Works about INTERMETALLIC compounds

Results: 4294

Exploring the Effect of Carbon Addition on the Mechanical and Thermal Behavior of Cu-11Al-5Ni Shape Memory Alloy.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4807, doi. 10.1007/s11837-025-07313-2

By:

El-Tahawy, M.;
Soliman, H. N.;
Hammad, A. E.;
Amin, M.

Publication type:

Article

Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4215, doi. 10.1007/s11837-025-07269-3

By:

Lin, Wei-Ting;
Li, Kelvin;
Lin, Kuo-Shu;
Wang, Chang-Meng;
Wu, Albert T.

Publication type:

Article

Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4206, doi. 10.1007/s11837-025-07268-4

By:

Shen, Yu-An;
Chen, Fang-Yu;
Gao, Ruhuna;
Ho, Cheng-En;
Nishikawa, Hiroshi;
Chen, Chih-Ming

Publication type:

Article

The Rate-Dependent Shear Performance of Ni-Stabilized SAC/Cu Joints Under Isothermal Aging.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4173, doi. 10.1007/s11837-025-07209-1

By:

Li, Quanzhen;
Li, Chengming;
Wang, Xiaojing;
Cai, Shanshan;
Liu, Ning;
Liu, Chen;
Sun, Shaofu

Publication type:

Article

Thermodynamics and Kinetics of Preparation of Y-Containing Magnesium Alloy by Calciothermic Reduction in Mg–Ca Melt.

Published in:

Metallurgical & Materials Transactions. Part B, 2025, v. 56, n. 3, p. 2332, doi. 10.1007/s11663-025-03488-w

By:

Ren, Liang;
Le, Qichi;
Gao, Shutang;
Wei, Xifeng;
Yin, Zhaoyang;
Liao, Qiyu;
Li, Yinglong

Publication type:

Article

Effect of Laser Processing Parameters on the Quality of Titanium Alloy Cladding Layer on Carbon Fiber-Reinforced Polymer.

Published in:

Polymers (20734360), 2025, v. 17, n. 9, p. 1195, doi. 10.3390/polym17091195

By:

Li, Jiayan;
Su, Xuan;
Wang, Fenxiang;
Zhang, Donghe;
Wang, Yingke;
Song, Haoran;
Xu, Jie;
Guo, Bin

Publication type:

Article

Evolution of Phase Transformations in the Mg-Ni-Ce System After Mechanical Synthesis and Spark Plasma Sintering.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 2131, doi. 10.3390/ma18092131

By:

Mukhamedova, Nuriya Meiramkanovna;
Miniyazov, Arman Zhanarbekovich;
Zhanbolatova, Gainiya Kaiyrdykyzy;
Ospanova, Zhanna Nurbolatovna;
Sabyrtayeva, Aisara Askhatkyzy;
Shaikieva, Karina Serikkyzy

Publication type:

Article

Fabrication and Properties of Zn-Containing Intermetallic Compounds as Sacrificial Anodes of Zn-Based Implants.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 2057, doi. 10.3390/ma18092057

By:

Li, Kelei;
Li, Junwei;
Wang, Tiebao;
Wang, Xin;
Qi, Yumin;
Zhao, Lichen;
Cui, Chunxiang

Publication type:

Article

Study on the Influence of Nickel Plating on the Structure and Properties of Aluminum/Steel Bimetallic Bonding.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 1898, doi. 10.3390/ma18091898

By:

Zhang, Yufei;
Zhang, Guowei;
Wang, Mingjie;
Xu, Hong

Publication type:

Article

The influence of aluminum alloying on microstructure, phase composition, and mechanical properties of chromium-nickel steel obtained by electron-beam additive manufacturing.

Published in:

Russian Physics Journal, 2025, v. 68, n. 2, p. 199, doi. 10.1007/s11182-025-03419-x

By:

Astafurov, S. V.;
Astafurova, E. G.;
Zagibalova, E. A.;
Luchin, A. V.;
Kolubaev, E. A.

Publication type:

Article

Ordering Degree Regulation of Pt2 NiCo Intermetallics for Efficient Oxygen Reduction Reaction.

