichem;
- De Martino, Giuseppe;
- Dehimi, Lakhdar;
- Carotenuto, Riccardo;
- Merenda, Massimo;
- Della Corte, Francesco G.;
- Rodriguez, Noel
- Article
8
- Social Sciences (2076-0760), 2022, v. 11, n. 12, p. 573, doi. 10.3390/socsci11120573
- Luft, Niklas;
- Wallmeyer, Paula;
- Barglowski, Karolina;
- Bonfert, Lisa
- Article
9
- Remote Sensing, 2021, v. 13, n. 24, p. 5088, doi. 10.3390/rs13245088
- Heuermann, Holger;
- Harzheim, Thomas;
- Cronenbroeck, Tobias
- Article
10
- International Journal of Automation Technology, 2019, v. 13, n. 6, p. 796, doi. 10.20965/ijat.2019.p0796
- Yamane, Satoshi;
- Matsuo, Kouki
- Article
11
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2025, v. 39, n. 19, p. 1, doi. 10.1142/S021797922550167X
- Prasad, Madhulika;
- Sahu, Satish Kumar;
- Parmar, Onika
- Article
12
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2017, v. 31, n. 16-19, p. -1, doi. 10.1142/S0217979217440957
- Ariyanti, Dessy;
- Maillot, Mathilde;
- Gao, Wei
- Article
13
- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2510, doi. 10.1007/s11664-022-09514-w
- Qasrawi, A. F.;
- Daragme, Rana B.
- Article
14
- Italian Journal of Food Science / Rivista Italiana di Scienza degli Alimenti, 2016, v. 28, n. 2, p. 326
- ROMANO, A.;
- CUENCA, M.;
- MAKHOUL, S.;
- BIASIOLI, F.;
- MARTINELLO, L.;
- FUGATTI, A.;
- SCAMPICCHIO, M.
- Article
15
- Majlesi Journal of Telecommunication Devices, 2014, v. 3, n. 4, p. 145
- Article
16
- Journal of Spectroscopy, 2016, p. 1, doi. 10.1155/2016/1617063
- Article
17
- International Journal of Distributed Sensor Networks, 2017, v. 13, n. 3, p. 1, doi. 10.1177/1550147717698883
- Kim, Byung-Seo;
- Won Kim, Sung;
- Zhang, Chi;
- Yue, Hao
- Article
18
- Nanoscale Research Letters, 2019, v. 14, n. 1, p. 1, doi. 10.1186/s11671-019-2866-5
- Wang, Zhuo;
- Yuan, Zhangyi'an;
- Zhou, Xin;
- Qiao, Ming;
- Li, Zhaoji;
- Zhang, Bo
- Article
19
- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5942, doi. 10.1007/s11664-017-5575-9
- Alimin, A.;
- Radzi, A.;
- Sazali, N.;
- Hatta, S.;
- Soin, N.;
- Hussin, H.
- Article
20
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2172, doi. 10.1007/s11664-015-4296-1
- Jena, Kanjalochan;
- Swain, Raghunandan;
- Lenka, T.
- Article
21
- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3388, doi. 10.1007/s11664-015-3834-1
- Punetha, Mayank;
- Singh, Yashvir
- Article
22
- Journal of Electronic Materials, 2015, v. 44, n. 5, p. 1361, doi. 10.1007/s11664-015-3624-9
- Dodd, Linzi;
- Shenton, Samantha;
- Gallant, Andrew;
- Wood, David
- Article
23
- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1207, doi. 10.1007/s11664-014-2978-8
- Hussin, H.;
- Soin, N.;
- Bukhori, M.F.;
- Abdul Wahab, Y.;
- Shahabuddin, S.
- Article
24
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 26, p. 1, doi. 10.1007/s10854-024-13391-w
- Article
25
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5071, doi. 10.1007/s10854-015-3030-3
- Li, Anli;
- Li, Pengwei;
- Hu, Jie;
- Zhang, Wendong
- Article
26
- Journal of Electronic Testing, 2015, v. 31, n. 4, p. 411, doi. 10.1007/s10836-015-5537-1
- Simionovski, Alexandre;
- Vaz, Rafael;
- Gonçalez, Odair;
- Wirth, Gilson
- Article
27
- IET Power Electronics (Wiley-Blackwell), 2020, v. 13, n. 3, p. 426, doi. 10.1049/iet-pel.2019.0400
- Yang Wen;
- Yuan Yang;
- Yong Gao
- Article
28
- IET Power Electronics (Wiley-Blackwell), 2019, v. 12, n. 15, p. 1, doi. 10.1049/iet-pel.2019.0284
- Article
29
- IET Power Electronics (Wiley-Blackwell), 2017, v. 10, n. 5, p. 577, doi. 10.1049/iet-pel.2016.0107
- Junil Moon;
- Hyeonseok Hwang;
- Byeonghak Jo;
- Chan-Keun Kwon;
- Tae-Geun Kim;
- Soo-Won Kim
- Article
30
- IET Power Electronics (Wiley-Blackwell), 2017, v. 10, n. 4, p. 421, doi. 10.1049/iet-pel.2015.0551
- Schirone, Luigi;
- Macellari, Michele;
- Pellitteri, Filippo
- Article
31
- IET Power Electronics (Wiley-Blackwell), 2016, v. 9, n. 3, p. 553, doi. 10.1049/iet-pel.2014.0799
- Zucchelli, Massimiliano;
- Colalongo, Luigi;
- Richelli, Anna;
- Kovacs-Vajna, Zsolt M.
