Works matching DE "INTEGRATED circuits manufacturing"

Results: 76

An Improved YOLOv5 Model for Lithographic Hotspot Detection.

Published in:

Micromachines, 2025, v. 16, n. 5, p. 568, doi. 10.3390/mi16050568

By:

Lin, Mu;
He, Wenjing;
Liu, Jiale;
Li, Fencheng;
Luo, Jun;
Shen, Yijiang

Publication type:

Article

Experimental realization of electromigration at high power for copper wires.

Published in:

Journal of Energy Systems, 2019, v. 3, n. 4, p. 158, doi. 10.30521/jes.616982

By:

Mahariq, Ibrahim;
Berjozkina, Svetlana

Publication type:

Article

Simulation and experimental verification of silicon dioxide deposition by PECVD.

Published in:

Modern Physics Letters B, 2017, v. 31, n. 6, p. -1, doi. 10.1142/S0217984917500555

By:

Xu, Qing;
Li, Yu-Xing;
Li, Xiao-Ning;
Wang, Jia-Bin;
Yang, Fan;
Yang, Yi;
Ren, Tian-Ling

Publication type:

Article

Wetting metamorphosis of hydrophobic fluoropolymer coatings submerged in water and ultrasonically vibrated.

Published in:

Journal of Coatings Technology & Research, 2020, v. 17, n. 3, p. 633, doi. 10.1007/s11998-019-00250-1

By:

Trapuzzano, Matthew;
Crane, Nathan B.;
Guldiken, Rasim;
Tejada-Martínez, Andrés

Publication type:

Article

Efficient design of all-optical AND and OR logic gates using fluid infiltration in silicon-based photonic crystal platform.

Published in:

Optical & Quantum Electronics, 2023, v. 55, n. 10, p. 1, doi. 10.1007/s11082-023-05222-9

By:

Mokhtarbaf, Ali;
Saghaei, Hamed;
Mosleh, Mohammad;
Chekin, Mohsen

Publication type:

Article

Hardware Trojan Detection Leveraging a Novel Golden Layout Model Towards Practical Applications.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 4, p. 529, doi. 10.1007/s10836-019-05816-w

By:

Liu, Yanjiang;
He, Jiaji;
Ma, Haocheng;
Zhao, Yiqiang

Publication type:

Article

Activity Factor Based Hardware Trojan Detection and Localization.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 3, p. 293, doi. 10.1007/s10836-019-05803-1

By:

Tang, Yongkang;
Fang, Liang;
Li, Shaoqing

Publication type:

Article

Enhancing ceria slurry performance for shallow trench isolation chemical mechanical polishing through non-ionic surfactant addition.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 11/12, p. 4997, doi. 10.1007/s00170-023-12254-8

By:

Zhang, Lifei;
Xie, Lile;
Lu, Xinchun

Publication type:

Article

Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 9/10, p. 4455, doi. 10.1007/s00170-023-12204-4

By:

Huy, Le Nam Quoc;
Hoa, Le Ngoc Quynh;
Chen, Chao-Chang A.

Publication type:

Article

On the Lateral Recrystallization of Amorphous Silicon Nanostructures Using Nickel Silicide.

Published in:

Semiconductors, 2020, v. 54, n. 13, p. 1784, doi. 10.1134/S1063782620130035

By:

Belostotskaya, S. O.;
Kuznetsov, E. V.;
Rybachek, E. N.;
Gubanova, O. V.

Publication type:

Article

Corning technology enables world’s deepest look into the universe.

Published in:: Glass Technology: European Journal of Glass Science & Technology Part A, 2022, v. 63, n. 3, p. 68
Publication type:: Article

Corning technology enables world’s deepest look into the universe: Corning marks achievement as NASA shows first images from James Webb Space Telescope.

Published in:: Glass Technology: European Journal of Glass Science & Technology Part A, 2022, v. 63, n. 2, p. 68
Publication type:: Article

An approach to model manufacturing of an enhanced swing differential Colpitts oscillator based on heterostructures to increase density of their elements with account mismatch-induced stress: on optimization of annealing.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 112, n. 3/4, p. 949, doi. 10.1007/s00170-020-06082-3

By:

Pankratov, E. L.

Publication type:

Article

Simultaneous Determination of Young's Modulus and Density of Ultrathin Low‐k Films Using Surface Acoustic Waves.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2024, v. 221, n. 7, p. 1, doi. 10.1002/pssa.202300860

By:

Zhang, Li;
Xiao, Xia;
Zhang, Jinsong;
Liu, Zhuo;
Huang, Yiting

Publication type:

Article

>Single machine parallel-batching scheduling problem with fuzzy due-date and fuzzy precedence relation.

