Works matching DE "LARGE scale integration of circuits"
Results: 43
High Dimensional Electromagnetic Interference Signal Clustering Based On SOM Neural Network.
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- Electronics / Elektronika (1450-5843), 2016, v. 20, n. 1, p. 27, doi. 10.7251/ELS1620027L
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- Article
A technique for estimating the probability of radiation-stimulated failures of integrated microcircuits in low-intensity radiation fields: Application to the Spektr-R spacecraft.
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- Cosmic Research, 2006, v. 44, n. 5, p. 456, doi. 10.1134/S0010952506050091
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- Article
The Palliation of Low Leakage Multi-Fin Based Schmitt Trigger Using Self Controllable Voltage Level Technique.
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- Journal of Active & Passive Electronic Devices, 2018, v. 13, n. 1, p. 73
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- Article
PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.
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- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 30, doi. 10.31399/asm.edfa.2016-1.p030
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- Article
The Implementation of a 2/4/8 Antennas Configurable Diversity OFDM Receiver for Mobile HDTV Application.
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- International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/303627
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- Article
Realization of IIR Decimation Filters Based on Merged Delay Transformation.
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- Research Letters in Communications, 2007, v. 2007, p. 1, doi. 10.1155/2007/53296
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- Article
A Sequential Circuit-Based IP Watermarking Algorithm for Multiple Scan Chains in Design-for-Test.
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- Radioengineering, 2011, v. 20, n. 2, p. 533
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- Article
Stacked Integration of MEMS on LSI.
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- Micromachines, 2016, v. 7, n. 8, p. 137, doi. 10.3390/mi7080137
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- Article
Large-Scale Integration of All-Glass Valves on a Microfluidic Device.
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- Micromachines, 2016, v. 7, n. 5, p. 83, doi. 10.3390/mi7050083
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- Article
The need for more flexibility in the regulation of smart grids - stakeholder involvement.
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- International Economics & Economic Policy, 2014, v. 11, n. 1/2, p. 261, doi. 10.1007/s10368-013-0243-x
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- Article
High Tap Density Co and Ni Containing P2‐Na<sub>0.66</sub>MnO<sub>2</sub> Buckyballs: A Promising High Voltage Cathode for Stable Sodium‐Ion Batteries.
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- Advanced Functional Materials, 2018, v. 28, n. 32, p. 1, doi. 10.1002/adfm.201801898
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- Article
Multiple Sink Placement in Partitioned Wireless Sensor Networks.
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- International Journal of Next-Generation Computing, 2015, v. 6, n. 2, p. 79
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- Article
EUV lithography: Lithography gets extreme.
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- Nature Photonics, 2010, v. 4, n. 1, p. 24, doi. 10.1038/nphoton.2009.251
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- Article
Circuit partitioning via set partitioning and column...
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- Operations Research, 1996, v. 44, n. 1, p. 65, doi. 10.1287/opre.44.1.65
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- Article
FAILURE ANALYSIS OF MULTILEVEL METALLIZED LSI USING OPTICAL BEAM INDUCED CURRENT.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 239, doi. 10.1002/qre.4680080311
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- Article
The first decades of developmental evolution and the Journal of Experimental Zoology.
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- Journal of Experimental Zoology Part B: Molecular & Developmental Evolution, 2018, v. 330, n. 8, p. 395, doi. 10.1002/jez.b.22839
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- Article
Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects.
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- 2012
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- Abstract
Application of polymers to photoresist materials.
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- International Polymer Science & Technology, 2012, v. 39, n. 5, p. 47, doi. 10.1177/0307174X1203900513
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- Article
SENSING.
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- 1983
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- Abstract
Analysis of the status and prospects for the commercial use of fiber-reinforced silicon-carbide ceramics.
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- Refractories & Industrial Ceramics, 2012, v. 53, n. 1, p. 62, doi. 10.1007/s11148-012-9463-9
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- Article
A 0.15-μm CMOS baseband LSI employing sleep mode with clock-offset compensation for M2M wireless sensor networks.
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- IEEJ Transactions on Electrical & Electronic Engineering, 2015, v. 10, n. 5, p. 576, doi. 10.1002/tee.22121
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- Article
4-kV 100-Mbps monolithic isolator on SOI with trench isolation for wideband networks.
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- IEEJ Transactions on Electrical & Electronic Engineering, 2013, v. 8, n. 6, p. 603, doi. 10.1002/tee.21903
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- Article
Low-Temperature Deposition of Reactively Sputtered SiN<sub>x</sub> Films Applicable to TSV Process.
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- Electronics & Communications in Japan, 2016, v. 99, n. 9, p. 101, doi. 10.1002/ecj.11865
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- Article
Bandwidth Control Using Adaptive Packet Policer Management for Packet Transport Network Based on Service Layer Request.
