High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
- By:
- Publication type:
- Article
Works matching DE "LEAD-free solder testing"
Results: 5
1
2
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2519, doi. 10.1007/s11664-012-2180-9
- By:
- Publication type:
- Article
3
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 763, doi. 10.1007/s11664-012-1921-0
- By:
- Publication type:
- Article
4
Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 3, p. 611, doi. 10.1007/s11664-011-1799-2
- By:
- Publication type:
- Article
5
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging.
- Published in:
- Journal of Materials Science, 2019, v. 54, n. 2, p. 1741, doi. 10.1007/s10853-018-2907-y
- By:
- Publication type:
- Article