Works about ISOTHERMAL processes

Results: 1690

Does a Warmer World Mean a Greener World? Not Likely!

Published in:

PLoS Biology, 2015, v. 13, n. 6, p. 1, doi. 10.1371/journal.pbio.1002166

By:

Chase, Jonathan

Publication type:

Article

High temperature corrosion behaviour of wire arc sprayed Fe based coatings.

Published in:

Surface Engineering, 2014, v. 30, n. 8, p. 573, doi. 10.1179/1743294414Y.0000000287

By:

Li, R.;
He, D. Y.;
Zhou, Z.;
Zhao, L. D.;
Song, X. Y.

Publication type:

Article

Temperature effects on accommodative processes in simulated amyotrophic lateral sclerosis in the physiological range.

Published in:

Journal of Integrative Neuroscience, 2017, v. 16, n. 3, p. 319, doi. 10.3233/JIN-170022

By:

Stephanova, D. I.;
Kossev, A.

Publication type:

Article

Time-Lapsing Evaluation of the Retardation Behaviour of Polypropylene Homo- and Copolymers using the Stepped Isothermal Method based on Depth-Sensing Macroindentation.

Published in:

Macromolecular Symposia, 2017, v. 373, n. 1, p. n/a, doi. 10.1002/masy.201600137

By:

Krolopp, Tobias;
Lach, Ralf;
Schöne, Jan;
Mecklenburg, Thomas;
Langer, Beate;
Grellmann, Wolfgang

Publication type:

Article

Studies on Non-Isothermal Crystallisation and Viscoelastic Properties of Poly(3-hydroxybutyrate- co-3-hydroxyhexanoate) and Epoxidized Natural Rubber Blends.

Published in:

Macromolecular Symposia, 2017, v. 371, n. 1, p. 107, doi. 10.1002/masy.201600049

By:

Akram, Faridah M.M.;
Chan, Chin Han;
Salim, Yoga Sugama;
Gan, Seng Neon;
Kumar, K. Sudesh

Publication type:

Article

Temperature Dependence of Morphology of Transcrystalline at the Interface of Carbon Fiber and Poly (L-Lactic Acid) Composite Under a Temperature Gradient Stage.

Published in:

Macromolecular Symposia, 2016, v. 365, n. 1, p. 10, doi. 10.1002/masy.201650026

By:

Zhang, Shengnan;
Xu, Duigong;
Yang, Wenxiao;
Tang, Ping;
Bin, Yuezhen

Publication type:

Article

Isothermal Fractionation by DSC: Stepwise Isothermal Segregation Technique Applied to Random C3C2 Copolymers.

Published in:

Macromolecular Symposia, 2015, v. 356, n. 1, p. 19, doi. 10.1002/masy.201500006

By:

Malizia, Federica;
Ferrara, Giuseppe;
Ferrari, Paolo;
Marega, Carla;
Marigo, Antonio

Publication type:

Article

Kinetics of Bu-NENA Evaporation from Bu-NENA/NC Propellant Determined by Isothermal Thermogravimetry.

Published in:

Propellants, Explosives, Pyrotechnics, 2017, v. 42, n. 3, p. 253, doi. 10.1002/prep.201600054

By:

Zhao, Benbo;
Zhang, Tianfu;
Wang, Zhen;
Sun, Shixiong;
Ge, Zhen;
Luo, Yunjun

Publication type:

Article

Single Step Synthesis of Nitro-Functionalized Hydroxyl-Terminated Polybutadiene.

Published in:

Propellants, Explosives, Pyrotechnics, 2013, v. 38, n. 6, p. 748, doi. 10.1002/prep.201300031

By:

Shekhar Pant, C.;
Santosh, Mada S. S. N. M.;
Banerjee, Shaibal;
Khanna, Pawan K.

