Works about LEAD-free solder

Results: 428

Effect of Operating Ambient Temperatures on Degradation of Solder Joints in IGBT Power Module.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 8, p. 6870, doi. 10.1007/s11664-025-12103-2

By:

Nebo, Sunday E.;
Amalu, Emeka H.;
Hughes, David J.

Publication type:

Article

Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 8, p. 6828, doi. 10.1007/s11664-025-12048-6

By:

Fardin, Sadib;
Moresalein, Md. Jawarul;
Motalab, Mohammad;
Faiyad, Abrar;
Paul, Ratul

Publication type:

Article

Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2680, doi. 10.3390/ma18122680

By:

Wang, Chao-Hong;
Lin, Che-Yang

Publication type:

Article

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain.

Published in:

INCAS Bulletin, 2016, v. 8, n. 1, p. 131, doi. 10.13111/2066-8201.2016.8.1.12

By:

PADURARU, Georgiana;
TUDOR, Andrei;
PETRESCU, Alina;
PLOTOG, Ioan

Publication type:

Article

Mechanical and Microstructural Properties of In, Ag, Al Doped Lead-Free Sn-Zn Solder Alloy Systems.

Published in:

Afyon Kocatepe University Journal of Science & Engineering / Afyon Kocatepe Üniversitesi Fen Ve Mühendislik Bilimleri Dergisi, 2022, v. 22, n. 3, p. 477, doi. 10.35414/akufemubid.1075864

By:

ÖZTÜRK, Esra

Publication type:

Article

Thickness-dependent Electrical and Piezoelectric Properties of Lead-Free Ferroelectric Ba0.8Sr0.2TiO3 Thin Films.

Published in:

Journal of Nano- & Electronic Physics, 2016, v. 8, n. 3, p. 1, doi. 10.21272/jnep.8(3).03027

By:

Kiselev, D. A.;
Levashov, S. A.;
Afanasiev, M. S.;
Kiselev, A. M.;
Chucheva, G. V.

Publication type:

Article

Nachruf für em. Univ. Prof. Dr. Herbert Ipser.

Published in:

Nachrichten aus der Chemie, 2020, v. 68, n. 5, p. 95, doi. 10.1002/nadc.20204099072

By:

Flandorfer, Hans;
Gruber, Ernst;
Richter, Klaus

Publication type:

Article

Micro-Particle Induced X-ray Emission Study of Lead-Free and Lead-Based Solders and Interactions with Copper Wires.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2023, v. 220, n. 10, p. 1, doi. 10.1002/pssa.202200432

By:

Whitlow, Harry J.;
Nagy, Gyula

Publication type:

Article

A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields.

Published in:

International Journal of Applied Mechanics, 2022, v. 14, n. 6, p. 1, doi. 10.1142/S1758825122500570

By:

Yi, J. L.;
Chen, J. H.;
Qu, C.;
Zhang, Y. X.;
Cui, Y. H.

Publication type:

Article

Cooling and Annealing Effect on Indentation Response of Lead-Free Solder.

Published in:

International Journal of Applied Mechanics, 2017, v. 9, n. 4, p. -1, doi. 10.1142/S1758825117500570

By:

Long, Xu;
Feng, Yihui;
Yao, Yao

Publication type:

Article

Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.

Published in:

Modern Physics Letters B, 2020, v. 34, n. 36, p. N.PAG, doi. 10.1142/S0217984920504138

By:

Liu, Yang;
Chang, Jian;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Sun, Fenglian

Publication type:

Article

Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2022, v. 36, n. 9-11, p. 1, doi. 10.1142/S021797922240015X

By:

Yao, Shuyi;
Shi, Xin;
Li, Yuanxing;
Wan, Liping;
Zheng, Xiangbo;
Wang, Yao;
Chen, Hui

Publication type:

Article

Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic-aided laser reflow soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2021, v. 35, n. 5, p. N.PAG, doi. 10.1142/S0217979221500636

By:

Wang, Bo;
Pan, Kailin;
Gong, Yubing;
Long, Yuhong;
Shi, Kai

Publication type:

Article

Influence of bismuth addition on the microstructure, wettability, thermal properties and electrical resistivity of Sn–Zn-based solder alloys.

Published in:

Welding International, 2025, v. 39, n. 4, p. 322, doi. 10.1080/09507116.2025.2462692

By:

Ibrahim Al-Ezzi, Athil S.

Publication type:

Article

Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys.

Published in:

Welding International, 2024, v. 38, n. 3, p. 211, doi. 10.1080/09507116.2024.2317322

By:

Al-Ezzi, Athil S.;
Kader, Ekhlas.;
Alazzawi, Sheymaa

Publication type:

Article

Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder.

