Works matching DE "LEAD-free electronics manufacturing processes"
Results: 81
Beware of Rosh's product focus.
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- Manufacturing Engineer, 2005, v. 84, n. 5, p. 48, doi. 10.1049/me:20050515
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Molten hydroxide synthesis as an alternative to molten salt synthesis for producing KNaNbO lead free ceramics.
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- Journal of Materials Science, 2012, v. 47, n. 4, p. 1938, doi. 10.1007/s10853-011-5984-8
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BiFeO-modified (Li, K, Na)(Nb, Ta)O lead-free piezoelectric ceramics with temperature-stable piezoelectric property and enhanced mechanical strength.
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- Journal of Materials Science, 2012, v. 47, n. 4, p. 1767, doi. 10.1007/s10853-011-5957-y
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Phase transition, dielectric and piezoelectric properties of KNaNbO-CaTiZrO lead-free ceramics.
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- Journal of Materials Science, 2012, v. 47, n. 1, p. 397, doi. 10.1007/s10853-011-5811-2
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Enhanced temperature stability of modified (K<sub>0.5</sub>Na<sub>0.5</sub>)<sub>0.94</sub>Li<sub>0.06</sub>NbO<sub>3</sub> lead-free piezoelectric ceramics.
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- Journal of Materials Science, 2009, v. 44, n. 22, p. 6162, doi. 10.1007/s10853-009-3852-6
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Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9
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Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4
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An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
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Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5
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Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3
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Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 39, doi. 10.1007/s11664-008-0529-x
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Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
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Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5
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Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0
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Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 860, doi. 10.1007/s11664-008-0399-2
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Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
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Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 515, doi. 10.1007/s11664-008-0379-6
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Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests.
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- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1129, doi. 10.1007/s11664-007-0186-5
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Nanoindentation on SnAgCu Lead-Free Solder Joints and Analysis.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2107, doi. 10.1007/s11664-006-0320-9
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The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5
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Effect of Small Additions of Alloying Elements on the Properties of Sn-Zn Eutectic Alloy.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1734, doi. 10.1007/s11664-006-0227-5
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The effects of third alloying elements on the bulk Ag<sub>3</sub>Sn formation in slowly cooled Sn–3.5Ag lead-free solder.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 275, doi. 10.1007/s10854-007-9292-7
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Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solder.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 247, doi. 10.1007/s10854-007-9279-4
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Interfacial reaction issues for lead-free electronic solders.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 155
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Life expectancies of Pb-free SAC solder interconnects in electronic hardware.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 229
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Electromigration issues in lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 259
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Impact of the ROHS directive on high-performance electronic systems.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 331
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Issues related to the implementation of Pb-free electronic solders in consumer electronics.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 319
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Tin pest issues in lead-free electronic solders.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 307
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Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 175
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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 247
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Mechanical fatigue of Sn-rich Pb-free solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 211
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Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 93
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Phase Diagrams of Pb-Free Solders and their Related Materials Systems.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 19
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Deformation behavior of tin and some tin alloys.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 191
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Processing and material issues related to lead-free soldering.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 147
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Thermodynamics and phase diagrams of lead-free solder materials.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 3
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Impact of the ROHS Directive on high-performance electronic systems.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 347
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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 39
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Composite lead-free electronic solders.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 129
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Determinants of green electricity adoption among residential customers in Germany.
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- International Journal of Consumer Studies, 2010, v. 34, n. 4, p. 464, doi. 10.1111/j.1470-6431.2010.00896.x
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A HYBRID METHOD FOR MECHANICAL TESTING OF ELECTRONIC PACKAGING.
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- Annals of DAAAM & Proceedings, 2009, p. 1045
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Lead-Free Reliability Issues and Test Methods.
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- EE: Evaluation Engineering, 2006, v. 45, n. 6, p. 48
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PCB Inspection Outlook for 2005.
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- EE: Evaluation Engineering, 2004, v. 43, n. 12, p. 38
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Green Electronics through Legislation and Lead Free Soldering.
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- CLEAN: Soil, Air, Water, 2008, v. 36, n. 2, p. 145, doi. 10.1002/clen.200700164
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Lead-free solders: Still learning, adapting, and working out the kinks.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 7, p. 15, doi. 10.1007/s11837-010-0101-z
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Structure and piezoelectric properties of KNaNbO-BiLiTiO lead-free ceramics.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 501, doi. 10.1007/s10854-011-0425-7
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Reliability of printed circuit boards containing lead-free solder in aggressive environments.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 4, p. 400, doi. 10.1007/s10854-010-0150-7
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Lead-Free Niobate Ceramics with Relaxor-Like Properties.
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- Ferroelectrics, 2006, v. 340, n. 1, p. 107, doi. 10.1080/00150190600889114
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High Performance Lead-free Piezoelectric Ceramics in the (K,Na)NbO 3 -LiTaO 3 Solid Solution System.
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- Ferroelectrics, 2006, v. 338, n. 1, p. 17, doi. 10.1080/00150190600732512
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