Publication type:

Article

Facile Characterization of Isothermal Crystallization and Microphase Separation Kinetics of Polyamide 6 (PA6)‐Based Thermoplastic Elastomers.

Published in:

Macromolecular Chemistry & Physics, 2024, v. 225, n. 15, p. 1, doi. 10.1002/macp.202400058

By:

Yuan, Ruchao;
Zhang, Longfeng;
Zhang, Junfeng;
Wang, Xueli;
Yu, Jianyong;
Li, Faxue

Publication type:

Article

A Matter of Size and Stress: Understanding the First-Order Transition in Materials for Solid-State Refrigeration.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 32, p. n/a, doi. 10.1002/adfm.201606735

By:

Gottschall, Tino;
Benke, Dimitri;
Fries, Maximilian;
Taubel, Andreas;
Radulov, Iliya A.;
Skokov, Konstantin P.;
Gutfleisch, Oliver

Publication type:

Article

High-Temperature Photoluminescence of CsPbX3 (X = Cl, Br, I) Nanocrystals.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 21, p. n/a, doi. 10.1002/adfm.201606750

By:

Diroll, Benjamin T.;
Nedelcu, Georgian;
Kovalenko, Maksym V.;
Schaller, Richard D.

Publication type:

Article

Temperature dependence of in vitro Rubisco kinetics in species of Flaveria with different photosynthetic mechanisms.

Published in:

Photosynthesis Research, 2015, v. 124, n. 1, p. 67, doi. 10.1007/s11120-015-0092-2

By:

Perdomo, Juan;
Cavanagh, Amanda;
Kubien, David;
Galmés, Jeroni

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25025, doi. 10.1007/s10854-022-09210-9

By:

Xin, Meiling;
Wang, Xiuqi;
Sun, Fenglian

Publication type:

Article

Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22771, doi. 10.1007/s10854-021-06711-x

By:

Shang, Min;
Dong, Chong;
Yao, Jinye;
Wang, Chen;
Ma, Haoran;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 23, p. 21335, doi. 10.1007/s10854-020-04646-3

By:

Dong, Chong;
Ma, Haoran;
Hussain, MuhammadMuzammal;
Sun, Liying;
Chen, Jun;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Potential temperature sensing of oriented carbon-fiber filled composite and its resistance memory effect.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9612, doi. 10.1007/s10854-019-01295-z

By:

Huang, Pei;
Xia, Zhidong;
Cui, Song;
Wang, Jinshu;
Zhao, Shaofan

Publication type:

Article

119Sn and 57Fe Mӧssbauer study of highly conductive vanadate glass.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8847, doi. 10.1007/s10854-019-01211-5

By:

Nishida, Tetsuaki;
Fujita, Yuki;
Shiba, Sachiya;
Masuda, Sayaka;
Yamaguchi, Naomi;
Izumi, Tomoka;
Kubuki, Shiro;
Oka, Nobuto

Publication type:

Article

Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4737, doi. 10.1007/s10854-019-00767-6

By:

Javid, N. Shahamat;
Sayyadi, R.;
Khodabakhshi, F.

Publication type:

Article

Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1519, doi. 10.1007/s10854-018-0423-0

By:

Li, Yulong;
Wang, Zhiliang;
Li, Xuewen;
Hu, Xiaowu;
Lei, Min

Publication type:

Article

Structural, optical and excellent humidity sensing behaviour of ZnSnO3 nanoparticles: effect of annealing.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 10769, doi. 10.1007/s10854-018-9143-8

By:

Sharma, Alfa;
Kumar, Yogendra;
Shirage, Parasharam M.