Published in:

Journal of Electrochemistry, 2025, v. 31, n. 4, p. 1, doi. 10.61558/2993-074X.3519

By:

Chen-Hao Zhang;
Han-Yu Hu;
Jun-Hao Yang;
Qian Zhang;
Chang Yang;
De-Li Wang

Publication type:

Article

Investigation of Sn–3.0Ag–0.5Cu Bump Arrays Prepared by the Pulsated Orifice Ejection Method.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402605

By:

Dong, Wei;
Liu, Jianing;
Liu, Haoyang;
Xu, Fumin

Publication type:

Article

Laser cladding Al/Ni composite coating and its tribology performance.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 266, doi. 10.1177/02670844241309306

By:

Zhang, Guangliang;
Ren, Zhichao;
Hou, Yuanyuan;
Zheng, Hongyu

Publication type:

Article

Development of reflective co-sputtered nanostructured metallic films.

Published in:

Surface Engineering, 2021, v. 37, n. 3, p. 400, doi. 10.1080/02670844.2020.1781376

By:

Prajwal, K.;
Priyanka, G. L.;
Hasan, Mohammed Adnan;
Carmel Mary Esther, A.;
Sridhara, N.;
Rajendra, A.;
Arya, S. B.;
Dey, Arjun

Publication type:

Article

Effect of annealing temperature on the thermal stability of FeCrNiMnMoxSi0.5B0.5 coatings.

Published in:

Surface Engineering, 2019, v. 35, n. 11, p. 962, doi. 10.1080/02670844.2019.1587141

By:

Zhu, Ying;
Guo, Xiong Ya;
Liu, Cheng Wen;
Zhou, Fang;
Liu, Bin Qi

Publication type:

Article

Surface mechanical coating of Cu plate by Cu Al powders.

Published in:

Surface Engineering, 2018, v. 34, n. 12, p. 926, doi. 10.1080/02670844.2018.1430010

By:

Farahbakhsh, Iman;
Mashimo, Tsutomu

Publication type:

Article

Processing and properties of CuAl 2 intermetallic coatings.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 186, doi. 10.1080/02670844.2016.1220733

By:

Abbasi, M.;
Verdian, M. M.

Publication type:

Article

Hardness-load modelling applied to multilayer galvanised coatings.

Published in:

Surface Engineering, 2016, v. 32, n. 3, p. 194, doi. 10.1080/02670844.2015.1116802

By:

Benarioua, Y.;
Mejias, A.;
Roudet, F.;
Iost, A.;
Chicot, D.

Publication type:

Article

Coating formation, fracture mode and cavitation performance of Fe40Al deposited by cold gas spraying.

Published in:

Surface Engineering, 2015, v. 31, n. 11, p. 853, doi. 10.1179/1743294414Y.0000000420

By:

Cinca, N.;
List, A.;
Gärtner, F.;
Guilemany, J. M.;
Klassen, T.

Publication type:

Article

Wear and electrochemical behaviour of Mg-Al intermetallic coating.

Published in:

Surface Engineering, 2014, v. 30, n. 12, p. 933, doi. 10.1179/1743294414Y.0000000257

By:

Li, Y.-G.;
Wei, Y.-H.;
Hou, L.-F.;
Guo, C.-L.;
Han, P.-J.

Publication type:

Article

Effect of La on intermetallic layer of galvalume.

Published in:

Surface Engineering, 2013, v. 29, n. 5, p. 390, doi. 10.1179/1743294413Y.0000000128

By:

Lai, X F;
Peng, H P;
Wang, J H;
Wu, C J;
Tu, H;
Liu, Y;
Su, X P

Publication type:

Article

Manganese enriched diffusion layers on NiAl alloy.

Published in:

Surface Engineering, 2006, v. 22, n. 3, p. 197, doi. 10.1179/174329406X108825

By:

Bartuška, P.;
Lašek, J.;
Paidar, V.

Publication type:

Article

Pulsed plasma nitrided Nb alloyed Mo3Si intermetallic alloy.

Published in:

Surface Engineering, 2005, v. 21, n. 2, p. 139, doi. 10.1179/174329405X40894

By:

Martínez, H.;
Rosales, I.

