Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages.
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- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3927, doi. 10.1007/s11664-015-3856-8
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Works matching DE "JOINT Electron Device Engineering Council (Organization)"
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Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test.
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- Journal of Electronic Materials, 2013, v. 42, n. 9, p. 2848, doi. 10.1007/s11664-013-2661-5
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3
Experiment and Simulation in Design of the Board-Level Drop Testing Tower Apparatus.
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- Experimental Techniques, 2012, v. 36, n. 2, p. 60, doi. 10.1111/j.1747-1567.2011.00755.x
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