Publication type:

Article

Structural relaxation and electrical conductivity of molybdovanadate glass.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2654, doi. 10.1007/s10854-017-8191-9

By:

Nishida, Tetsuaki;
Furumoto, Isao;
Fujita, Yuki;
Kubuki, Shiro;
Oka, Nobuto

Publication type:

Article

Dynamics of radio-photoluminescence and thermally-stimulated luminescence in KBr:Sm.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 15980, doi. 10.1007/s10854-017-7496-z

By:

Okada, Go;
Fujimoto, Yutaka;
Tanaka, Hironori;
Kasap, Safa;
Yanagida, Takayuki

Publication type:

Article

Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 °C.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12606, doi. 10.1007/s10854-017-7085-1

By:

Liu, Xiangdong;
Zhou, Shiqi;
Nishikawa, Hiroshi

Publication type:

Article

Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12617, doi. 10.1007/s10854-017-7086-0

By:

Pun, Kelvin;
Islam, M.;
Cheung, Chee;
Chan, Alan

Publication type:

Article

Effect of isothermal aging on microstructure, electrical resistivity and damping properties of Sn-Ag-Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9363, doi. 10.1007/s10854-017-6675-2

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

High temperature MEMS packages: die-attach solutions for LiNbO under low bonding pressures.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8784, doi. 10.1007/s10854-017-6605-3

By:

Roshanghias, Ali;
Bruckner, Gudrun;
Binder, Alfred

Publication type:

Article

Interfacial microstructure evolution and shear behavior of Au-12Ge/Ni solder joints during isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3685, doi. 10.1007/s10854-016-5974-3

By:

Ma, Yunzhu;
Wu, Tong;
Liu, Wensheng;
Huang, Yufeng;
Tang, Siwei;
Wang, Yikai

Publication type:

Article

Physical properties of SnO thin films prepared by isothermal oxidation of vacuum evaporated Sn.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 3, p. 2481, doi. 10.1007/s10854-016-5821-6

By:

Kabir, A.;
Boulainine, D.;
Bouanane, I.;
Schmerber, G.;
Boudjema, B.

Publication type:

Article

Comparative study on the wettability and interfacial structure in Sn-xZn/Cu and Sn/Cu-xZn system.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1631, doi. 10.1007/s10854-016-5705-9

By:

Wang, Fengjiang;
Li, Dongyang;
Wang, Jiheng;
Wang, Xiaojing;
Dong, Changhui

Publication type:

Article

Gold and silver diffusion in germanium: a thermodynamic approach.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1966, doi. 10.1007/s10854-016-5750-4

By:

Panayiotatos, Y.;
Vovk, R.;
Chroneos, A.

Publication type:

Article

Substrate temperature dependent structural, optical, morphology and electrical properties of RF sputtered CdTe thin films for solar cell application.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12405, doi. 10.1007/s10854-016-5149-2

By:

Kulkarni, Rupali;
Pawbake, Amit;
Waykar, Ravindra;
Jadhavar, Ashok;
Rokade, Avinash;
Rondiya, Sachin;
Karpe, Smita;
Diwate, Kiran;
Funde, Adinath;
Sharma, Vidhika;
Lonkar, Ganesh;
Jadkar, Sandesh

Publication type:

Article

Effect of substrate temperature on nebulized spray pyrolysised InS thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4437, doi. 10.1007/s10854-016-4315-x

By:

Raj Mohamed, J.;
Sanjeeviraja, C.;
Amalraj, L.

Publication type:

Article

The effect of annealing temperature on resistive switching behaviors of HfO film.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6699, doi. 10.1007/s10854-015-3272-0

By:

Guo, Tingting;
Tan, Tingting;
Liu, Zhengtang

Publication type:

Article

Bismuth layer-structured piezoelectric ceramics with high piezoelectric constant and high temperature stability.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 5686, doi. 10.1007/s10854-015-3120-2

By:

Ji, Wanbin;
Chu, Ruiqing;
Xu, Zhijun;
Hao, Jigong;
Cheng, Renfei;
Chen, Xueyan;
Xu, Yan

Publication type:

Article

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4954, doi. 10.1007/s10854-014-2257-8

By:

Liu, Yang;
Yuan, Cadmus;
Zhang, Guoqi;
Meerwijk, Joost;
Luo, Liangliang;
Zhang, Honglin;
Sun, Fenglian

Publication type:

Article

Influence of TiO nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO solder joints during isothermal aging process.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 981, doi. 10.1007/s10854-013-1675-3

By:

Tang, Y.;
Li, G.;
Chen, D.;
Pan, Y.