Publication type:

Article

ALUMINIUM ENRICHED DIFFUSION LAYERS ON NiAl alloy.

Published in:

Surface Engineering, 2003, v. 19, n. 3, p. 185

By:

Bartuška, P.;
Lašek, J.;
Paidar, V.

Publication type:

Article

Hydrogen Sorption Characteristics of ZrCrAl Ternary Alloy as a Function of Milling Time.

Published in:

Macromolecular Symposia, 2017, v. 376, n. 1, p. n/a, doi. 10.1002/masy.201700047

By:

Agarwal, Shivani;
Mangal, R. K.;
Kumar, Manoj;
Awasthi, Kamlendra;
Kumar, Sanjay;
Jain, Ankur

Publication type:

Article

Mn+Sb2O3 Thermite/Intermetallic Delay Compositions.

Published in:

Propellants, Explosives, Pyrotechnics, 2016, v. 41, n. 5, p. 919, doi. 10.1002/prep.201600007

By:

Montgomery, Yolandi C.;
Focke, Walter W.;
Atanasova, Maria;
Del Fabbro, Olinto;
Kelly, Cheryl

Publication type:

Article

Transition from Impact-induced Thermal Runaway to Prompt Mechanochemical Explosion in Nanoscaled Ni/Al Reactive Systems.

Published in:

Propellants, Explosives, Pyrotechnics, 2013, v. 38, n. 5, p. 611, doi. 10.1002/prep.201200193

By:

Reeves, Robert V.;
Mukasyan, Alexander S.;
Son, Steven F.

Publication type:

Article

Structural Complexity in the Apparently Simple Crystal Structure of Be2Ru.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 33, p. 1, doi. 10.1002/chem.202300578

By:

Agnarelli, Laura;
Prots, Yurii;
Ormeci, Alim;
Ramlau, Reiner;
Krnel, Mitja;
Svanidze, Eteri;
König, Markus;
Schmidt, Marcus;
Burkhardt, Ulrich;
Leithe‐Jasper, Andreas;
Grin, Yuri

Publication type:

Article

Intermetallic Compound TiM (M=Co, Fe) with a Layered Structure Prepared by Deoxidizing Ilmenite‐type Oxides in Molten LiCl‐CaH2 Mixtures.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 32, p. 1, doi. 10.1002/chem.202300194

By:

Kobayashi, Yasukazu;
Nagaura, Tomota;
Alowasheeir, Azhar;
Tada, Shohei;
Yamauchi, Yusuke

Publication type:

Article

C−H and Si−H Activation Reactions at Ru/Ga Complexes: A Combined Experimental and Theoretical Case Study on the Ru−Ga Bond.

Published in:

Chemistry - A European Journal, 2022, v. 28, n. 54, p. 1, doi. 10.1002/chem.202200887

By:

Muhr, Maximilian;
Bühler, Raphael;
Liang, Hao;
Gilch, Jonas;
Jandl, Christian;
Kahlal, Samia;
Saillard, Jean‐Yves;
Gemel, Christian;
Fischer, Roland A.

Publication type:

Article

Discovering a Dual-Buffer Effect for Lithium Storage: Durable Nanostructured Ordered Mesoporous Co-Sn Intermetallic Electrodes.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 17, p. 2800, doi. 10.1002/adfm.201600121

By:

Park, Gwi Ok;
Yoon, Jeongbae;
Shon, Jeong Kuk;
Choi, Yun Seok;
Won, Jong Gu;
Park, Su Bin;
Kim, Kyoung Ho;
Kim, Hansu;
Yoon, Won‐Sub;
Kim, Ji Man

Publication type:

Article

Ultrafast and Highly Reversible Sodium Storage in Zinc-Antimony Intermetallic Nanomaterials.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 4, p. 543, doi. 10.1002/adfm.201504461

By:

Nie, Anmin;
Gan, Li‐yong;
Cheng, Yingchun;
Tao, Xinyong;
Yuan, Yifei;
Sharifi‐Asl, Soroosh;
He, Kun;
Asayesh‐Ardakani, Hasti;
Vasiraju, Venkata;
Lu, Jun;
Mashayek, Farzad;
Klie, Robert;
Vaddiraju, Sreeram;
Schwingenschlögl, Udo;
Shahbazian‐Yassar, Reza

