Works matching DE "INTERFACIAL reactions"

Results: 873

Rekindling hopes for lithium-sulfur batteries.

Published in:

National Science Review, 2025, v. 12, n. 4, p. 1, doi. 10.1093/nsr/nwaf079

By:

Qu, Hongtao;
Su, Bao-Lian

Publication type:

Article

PtRu Intra‐Cluster Electron Modulation Accelerates Multi‐Scenario Hydrogen Evolution Reaction.

Published in:

Advanced Energy Materials, 2025, v. 15, n. 19, p. 1, doi. 10.1002/aenm.202405828

By:

Zhao, Xue;
Jiang, Yaling;
Wang, Dan;
Zhang, Yicheng;
Chen, Mengshan;
Hu, Guangzhi;
Zhang, Haibo;
Jin, Zhong;
Zhou, Yingtang

Publication type:

Article

Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4161, doi. 10.1007/s11837-025-07204-6

By:

Wang, Chao-hong;
Li, Yue-han

Publication type:

Article

Experimental Study on Thermokinetics of Hydrogen Enrichment and Release In X17CrNi16-2 Stainless Steel Melts.

Published in:

Metallurgical & Materials Transactions. Part B, 2025, v. 56, n. 3, p. 2277, doi. 10.1007/s11663-024-03425-3

By:

Li, Wei;
Liu, Jianhua;
Zhang, Jie;
Yan, Baijun;
He, Yang;
Zhang, Yudi;
Qu, Yuweng

Publication type:

Article

Consolidating Surface Lattice via Facile Self‐Anchored Oxygen Layer Reconstruction Toward Superior Performance and High Safety Nickel‐Rich Oxide Cathodes.

Published in:

Advanced Functional Materials, 2025, v. 35, n. 20, p. 1, doi. 10.1002/adfm.202422806

By:

Wang, Haoyu;
Shi, Qi;
Dong, Jinyang;
Wang, Meng;
Lu, Yun;
Liu, Yun;
Liu, Jinzhong;
Li, Ning;
Huang, Qing;
Su, Yuefeng;
Wu, Feng;
Chen, Lai

Publication type:

Article

Investigation on the Interfaces in Organic Devices by Photoemission Spectroscopy.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 9, p. 680, doi. 10.3390/nano15090680

By:

Xie, Haipeng;
Cheng, Xianjun;
Huang, Han

Publication type:

Article

Utilizing Fly Ash from Coal-Fired Power Plants to Join ZrO 2 and Crofer by Reactive Air Brazing.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 1956, doi. 10.3390/ma18091956

By:

Chang, Shu-Wei;
Shiue, Ren-Kae;
Huang, Liang-Wei

Publication type:

Article

Microstructure Evolution and Brazing Mechanism of AgCuTi Alloy Vacuum Brazed Corundum–Mullite Ceramic and Mo Joint.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402651

By:

Mingyuan, Zhao;
Sujuan, Zhong;
Jian, Qin;
Wei, Dong

Publication type:

Article

Multiscale interfacial stabilization via prelithiation separator engineering for Ah-level anode-free lithium batteries.

Published in:

Nature Communications, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41467-025-59521-8

By:

Shao, Ahu;
Wang, Helin;
Zhang, Min;
Liu, Jiacheng;
Cheng, Lu;
Li, Yunsong;
Guo, Yuxiang;
Wang, Zhiqiao;
Jia, Qiurong;
Wang, Xin;
Tang, Xiaoyu;
Zhao, Xiaodong;
Ma, Yue

Publication type:

Article

Monitoring and Accelerating Methods of Corrosion for Reinforced Concrete: A Review.

