Works matching DE "LEAD-free electronics manufacturing processes"

Results: 85

Structure and piezoelectric properties of KNaNbO-BiLiTiO lead-free ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 501, doi. 10.1007/s10854-011-0425-7

By:

Lin, Dunmin;
Kwok, Kin

Publication type:

Article

Reliability of printed circuit boards containing lead-free solder in aggressive environments.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 4, p. 400, doi. 10.1007/s10854-010-0150-7

By:

Moshrefi-Torbati, M.;
Swingler, J.

Publication type:

Article

The effects of third alloying elements on the bulk Ag3Sn formation in slowly cooled Sn–3.5Ag lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 275, doi. 10.1007/s10854-007-9292-7

By:

Jun Shen;
Shiqiang Lai;
Yongchang Liu;
Houxiu Gao;
Jun Wei

Publication type:

Article

Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 247, doi. 10.1007/s10854-007-9279-4

By:

Wan, J. B.;
Liu, Y. C.;
Wei, C.;
Gao, Z. M.;
Ma, C. S.

Publication type:

Article

Electromigration issues in lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 259

By:

Chih Chen;
S. Liang

Publication type:

Article

Impact of the ROHS directive on high-performance electronic systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 331

By:

Karl Puttlitz;
George Galyon

Publication type:

Article

Life expectancies of Pb-free SAC solder interconnects in electronic hardware.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 229

By:

Michael Osterman;
Abhijit Dasgupta

Publication type:

Article

Tin pest issues in lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 307

By:

W. Plumbridge

Publication type:

Article

Mechanical fatigue of Sn-rich Pb-free solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 211

By:

Q. Zeng;
L. Zhang;
Q. Zhu

Publication type:

Article

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 93

By:

Paul Vianco;
Jerome Rejent;
Arlo Fossum;
Michael Neilsen

Publication type:

Article

Phase Diagrams of Pb-Free Solders and their Related Materials Systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 19

By:

Sinn-Wen Chen;
Chao-Hong Wang;
Shih-Kang Lin;
Chen-Nan Chiu

Publication type:

Article

Interfacial reaction issues for lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 155

By:

C. Ho;
S. Yang;
C. Kao

Publication type:

Article

Processing and material issues related to lead-free soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 147

By:

Laura Turbini

Publication type:

Article

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 175

By:

N. Chawla;
R. Sidhu

Publication type:

Article

Issues related to the implementation of Pb-free electronic solders in consumer electronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 319

By:

D. Frear

Publication type:

Article

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 247

By:

Seung-Hyun Chae;
Xuefeng Zhang;
Kuan-Hsun Lu;
Huang-Lin Chao;
Paul Ho;
Min Ding;
Peng Su;
Trent Uehling;
Lakshmi Ramanathan

Publication type:

Article

Deformation behavior of tin and some tin alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 191

By:

Fuqian Yang;
J. C. M. Li

Publication type:

Article

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 39

By:

D. Swenson

Publication type:

Article

Thermodynamics and phase diagrams of lead-free solder materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 3

By:

H. Ipser;
H. Flandorfer;
Ch. Luef;
C. Schmetterer;
U. Saeed

Publication type:

Article

Impact of the ROHS Directive on high-performance electronic systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 347

By:

Karl Puttlitz;
George Galyon

Publication type:

Article

Composite lead-free electronic solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 129

By:

Fu Guo

Publication type:

Article

Lead-Free Reliability Issues and Test Methods.

Published in:

EE: Evaluation Engineering, 2006, v. 45, n. 6, p. 48

By:

Delserro, Gary

Publication type:

Article

PCB Inspection Outlook for 2005.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 12, p. 38

By:

Lecklider, Tom

Publication type:

Article

Lead-free transducer for non-destructive evaluation.

Published in:

Applied Physics A: Materials Science & Processing, 2007, v. 88, n. 1, p. 209, doi. 10.1007/s00339-007-3971-3

By:

Edwards, G.C.;
Choy, S.H.;
Chan, H.L.W.;
Scott, D.A.;
Batten, A.

Publication type:

Article

0.90(Bi1/2Na1/2)TiO3–0.05(Bi1/2K1/2)TiO3– 0.05BaTiO3 transducer for ultrasonic wirebonding applications.

