Works about ISOSTATIC pressing
1
- Polymer Engineering & Science, 2004, v. 44, n. 10, p. 1848, doi. 10.1002/pen.20186
- Gul, Rizwan M.;
- McGarry, Frederick J.
- Article
2
- Polymer Engineering & Science, 2001, v. 41, n. 7, p. 1292, doi. 10.1002/pen.10829
- Yu, Yishan;
- White, James L.
- Article
3
- Polymer Engineering & Science, 1999, v. 39, n. 9, p. 1661, doi. 10.1002/pen.11560
- Incarnato, Loredana;
- Scarfato, Paola
- Article
4
- Surface Engineering, 2018, v. 34, n. 12, p. 955, doi. 10.1080/02670844.2018.1434959
- Huang, Xina;
- Lang, Lihui;
- Xu, Wencai;
- Meng, Fandi
- Article
5
- Surface Engineering, 2007, v. 23, n. 4, p. 267, doi. 10.1179/174329407X215069
- Mudali, U. Kamachi;
- Sridhar, T. M.;
- Rajendran, N.
- Article
6
- Surface Engineering, 2005, v. 21, n. 1, p. 12, doi. 10.1179/174329405X41307
- Article
7
- Surface Engineering, 2003, v. 19, n. 3, p. 229, doi. 10.1179/026708403225006212
- Article
8
- Advanced Functional Materials, 2016, v. 26, n. 17, p. 2940, doi. 10.1002/adfm.201505190
- Esaki, Yu;
- Matsushima, Toshinori;
- Adachi, Chihaya
- Article
9
- Advanced Functional Materials, 2014, v. 24, n. 22, p. 3392, doi. 10.1002/adfm.201302845
- Taylor, Nathan J.;
- Pottebaum, Andrew J.;
- Uz, Veli;
- Laine, Richard M.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2753, doi. 10.1007/s10854-021-07481-2
- Bacherikov, Yuriy Yu.;
- Lytvyn, Petro M.;
- Mamykin, Sergii V.;
- Okhrimenko, Olga B.;
- Ponomarenko, Valentyna V.;
- Malyuta, Serhiy V.;
- Doroshkevich, Aleksandr S.;
- Danilenko, Igor A.;
- Gorban, Oksana A.;
- Gilchuk, Andrii;
- Baiova, Yana;
- Lyubchyk, Andriy
- Article
11
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1480, doi. 10.1007/s10854-021-07656-x
- Guo, Fen;
- Li, Tuo;
- Man, Hong Tao;
- Liu, Kai;
- Zou, Xiao Feng;
- Wang, Xiao Liang
- Article
12
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2459, doi. 10.1007/s10854-019-02783-y
- Jiang, Lipeng;
- Li, Dongxu;
- Li, Wenjiang;
- Song, Zilin;
- Yang, Jianchun;
- Guo, Li;
- Tian, Zhirui;
- Liu, Xiaohua;
- Li, Jianming
- Article
13
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 11769, doi. 10.1007/s10854-017-6982-7
- Kilinc, Enes;
- Demirci, Selim;
- Uysal, Fatih;
- Celik, Erdal;
- Kurt, Huseyin
- Article
14
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 7854, doi. 10.1007/s10854-017-6482-9
- Gan, Lin;
- Zhu, Lin-Lin;
- Park, Young-Jo;
- Go, Shin-Il;
- Kim, Ha-Neul;
- Kim, Jin-Myung;
- Ko, Jae-Woong
- Article
15
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 3, p. 3052, doi. 10.1007/s10854-016-5892-4
- Liu, Fei;
- Qu, Jingjing;
- Yuan, Changlai;
- Chen, Guohua;
- Qin, Panpan;
- Huang, Xianpei
- Article
16
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7823, doi. 10.1007/s10854-015-3431-3
- Zhang, Biao;
- Ye, Feng;
- Liu, Shichao;
- Liu, Qiang;
- Gao, Ye
- Article
17
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3757, doi. 10.1007/s10854-015-2899-1
- Kumar, Ajeet;
- Bhanu Prasad, V.;
- James Raju, K.;
- James, A.