Published in:

Welding International, 2017, v. 31, n. 11, p. 846, doi. 10.1080/09507116.2016.1223227

By:

Yamaguchi, Takuto;
Tohei, Tomotake;
Ikeda, Osamu;
Hata, Shohei;
Oda, Yuichi;
Kuroki, Kazuma;
Kuroda, Hiromitsu;
Hirose, Akio

Publication type:

Article

Use of contact-reactive soldering in production of power semiconductor devices.

Published in:

Welding International, 2012, v. 26, n. 1, p. 45, doi. 10.1080/09507116.2011.592712

By:

Zenin, V.V.;
Boiko, V.I.

Publication type:

Article

Thermodynamic Reassessment of the Binary Cu-Sn, Cu-P, and Sn-P and Ternary Cu-Sn-P Systems.

Published in:

Journal of Phase Equilibria & Diffusion, 2024, v. 45, n. 3, p. 547, doi. 10.1007/s11669-024-01112-z

By:

Oikawa, Katsunari;
Ueshima, Nobufumi

Publication type:

Article

Herbert Ipser (1947–2019).

Published in:: Journal of Phase Equilibria & Diffusion, 2020, v. 41, n. 1, p. 1, doi. 10.1007/s11669-020-00782-9
Publication type:: Article

Advances in Pb-free Solder Microstructure Control and Interconnect Design.

Published in:

Journal of Phase Equilibria & Diffusion, 2016, v. 37, n. 4, p. 369, doi. 10.1007/s11669-016-0476-9

By:

Reeve, Kathlene;
Holaday, John;
Choquette, Stephanie;
Anderson, Iver;
Handwerker, Carol

Publication type:

Article

Experimental Determination of Phase Equilibria in the Ag-Cu-Sb Ternary System.

Published in:

Journal of Phase Equilibria & Diffusion, 2015, v. 36, n. 5, p. 503, doi. 10.1007/s11669-015-0406-2

By:

Liu, X.;
Yang, X.;
Yang, S.;
Wang, C.

Publication type:

Article

The Effect of Gallium Addition on the Microstructure and Superconducting Properties of In-Bi-Sn Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2628, doi. 10.1007/s11664-024-11584-x

By:

Zhou, Jiye;
Shahbazi, Mahboobeh;
Poitras, Jordan T.;
Tan, Xin Fu;
McDonald, Stuart D.;
Nogita, Kazuhiro

Publication type:

Article

Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2589, doi. 10.1007/s11664-024-11382-5

By:

Wang, Chao-hong;
Chang, Tai-yu

Publication type:

Article

Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9

By:

Zhao, Yuwen;
Yang, Jiyou;
Xu, Liming;
Zhao, Yueqi;
Li, Kun;
Yang, Linmei

Publication type:

Article

Effect of Sn Orientation on Electromigration Failure in CuSn Solders.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8

By:

Pham, Andrew Minh;
Haq, Fariha;
Sadasiva, Subramanya;
Li, Guangxu;
Koslowski, Marisol

Publication type:

Article

Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5486, doi. 10.1007/s11664-024-11235-1

By:

Lebda, H. I.;
Habashy, D. M.;
Mousa, M. M.

Publication type:

Article

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1183, doi. 10.1007/s11664-023-10849-1

By:

Tan, Xin F.;
Hao, Qichao;
Zhou, Jiye;
McDonald, Stuart D.;
Sweatman, Keith;
Nogita, Kazuhiro

Publication type:

Article

The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 1, p. 380, doi. 10.1007/s11664-023-10780-5

By:

Belhadi, Mohamed El Amine;
Hamasha, Sa'd;
Alahmer, Ali;
Zhao, Rong;
Prorok, Barton C.;
Alavi, Soroosh

Publication type:

Article

Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7512, doi. 10.1007/s11664-023-10660-y

By:

Wang, Xianyu;
He, Liang;
Chen, Hua;
Xiao, Xiaolei

Publication type:

Article

Measurement of Mixing Enthalpies for Sn-Bi-Sb Lead-Free Solder System.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 9, p. 6316, doi. 10.1007/s11664-023-10579-4

By:

Singh, Vikrant;
Pathote, Dileep;
Jaiswal, Dheeraj;
Kumar, M. R.;
Singh, Kamalesh K.;
Behera, C. K.

Publication type:

Article

Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x

By:

Njoku, Jude E.;
Amalu, Emeka H.;
Ekere, Ndy;
Mallik, Sabuj;
Ekpu, Mathias;
Ogbodo, Eugene A.

Publication type:

Article

Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 2, p. 1216, doi. 10.1007/s11664-022-10006-0

By:

Han, Jing;
Cao, Heng;
Meng, Zhou;
Jin, Xuelun;
Ma, Limin;
Guo, Fu;
An, Tong;
Wang, Ting

Publication type:

Article

Low-Cycle Fatigue Behavior of Sn-0.3Ag-0.7Cu-0.5CeO2 Composite Solder Alloy.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 12, p. 7313, doi. 10.1007/s11664-022-09958-0

By:

Li, L.;
Li, Z. H.;
Tang, Y.;
Li, G. Y.