- Article
32
- IET Power Electronics (Wiley-Blackwell), 2015, v. 8, n. 7, p. 1156, doi. 10.1049/iet-pel.2014.0182
- Chao-Chun Wang;
- Kuan-Hung Wu;
- Yu-Chen Liu;
- Cheng-Yan Yang;
- Mohammed Mahmood Alam;
- Yu-Kang Lo;
- Huang-Jen Chiu
- Article
33
- IET Power Electronics (Wiley-Blackwell), 2015, v. 8, n. 5, p. 678, doi. 10.1049/iet-pel.2013.0975
- Wang Ying;
- Hu Hai-Fan;
- Yu Cheng-Hao;
- Wei Jia-Tong
- Article
34
- Journal of Engineering & Sustainable Development, 2018, v. 22, n. 2, Part 2, p. 64, doi. 10.31272/jeasd.2018.2.19
- Munaf Fathi Badr;
- Suhad Dawood Salman
- Article
35
- Physica Status Solidi - Rapid Research Letters, 2014, v. 8, n. 1, p. 65, doi. 10.1002/pssr.201300119
- Yu, Ran;
- Georgiev, Yordan M.;
- Das, Samaresh;
- Hobbs, Richard G.;
- Povey, Ian M.;
- Petkov, Nikolay;
- Shayesteh, Maryam;
- O'Connell, Dan;
- Holmes, Justin D.;
- Duffy, Ray
- Article
36
- Journal of Circuits, Systems & Computers, 2018, v. 27, n. 13, p. N.PAG, doi. 10.1142/S0218126618300088
- Wu, Jin;
- Dai, Pengfei;
- Peng, Jie;
- Zheng, Lixia;
- Sun, Weifeng
- Article
37
- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 9, p. 4150, doi. 10.1007/s11661-015-3040-z
- Akin, Seçkİn;
- Sönmezoğlu, Savaş
- Article
38
- Journal of Solid State Electrochemistry, 2019, v. 23, n. 1, p. 81, doi. 10.1007/s10008-018-4111-z
- Wang, Ziyan;
- Li, Meishan;
- Ye, Yingxiang;
- Yang, Yisi;
- Lu, Yaqi;
- Ma, Xiuling;
- Zhang, Zhangjing;
- Xiang, Shengchang
- Article
39
- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2018, v. 12, n. 5, p. 756, doi. 10.1049/iet-map.2017.0235
- Ambulker, Sunanda;
- Nakhate, Sangeeta
- Article
40
- Journal of Communications Technology & Electronics, 2017, v. 62, n. 5, p. 512, doi. 10.1134/S1064226917050047
- Budagyan, I.;
- Kostin, M.;
- Shil'tsin, A.
- Article
41
- Applied Sciences (2076-3417), 2020, v. 10, n. 12, p. 4380, doi. 10.3390/app10124380
- Lee, Yu-Lin;
- Lin, Chang-Hua;
- Yang, Shih-Jen
- Article
42
- Journal of Nanjing University of Aeronautics & Astronautics / Nanjing Hangkong Hangtian Daxue Xuebao, 2017, v. 49, n. 4, p. 531, doi. 10.16356/j.1005-2615.2017.04.012
- Article
43
- Nanomaterials & Nanotechnology, 2015, v. 5, p. 1, doi. 10.5772/61395
- Honghua Huang;
- Ying Zhang;
- Wenyan Wei;
- Ting Yu;
- Xingfang Luo;
- Cailei Yuan
- Article
44
- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 7, p. 1, doi. 10.1007/s00339-023-06728-5
- Sun, WenJie;
- Song, JianJun;
- Zhang, Zhe;
- Bi, SiHan
- Article
45
- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 2, p. 1, doi. 10.1007/s00339-023-06383-w
- Article
46
- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 2, p. 1, doi. 10.1007/s00339-022-06375-2
- Hu, Ziyan;
- Zhang, Hongyan;
- Zhang, Ling;
- Cheng, Cao;
- Man, Jianping
- Article
47
- Applied Physics A: Materials Science & Processing, 2019, v. 125, n. 5, p. N.PAG, doi. 10.1007/s00339-019-2606-9
- Bencherif, H.;
- Dehimi, L.;
- Pezzimenti, F.;
- Corte, F. G. Della
- Article
48
- Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 12, p. 1, doi. 10.1007/s00339-017-1430-3
- Kim, Hogyoung;
- Kim, Dong;
- Choi, Byung
- Article
49
- Semiconductors, 2018, v. 52, n. 5, p. 590, doi. 10.1134/S1063782618050068
- Filatov, D. O.;
- Guseinov, D. V.;
- Chalkov, V. Yu.;
- Denisov, S. A.;
- Shengurov, V. G.
- Article
50
- Semiconductors, 2014, v. 48, n. 10, p. 1381, doi. 10.1134/S1063782614100145
- Article