Published in:

Macromolecular Symposia, 2024, v. 413, n. 1, p. 1, doi. 10.1002/masy.202300010

By:

Nayak, Chittaranjan;
Disale, Anil;
Suryawanshi, Nagesh;
Jadhav, Nitin;
Jagdale, Umesh;
Bhoite, Gauri;
Thakare, Sunil;
Pandey, Shri Prakash

Publication type:

Article

Engineering Detrimental Functional Groups in Conductive Additives Toward High-Performance All-Solid-State Batteries.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 22, p. 1, doi. 10.1002/chem.202400074

By:

Li, Jianqing;
Xu, Daren;
Yao, Shiyu;
Du, Fei

Publication type:

Article

Dual Strategies with Anion/Cation Co‐Doping and Lithium Carbonate Coating to Enhance the Electrochemical Performance of Lithium‐Rich Layered Oxides.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 71, p. 1, doi. 10.1002/chem.202302569

By:

Chen, Huai;
Ma, Jun;
Liu, Fei;
Yao, Mengqin

Publication type:

Article

Wettability‐Regulated Synthesis of Metal–Organic Framework Array with Subnanochannels Enables Efficient Separation of Mono‐/Multivalent Metal Ions.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 39, p. 1, doi. 10.1002/chem.202301163

By:

Wu, Zihan;
Li, Chen;
Huang, Cheng;
Cheng, Sha;
Ouyang, Xiaozhi;
Chen, Wen;
Zhang, Pengchao;
Jiang, Yanan;
Jiang, Lei

Publication type:

Article

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0

By:

Gao, He;
Liu, Wei;
Wang, Chunqing

Publication type:

Article

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25753, doi. 10.1007/s10854-022-09268-5

By:

Peng, Xianwen;
Wang, Yue;
Ye, Zheng;
Huang, Jihua;
Yang, Jian;
Chen, Shuhai;
Zhao, Xingke

Publication type:

Article

Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25580, doi. 10.1007/s10854-022-09256-9

By:

Yeh, C. Y.;
Wang, J. Y.;
Wu, C. Y.;
Chiu, C. Y.;
Lee, C. H.;
Huang, B. R.;
Fu, K. L.;
Chang, J. S.;
Yen, T. H.;
Lee, Y. F.;
Liu, C. Y.

Publication type:

Article

Structure and properties of low-Ag SAC solders for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22668, doi. 10.1007/s10854-022-09091-y

By:

Lu, Xiao;
Zhang, Liang;
Xi, Wang;
Li, Mu-lan

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Phase evolution and dielectric properties of La2O3–B2O3–ZnO glass-ceramics/Al2O3 composites for LTCC substrates at high frequencies.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 15, p. 12436, doi. 10.1007/s10854-022-08201-0

By:

Chen, Xingyu;
Wang, Fenglin;
Guan, Yeqing;
Zhu, Xuelian;
Shi, Jiawen;
Mao, Haijun;
Li, Wei;
Zhang, Weijun

Publication type:

Article

Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 15, p. 12321, doi. 10.1007/s10854-022-08190-0

By:

Wang, Chao-hong;
Chang, Tai-Yu

Publication type:

Article

Design and fabrication of MoO3 nanoparticles incorporated PEDOT:PSS hybrid thin films for ITO-free organic solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11342, doi. 10.1007/s10854-022-08107-x

By:

Gurudevi, P.;
Venkateswari, P.;
Sivakumar, T.

Publication type:

Article

Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7983, doi. 10.1007/s10854-022-07948-w

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Study of the efficiency of g-C3N4-loaded P25 for photocatalytic degradation of malachite green in aqueous and Pickering emulsion systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5846, doi. 10.1007/s10854-022-07767-z

By:

Liu, Shihao;
Wang, Shi;
Lei, Chunsheng;
Li, Ruyi;
Feng, Siyang;
Jin, Qiyu

Publication type:

Article

Role of Ti in direct active bonding of SiC substrate using Sn–Ag–Ti alloy filler.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3331, doi. 10.1007/s10854-021-07533-7

By:

Cheng, L. X.;
Ma, K. B.;
Yue, X. J.;
Li, Z. L.;
Li, G. Y.