- Article
18
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2493, doi. 10.1007/s10854-015-2711-2
- Doan, Thi;
- Lebey, Thierry;
- Forest, François;
- Meynard, Thierry;
- Valdez-Nava, Zarel
- Article
19
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1116, doi. 10.1007/s10854-012-0891-6
- Zhong, Hui;
- Xiao, Zhanfei;
- Yang, Jie;
- Jiao, Xiangquan;
- Wang, Hualei;
- Shi, Yu
- Article
20
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1287, doi. 10.1007/s10854-012-0921-4
- Xue, Xiaomei;
- Yu, Hongtao;
- Xu, Guangliang
- Article
21
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1081, doi. 10.1007/s10854-012-0883-6
- Li, Shaochun;
- Zhang, Qilong;
- Zhao, Tiejun;
- Jin, Zuquan;
- Geng, Yongjuan
- Article
22
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1332, doi. 10.1007/s10854-012-0929-9
- Sakamoto, Soichi;
- Sugahara, Tohru;
- Suganuma, Katsuaki
- Article
23
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 987, doi. 10.1007/s10854-012-0863-x
- Fu, Qiu-yun;
- Qin, Yu-xiang;
- Zhou, Dong-xiang;
- Hu, Yun-xiang;
- Xie, Zhen-zhen
- Article
24
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 1012, doi. 10.1007/s10854-012-0868-5
- Article
25
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 628, doi. 10.1007/s10854-012-0777-7
- Yang, Wendong;
- Liu, Chunyan;
- Zhang, Zhiying;
- Liu, Yun;
- Nie, Shidong
- Article
26
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 649, doi. 10.1007/s10854-009-9971-7
- Dunmin Lin;
- Qiaoji Zheng;
- Kwok, K. W.;
- Chenggang Xu;
- Chun Yang
- Article
27
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 656, doi. 10.1007/s10854-009-9972-6
- Qing Zhi Shi;
- Ze Sheng Yan
- Article
28
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 302, doi. 10.1007/s10854-009-9910-7
- Shigyo, Tatsuhiro;
- Itoh, Hidenobu;
- Takahashi, Junichi
- Article
29
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1186, doi. 10.1007/s10854-008-9849-0
- Jiao Li;
- Wu Songping;
- Ding Xiaohong;
- Ni Jing
- Article
30
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1140, doi. 10.1007/s10854-008-9840-9
- Ruzhong Zuo;
- Hongqiang Wang;
- Bing Ma;
- Longtu Li
- Article
31
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 149, doi. 10.1007/s10854-008-9673-6
- Freire, F. N. A.;
- Santos, M. R. P.;
- Pereira, F. M. M.;
- Sohn, R. S. T. M.;
- Almeida, J. S.;
- Medeiros, A. M. L.;
- Sancho, E. O.;
- Costa, M. M.;
- Sombra, A. S. B.
- Article
32
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 12, p. 1153, doi. 10.1007/s10854-007-9503-2
- Rejini, R.;
- Subodh, G.;
- Sebastian, M. T.
- Article
33
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 11, p. 1100, doi. 10.1007/s10854-007-9475-2
- Prasanth, N. P.;
- Varghese, Justin M.;
- Prasad, K.;
- Krishnan, Bindu;
- Seema, A.;
- Dayas, K. R.
- Article
34
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 1012, doi. 10.1007/s10854-007-9443-x
- Sprio, S.;
- Rinaldi, D.;
- Celotti, G.;
- Pialorsi, E.;
- Tampieri, A.
- Article
35
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 1000, doi. 10.1007/s10854-007-9439-6
- Zou, Dong;
- Zhang, Qilong;
- Yang, Hui;
- Ma, Manchang
- Article
36
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 505, doi. 10.1007/s10854-007-9371-9
- Shunhua Wu;
- Shuang Wang;
- Liying Chen;
- Xiaoyong Wang
- Article
37
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 271, doi. 10.1007/s10854-007-9281-x
- Article
38
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 12, p. 1247, doi. 10.1007/s10854-007-9136-5
- Sulepetkar, S. T.;
- Raibagkar, Ravindra L.
- Article
39
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 12, p. 1211, doi. 10.1007/s10854-007-9135-6
- Lokare, S. A.;
- Devan, R. S.;
- Patil, D. R.;
- Chougule, B. K.
- Article
40
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 12, p. 1179, doi. 10.1007/s10854-007-9369-3
- En-Hui Liu;
- Rui Ding;
- Xiang-Yun Meng;
- Song-Ting Tan;
- Ji-Cheng Zhou
- Article
41
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 12, p. 1253, doi. 10.1007/s10854-007-9283-8
- Article
42
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1031, doi. 10.1007/s10854-007-9133-8
- Article
43
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 9, p. 957, doi. 10.1007/s10854-007-9313-6
- Cavenaghi, José M.;
- Molisani, André L.;
- Yoshimura, Humberto N.;
- de Sousa, Vânia Caldas
- Article
44
- Biotechnology Letters, 2002, v. 24, n. 15, p. 1295, doi. 10.1023/A:1016222328138
- Beshay, Usama;
- Abd-El-Haleem, Desouky;
- Moawad, Hassan;
- Zaki, Sahar
- Article
45
- 2025
- Ganta, Mihiretu Gezahagn;
- Kurek, Marta
- Literature Review
46
- International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 3, p. 1545, doi. 10.1007/s00170-024-14882-0
- Cummings, Christine M.;
- Corbin, David J.;
- Reutzel, Edward W.;
- Keist, Jayme S.;
- Overdorff, Ryan;
- Nassar, Abdalla R.
- Article
47
- International Journal of Advanced Manufacturing Technology, 2024, v. 135, n. 11, p. 5925, doi. 10.1007/s00170-024-14856-2
- Bijjala, Surya T.;
- Wilkerson, Ryan;
- Beamer, Chad;
- Kumar, Pankaj
- Article
48
- International Journal of Advanced Manufacturing Technology, 2024, v. 135, n. 5/6, p. 2355, doi. 10.1007/s00170-024-14649-7
- Paul, Sourabh;
- Smith, Patrick J.;
- Mumtaz, Kamran
- Article
49
- International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 5/6, p. 2373, doi. 10.1007/s00170-024-14030-8
- Sobhani, Samaneh;
- Gandy, David;
- Albert, Marc;
- Tabei, Ali;
- Fan, Zhaoyan
- Article
50
- International Journal of Advanced Manufacturing Technology, 2023, v. 126, n. 9/10, p. 3861, doi. 10.1007/s00170-023-11376-3
- Su, Shaohua;
- Hong, Zijian;
- Wu, Yongjun;
- Wang, Peng;
- Li, Xiaobao;
- Wu, Junwen;
- Huang, Yuhui
- Article