Publication type:

Article

Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 9, p. 4952, doi. 10.1007/s11664-022-09732-2

By:

Pu, Cunji;
Qiu, Jialong;
Li, Caiju;
Gao, Peng;
Peng, Yanzhi;
He, Qi;
Bai, Hailong;
Yi, Jianhong

Publication type:

Article

Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3552, doi. 10.1007/s11664-022-09601-y

By:

Yao, Zongxiang;
Ling, Diying;
Liu, Yikai;
Sun, Jiashuai;
Yin, Limeng;
Wang, Gang;
Zhang, Long

Publication type:

Article

Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1820, doi. 10.1007/s11664-022-09438-5

By:

Wang, Chao-hong;
Chen, Ke-Hsing;
Tsai, Jiun-Yu

Publication type:

Article

Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1116, doi. 10.1007/s11664-021-09377-7

By:

Qin, Hongbo;
Lei, Chuyi;
Luan, Xinghe;
Wen, Quanzhang;
Li, Wangyun

Publication type:

Article

The Effect of Electric-Thermal-Vibration Stress Coupling on the Reliability of Sn-Ag-Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 1, p. 284, doi. 10.1007/s11664-021-09302-y

By:

Hu, Xinlan;
He, Liang;
Chen, Hua;
Lv, Yunxuan;
Gao, Haowen;
Liu, Juncheng

Publication type:

Article

Phase-Field Modelling of Lead-Free Solder Joint Void Growth Under Thermal-Electrical Coupled Stress.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 1, p. 259, doi. 10.1007/s11664-021-09287-8

By:

Li, Yanruoyue;
Fu, Guicui;
Wan, Bo;
Yan, Xiaojun;
Zhang, Weifang;
Li, Wei

Publication type:

Article

Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6629, doi. 10.1007/s11664-021-09157-3

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Guo, Chunfeng;
Hu, Rongrong;
Su, Xiaofeng

Publication type:

Article

Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 11, p. 6372, doi. 10.1007/s11664-021-09143-9

By:

Zamani Bakhtiarvand, N.;
Taherizadeh, A.;
Maleki, A.;
Karimi, M. A.

Publication type:

Article

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5965, doi. 10.1007/s11664-021-09107-z

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Li, Yang;
Guo, Chunfeng;
Hu, Rongrong;
Bao, Qijun

Publication type:

Article

Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4433, doi. 10.1007/s11664-021-08968-8

By:

Ekpu, Mathias

Publication type:

Article

Interfacial reactions with and without current stressing at Sn-Co/Ag and Sn-Co/Cu solder joints.

Published in:

Journal of Materials Science, 2013, v. 48, n. 19, p. 6640, doi. 10.1007/s10853-013-7464-9

By:

Hsu, Chia-ming;
Chen, Sinn-wen

Publication type:

Article

Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging.

Published in:

Journal of Materials Science, 2012, v. 47, n. 9, p. 4012, doi. 10.1007/s10853-012-6254-0

By:

Chen, Wei-Yu;
Yu, Chi-Yang;
Duh, Jenq-Gong

Publication type:

Article

Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes.

Published in:

Journal of Engineering Physics & Thermophysics, 2022, v. 95, n. 6, p. 1437, doi. 10.1007/s10891-022-02612-w

By:

Zhdanok, S. A.;
Lanin, V. L.;
Emel'yanov, V. A.;
Krauklis, A. V.

Publication type:

Article

Microstructure and Mechanical Properties of Bi27In38Sn35 Foil Produced by Rapid Solidification.

Published in:

Journal of Engineering Physics & Thermophysics, 2021, v. 94, n. 2, p. 534, doi. 10.1007/s10891-021-02325-6

By:

Gusakova, S. V.;
Shepelevich, V. G.;
Gusakova, O. V.

Publication type:

Article

Avoiding inelastic strains in solder joint interconnections of space electronics.

Published in:

ZAMM -- Journal of Applied Mathematics & Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 2023, v. 103, n. 2, p. 1, doi. 10.1002/zamm.202200097

By:

Suhir, E.

Publication type:

Article

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix.

Published in:

Crystal Research & Technology, 2020, v. 55, n. 12, p. 1, doi. 10.1002/crat.202000123

By:

Pal, Manoj Kumar;
Gergely, Gréta;
Koncz‐Horváth, Dániel;
Gácsi, Zoltán

Publication type:

Article

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles.

Published in:

Journal of Polytechnic, 2024, v. 27, n. 4, p. 1505, doi. 10.2339/politeknik.1313792

By:

TALAŞ, Şükrü;
ÖZKAN, Elif;
AYAR, Bahattin

Publication type:

Article