Publication type:

Article

Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3

By:

Hu, Xiaowu;
Ke, Zunrong

Publication type:

Article

Microstructure and interface evolution of Sn-2.5Bi-1.4In-1Zn-0.3Ag/Cu joint during isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 4122, doi. 10.1007/s10854-013-1370-4

By:

Zhou, Zhihui;
Liu, Yongchang;
Dong, Mingjie;
Gao, Zhiming;
Li, Huijun

Publication type:

Article

Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1231, doi. 10.1007/s10854-012-0912-5

By:

Li, Xiaoyun;
Zu, Fangqiu;
Huang, Zhongyue;
Wang, Chong;
Zhang, Wenjin

Publication type:

Article

Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 644, doi. 10.1007/s10854-012-0783-9

By:

Laurila, T.;
Karppinen, J.;
Li, J.;
Vuorinen, V.;
Paulasto-Kröckel, M.

Publication type:

Article

Detailed thermal analysis of crystallization kinetics and band morphology for future blending of absorbable poly(p‐dioxanone) monofilament surgical suture with poly(ε‐caprolactone).

Published in:

Polymer International, 2021, v. 70, n. 5, p. 648, doi. 10.1002/pi.6150

By:

Mamun, Al

Publication type:

Article

Oxidation behavior of alloy HK40 in H2H2O atmosphere.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2013, v. 64, n. 9, p. 777, doi. 10.1002/maco.201106336

By:

Shao, M.‐Z.;
Cui, L.‐S.;
Zheng, Y.‐J.;
Wang, Y.‐X.;
Xing, L.‐L.

Publication type:

Article

Optimizing hot forging parameters for gas turbine blade formation: a comprehensive study.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1563, doi. 10.1007/s00170-024-13825-z

By:

Javid, Youness

Publication type:

Article

Optimization strategy for the indirect isothermal extrusion of high-strength aluminum alloy based on temporal fusion transformer.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 126, n. 11/12, p. 5179, doi. 10.1007/s00170-023-11370-9

By:

Guo, Ce;
Qiao, Jisen;
Wang, Wenyan;
Sun, Dong-Zhi;
Li, Qilun

Publication type:

Article

A new process chain combining cross-wedge rolling and isothermal forging for the forming of titanium alloy turbine blades.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 5/6, p. 1827, doi. 10.1007/s00170-020-05451-2

By:

Li, Junling;
Wang, Baoyu;
Fang, Shuang;
Chen, Ping

Publication type:

Article

Uncertainty analysis and multi-objective billet robust optimization for transitional region of multi-rib component under isothermal local loading forming.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 97, n. 1-4, p. 1165, doi. 10.1007/s00170-018-2000-3

By:

Wei, Ke;
Fan, Xiaoguang;
Zhan, Mei;
Zeng, Xiang;
Jiang, Xueqi

Publication type:

Article

Hot forging process design, microstructure, and mechanical properties of cast Mg-Zn-Y-Zr magnesium alloy tank cover.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 94, n. 9-12, p. 4199, doi. 10.1007/s00170-017-1146-8

By:

Xiangsheng Xia;
Lu Xiao;
Qiang Chen;
Hui Li;
Yanjiang Tan

Publication type:

Article

Kink Wave Propagation in Thin Isothermal Magnetic Flux Tubes.

Published in:

Solar Physics, 2014, v. 289, n. 8, p. 3033, doi. 10.1007/s11207-014-0520-z

By:

Lopin, I.;
Nagorny, I.;
Nippolainen, E.

Publication type:

Article