Publication type:

Article

Mesostructured Intermetallic Compounds of Platinum and Non-Transition Metals for Enhanced Electrocatalysis of Oxygen Reduction Reaction.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 2, p. 230, doi. 10.1002/adfm.201401868

By:

Lang, Xing‐You;
Han, Gao‐Feng;
Xiao, Bei‐Bei;
Gu, Lin;
Yang, Zhen‐Zhong;
Wen, Zi;
Zhu, Yong‐Fu;
Zhao, Ming;
Li, Jian‐Chen;
Jiang, Qing

Publication type:

Article

Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10124-3

By:

Tang, Chu;
Chen, Zhuo;
Zhu, Wenhui

Publication type:

Article

Effect of Pr substitution for Nd on structure, magnetic transitions, and magnetocaloric effect in Nd7−xPrxPd3 intermetallic compounds.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10085-7

By:

Sun, N.;
Ruan, J. F.;
Wu, X. F.;
Du, Y. S.;
Fu, G.;
Ma, L.;
Li, L.;
Cheng, G.;
Wang, J.;
Zhao, J. T.;
Rao, G. H.

Publication type:

Article

Influence of Ti substitution on magnetic and magnetocaloric properties of Pr2Fe17-xTix intermetallic compounds.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09622-7

By:

Cengiz, N. E.;
Pektas, M.;
Kaya, A. O.;
Bayri, N.;
Izgi, T.;
Gencer, H.;
Kolat, V. S.;
Atalay, S.

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09590-y

By:

Chen, Huifeng;
Liu, Yang;
Zhang, Shuang;
Cao, Rongxing;
Xue, Yuxiong

Publication type:

Article

Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09502-0

By:

Han, Jing;
Meng, Zhou;
Jin, Xuelun;
Ma, Limin;
Guo, Fu;
Wang, Yishu;
Zhou, Wei;
An, Tong

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25753, doi. 10.1007/s10854-022-09268-5

By:

Peng, Xianwen;
Wang, Yue;
Ye, Zheng;
Huang, Jihua;
Yang, Jian;
Chen, Shuhai;
Zhao, Xingke

Publication type:

Article

Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25580, doi. 10.1007/s10854-022-09256-9

By:

Yeh, C. Y.;
Wang, J. Y.;
Wu, C. Y.;
Chiu, C. Y.;
Lee, C. H.;
Huang, B. R.;
Fu, K. L.;
Chang, J. S.;
Yen, T. H.;
Lee, Y. F.;
Liu, C. Y.

Publication type:

Article

Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25274, doi. 10.1007/s10854-022-09234-1

By:

Huang, M. L.;
Zou, L.;
Wu, Y.

Publication type:

Article

Indium thermal interface material microstructure as a function of thermal history and bonding metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22810, doi. 10.1007/s10854-022-09048-1

By:

McClure, Peter;
Wang, Yujia

Publication type:

Article

Investigation on the microstructure, phase formation and properties of aluminium alloy coatings by stud spraying.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22256, doi. 10.1007/s10854-022-09004-z

By:

Zhao, Xilong;
Lu, Xinhong;
Wang, Kun;
He, Feng

Publication type:

Article

Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21127, doi. 10.1007/s10854-022-08917-z

By:

Ahn, Byeongjin;
Kim, Jahyeon;
Cheon, Gyeong-Yeong;
Lee, Tae-Ik;
Park, Young-Bae;
Kim, Jungsoo;
Ko, Yong-Ho

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16700, doi. 10.1007/s10854-022-08567-1

By:

Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14249, doi. 10.1007/s10854-022-08353-z

By:

Amli, S. F. Muhd;
Salleh, M. A. A. Mohd;
Ramli, M. I. I.;
Aziz, M. S. Abdul;
Yasuda, H.;
Chaiprapa, J.;
Nogita, K.

Publication type:

Article

Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14240, doi. 10.1007/s10854-022-08352-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.

Publication type:

Article