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- Electronics & Communications in Japan, 2016, v. 99, n. 8, p. 38, doi. 10.1002/ecj.11837
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- Article
Multichannel Low-Noise Low-Power Amplifier for Neural Signal Acquisition.
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- Electronics & Communications in Japan, 2016, v. 99, n. 5, p. 62, doi. 10.1002/ecj.11816
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- Article
Three-Dimensional Microcoil Oscillator Fabricated with Monolithic Process on LSI.
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- Electronics & Communications in Japan, 2012, v. 95, n. 11, p. 49, doi. 10.1002/ecj.11404
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- Article
TOWARD ULTRA-LOW POWER III-V QUANTUM LARGE SCALE INTEGRATED CIRCUITS FOR UBIQUITOUS NETWORK ERA.
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- International Journal of High Speed Electronics & Systems, 2006, v. 16, n. 2, p. 421, doi. 10.1142/S0129156406003758
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- Article
Large-scale extraction of brain connectivity from the neuroscientific literature.
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- Bioinformatics, 2015, v. 31, n. 10, p. 1640, doi. 10.1093/bioinformatics/btv025
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- Article
Utilizing NDR effect to reduce switching threshold variations in memristive devices.
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- Applied Physics A: Materials Science & Processing, 2013, v. 111, n. 1, p. 199, doi. 10.1007/s00339-013-7550-5
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- Article
Placement Tool Dedicated for a Via-Programmable Logic Device VPEX.
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- International Journal for Computers & Their Applications, 2011, v. 18, n. 4, p. 218
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- Article
Fault current behaviour of large wind farms and their protection performance.
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- Australian Journal of Electrical & Electronic Engineering, 2014, v. 11, n. 1, p. 136, doi. 10.7158/E13-018.2014.11.1
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- Article
Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors.
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- Sensors (14248220), 2018, v. 18, n. 1, p. 231, doi. 10.3390/s18010231
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- Article
Carbon Nanotube Integration with a CMOS Process.
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- Sensors (14248220), 2010, v. 10, n. 4, p. 3857, doi. 10.3390/s100403857
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- Article
A Resonant Tunneling Nanowire Field Effect Transistor with Physical Contractions: A Negative Differential Resistance Device for Low Power Very Large Scale Integration Applications.
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- Journal of Electronic Materials, 2018, v. 47, n. 2, p. 1091, doi. 10.1007/s11664-017-5823-z
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- Article
Binary Decision Diagrams and neural networks.
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- Journal of Supercomputing, 2007, v. 39, n. 3, p. 301, doi. 10.1007/s11227-006-0010-7
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- Article
Universal inherent fluctuations in statistical counting of large particles in slurry used for semiconductor manufacturing.
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- Scientific Reports, 2020, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41598-020-71768-3
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- Article
AN IMPROVED RULE-BASED DUMMY METAL FILL METHOD FOR 65 NM ASIC DESIGN.
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- Journal of Circuits, Systems & Computers, 2013, v. 22, n. 4, p. 1, doi. 10.1142/S0218126613500217
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- Article
ELECTRIC MODELS OF LARGE-SCALE SYSTEMS AND THEIR ANALOGY TO THERMODYNAMIC SYSTEMS.
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- Journal of Circuits, Systems & Computers, 2006, v. 15, n. 4, p. 505, doi. 10.1142/S0218126606003258
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- Article
Radiation-Induced Fault Simulation of SOI/SOS CMOS LSI's Using Universal Rad-SPICE MOSFET Model.
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- Journal of Electronic Testing, 2017, v. 33, n. 1, p. 37, doi. 10.1007/s10836-016-5635-8
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- Article
BER Analysis of Equalized OFDM Systems in Nakagami, m < 1 Fading.
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- Wireless Personal Communications, 2007, v. 40, n. 3, p. 281, doi. 10.1007/s11277-006-9190-y
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- Article
High yield manufacturing of fully screen-printed organic electrochemical transistors.
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- NPJ Flexible Electronics, 2020, v. 4, n. 1, p. 1, doi. 10.1038/s41528-020-0078-9
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- Article
Ideal Sensor Chips --A Smart Microsensor Chip with LSI and MEMS Process and Materials--.
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- Sensors & Materials, 2018, v. 30, n. 12, Part 1, p. 2761, doi. 10.18494/SAM.2018.1773
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- Article
Vehicle Scheduling Schemes for Commercial and Emergency Logistics Integration.
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- PLoS ONE, 2013, v. 8, n. 12, p. 1, doi. 10.1371/journal.pone.0082866
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- Article