Publication type:

Article

Interfacial reaction and properties of Sn0.3Ag0.7Cu containing nano-TiN solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3320, doi. 10.1007/s10854-021-07532-8

By:

Sun, Lei;
Zhang, Liang;
Zhang, Yi;
Xu, Ye-xiang;
Zhang, Pei-xin;
Liu, Qi-hao;
Shan, Hao-jie

Publication type:

Article

Effect of Ni and TiO2 particle addition on the wettability and interfacial reaction of Sn20Bi lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3306, doi. 10.1007/s10854-021-07531-9

By:

Song, Qianqian;
Li, Yitai;
Yu, Jinli;
Qi, Da;
Qin, Weiou;
Zhan, Yongzhong

Publication type:

Article

Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 2957, doi. 10.1007/s10854-021-07494-x

By:

Shang, Min;
Dong, Chong;
Ma, Haoran;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Wetting behavior of eutectic Au–Sn solder on Ni/Au metallization at different temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 1774, doi. 10.1007/s10854-021-07227-0

By:

Wang, Jie;
Wu, Yiping;
Chen, Weimin;
Xie, Yangquan

Publication type:

Article

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 22, p. 26666, doi. 10.1007/s10854-021-07044-5

By:

Li, Mu-lan;
Gao, Li-li;
Zhang, Liang;
Jiang, Nan;
Zhong, Su-juan;
Zhang, Lei

Publication type:

Article

Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 20, p. 24790, doi. 10.1007/s10854-021-06936-w

By:

Back, Jong-Hoon;
Yoon, Jeong-Won

Publication type:

Article

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9

By:

Gui, Zixiao;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Yulong;
Wang, Haozhong

Publication type:

Article

Recent advances on SnBi low-temperature solder for electronic interconnections.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22731, doi. 10.1007/s10854-021-06820-7

By:

Jiang, Nan;
Zhang, Liang;
Gao, Li-Li;
Song, Xiao-Guo;
He, Peng

Publication type:

Article

Microstructure evolution of Cu/Sn58Bi/Cu solder joint bearing graphene nanosheets for 3D packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16970, doi. 10.1007/s10854-021-06261-2

By:

Jiang, Nan;
Zhang, Liang;
Gao, Li-li;
Long, Wei-min;
Zhong, Su-juan;
Zhang, Lei

Publication type:

Article

Effect of ultrasonic treatment on interfacial reactions and microstructure of SnCr/CuFeNiCoCr solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 15352, doi. 10.1007/s10854-021-06085-0

By:

Yang, Qing;
Hu, Xiaowu

Publication type:

Article

Phase characterization of interfacial reactions in the Ni/In/Cu ternary system.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 4, p. 4205, doi. 10.1007/s10854-020-05165-x

By:

Wang, Y. W.

Publication type:

Article

Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 3324, doi. 10.1007/s10854-020-05080-1

By:

Baek, Seungju;
Jeong, Gyu-Won;
Son, Jun-Hyuk;
Kim, Min-Su;
Lee, Han-Bo-Ram;
Kim, Jungsoo;
Ko, Yong-Ho

Publication type:

Article

Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 2655, doi. 10.1007/s10854-020-04755-z

By:

Xu, Kai-kai;
Zhang, Liang;
Jiang, Nan

Publication type:

Article

Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 19852, doi. 10.1007/s10854-020-04509-x

By:

Kim, Jungsoo;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15086, doi. 10.1007/s10854-020-04072-5

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Shuang

Publication type:

Article

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11470, doi. 10.1007/s10854-020-03695-y

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Zhang, Zhe;
Li, Qinglin

Publication type:

Article

Phase stabilities and interfacial reactions of the Cu–In binary systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10161, doi. 10.1007/s10854-020-03561-x

By:

Lin, Y. F.;
Hung, H. T.;
Yu, H. Y.;
Kao, C. R.;
Wang, Y. W.

Publication type:

Article

Microstructure characterization of Al2O3–Mullite–AlN multiphase ceramic film on Cr/WCu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5941, doi. 10.1007/s10854-020-03162-8

By:

Zhu, Jiandong;
Zheng, Zhen;
Wang, Chunqing;
Liu, Jianguo

Publication type:

Article

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6

By:

Sun, Fenglian;
Yin, Zuozhu

Publication type:

Article

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18462, doi. 10.1007/s10854-019-02200-4

By:

Sun, Lei;
Chen, Ming-he;
Zhang, Liang;
Xie, Lan-sheng;
Wei, Chun-chun

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12840, doi. 10.1007/s10854-019-01729-8

By:

Du, Yahong;
Wen, Ming;
Ji, Hongjun;
Li, Mingyu;
Liu, Zhi-Quan

Publication type:

Article

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12911, doi. 10.1007/s10854-019-01653-x

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article