Published in:

Applied Physics A: Materials Science & Processing, 2006, v. 84, n. 3, p. 313, doi. 10.1007/s00339-006-3625-x

By:

Choy, S. H.;
Wang, X. X.;
Chong, C. P.;
Chan, H. L. W.;
Liu, P. C. K.;
Choy, C. L.

Publication type:

Article

Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2519, doi. 10.1007/s11664-012-2180-9

By:

Yazzie, K.E.;
Williams, J.J.;
Chawla, N.

Publication type:

Article

Whisker Formation Induced by Component and Assembly Ionic Contamination.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 2, p. 204, doi. 10.1007/s11664-011-1808-5

By:

Snugovsky, Polina;
Meschter, Stephan;
Bagheri, Zohreh;
Kosiba, Eva;
Romansky, Marianne;
Kennedy, Jeffrey

Publication type:

Article

Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 153, doi. 10.1007/s11664-011-1740-8

By:

Lin, T.Y.;
Liao, C.N.;
Wu, Albert

Publication type:

Article

Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 86, doi. 10.1007/s11664-011-1757-z

By:

Gierlotka, Wojciech

Publication type:

Article

Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1517, doi. 10.1007/s11664-011-1632-y

By:

Laurila, T.;
Karppinen, J.;
Vuorinen, V.;
Paul, A.;
Paulasto-Kröckel, M.

Publication type:

Article

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1533, doi. 10.1007/s11664-011-1639-4

By:

Leinenbach, C.;
Valenza, F.;
Giuranno, D.;
Elsener, H.;
Jin, S.;
Novakovic, R.

Publication type:

Article

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi- xCr Solder in 3.5% NaCl Solution.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1556, doi. 10.1007/s11664-011-1650-9

By:

Hu, Jing;
Luo, Tingbi;
Hu, Anmin;
Li, Ming;
Mao, Dali

Publication type:

Article

Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1409, doi. 10.1007/s11664-011-1534-z

By:

Nguyen, T.;
Yu, D.;
Park, S.

Publication type:

Article

Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2553, doi. 10.1007/s11664-010-1373-3

By:

Harcuba, Petr;
Janeček, Miloš

Publication type:

Article

Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies.

Published in:: Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2503, doi. 10.1007/s11664-010-1389-8
Publication type:: Article

Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl-NaSO Electroplating Solutions for Pb-Free Solder Packaging.

Published in:

2010

By:

Dalili, Neda;
He, Anqiang;
Liu, Qi;
Ivey, Douglas

Publication type:

Correction Notice

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2643, doi. 10.1007/s11664-010-1313-2

By:

Chang, Jaewon;
Seo, Sun-Kyoung;
Lee, Hyuck

Publication type:

Article

High-Temperature Capacitor Based on Ca-Doped BiNaTiO-BaTiO Ceramics.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2471, doi. 10.1007/s11664-010-1246-9

By:

Yuan, Y.;
Zhou, X.;
Zhao, C.;
Li, B.;
Zhang, S.

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9

By:

Nousiainen, Olli;
Kangasvieri, Tero;
Rautioaho, Risto;
Vähäkangas, Jouko

Publication type:

Article

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4

By:

Zhao, N.;
Pan, X. M.;
D. Q. Yu;
Ma, H. T.;
L. Wang

Publication type:

Article

Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5

By:

Hui Zhao;
Nalagatla, Dinesh;
Sekulic, Dusan

Publication type:

Article

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3

By:

Mahmudi, R.;
Geranmayeh, A.R.;
Noori, H.;
Taghaddosi, M.

Publication type:

Article

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 39, doi. 10.1007/s11664-008-0529-x

By:

Kim, Dong;
Cho, Moon;
Seo, Sun-Kyoung;
Lee, Hyuck

Publication type:

Article

Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0

By:

Lai, R.;
Lin, K.;
Salam, B.

Publication type:

Article

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5

By:

Kumamoto, Seishi;
Sakural, Hitoshi;
Kukimoto, Youichi;
Suganuma, Katsuaki

Publication type:

Article

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0

By:

Xu, Luhua;
Pang, John H. L.;
Che, Faxing

Publication type:

Article

Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 860, doi. 10.1007/s11664-008-0399-2

By:

Babaghorbani, P.;
Gupta, M.

Publication type:

Article

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6

By:

Shih, T. I.;
Duh, J. G.

Publication type:

Article

Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 4, p. 515, doi. 10.1007/s11664-008-0379-6

By:

Nai, S. M. L.;
Wei, J.;
Gupta, M.

Publication type:

Article