Published in:

International Journal of Production Research, 2015, v. 53, n. 9, p. 2707, doi. 10.1080/00207543.2014.975866

By:

Li, Xuesong;
Ishii, Hiroaki;
Chen, Minghao

Publication type:

Article

A review of yield modelling techniques for semiconductor manufacturing.

Published in:

International Journal of Production Research, 2006, v. 44, n. 23, p. 5019, doi. 10.1080/00207540600596874

By:

Kumar, N.;
Kennedy, K.;
Gildersleeve, K.;
Abelson, R.;
Mastrangelo, C. M.;
Montgomery, D. C.

Publication type:

Article

Hybrid LSTM-ARMA Demand-Forecasting Model Based on Error Compensation for Integrated Circuit Tray Manufacturing.

Published in:

Mathematics (2227-7390), 2022, v. 10, n. 13, p. 2158, doi. 10.3390/math10132158

By:

Wang, Chien-Chih;
Chang, Hsin-Tzu;
Chien, Chun-Hua

Publication type:

Article

No-Idle Flowshop Scheduling for Energy-Efficient Production: An Improved Optimization Framework.

Published in:

Mathematics (2227-7390), 2021, v. 9, n. 12, p. 1335, doi. 10.3390/math9121335

By:

Cheng, Chen-Yang;
Lin, Shih-Wei;
Pourhejazy, Pourya;
Ying, Kuo-Ching;
Lin, Yu-Zhe

Publication type:

Article

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments.

Published in:

Nanomaterials (2079-4991), 2024, v. 14, n. 1, p. 127, doi. 10.3390/nano14010127

By:

Lin, Ziwei;
Zhu, Junli;
Huang, Qi;
Zhu, Lei;
Li, Weimin;
Yu, Wenjie

Publication type:

Article

Direct Application of Carbon Nanotubes (CNTs) Grown by Chemical Vapor Deposition (CVD) for Integrated Circuits (ICs) Interconnection: Challenges and Developments.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 20, p. 2791, doi. 10.3390/nano13202791

By:

Chu, Zhenbang;
Xu, Baohui;
Liang, Jie

Publication type:

Article

Characteristic Variabilities of Subnanometer EOT La 2 O 3 Gate Dielectric Film of Nano CMOS Devices.

Published in:

Nanomaterials (2079-4991), 2021, v. 11, n. 8, p. 2118, doi. 10.3390/nano11082118

By:

Wong, Hei;
Zhang, Jieqiong;
Iwai, Hiroshi;
Kakushima, Kuniyuki

Publication type:

Article

Design and Device Mismatch Analysis of CSS–UWB Pulse Generator.

Published in:

Journal of Circuits, Systems & Computers, 2022, v. 31, n. 4, p. 1, doi. 10.1142/S0218126622500724

By:

Benali, Saif;
Barraj, Imen;
Trabelsi, Hatem

Publication type:

Article

INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.

Published in:

Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, n. 1s, p. 71, doi. 10.53656/str2024-1s-5-int

By:

Nachev, Ivan;
Tomova, Yuliana;
Konstantinov, Iskren;
Spasova, Marina

Publication type:

Article

Simulation of silicon etching in NF<sub>3</sub> plasma reactor.

Published in:

Pramana: Journal of Physics, 2023, v. 97, n. 3, p. 1, doi. 10.1007/s12043-023-02579-0

By:

Swami, H L;
Mehta, V;
Kumar, Yogendra;
Jariwala, Chetan;
Kumar, Rajesh

Publication type:

Article

Fluorinated MOF‐Based Hexafluoropropylene Nanotrap for Highly Efficient Purification of Octafluoropropane Electronic Specialty Gas.

Published in:

Angewandte Chemie, 2024, v. 136, n. 15, p. 1, doi. 10.1002/ange.202401770

By:

Zheng, Mingze;
Xue, Wenjuan;
Yan, Tongan;
Jiang, Zefeng;
Fang, Zhi;
Huang, Hongliang;
Zhong, Chongli

Publication type:

Article

Radio Frequency Properties of a 3D Printed Klystron Circuit.

Published in:

Instruments (2410-390X), 2024, v. 8, n. 1, p. 9, doi. 10.3390/instruments8010009

By:

Wehner, Charlotte;
Shirley, Bradley;
Mathesen, Garrett;
Merrick, Julian;
Weatherford, Brandon;
Nanni, Emilio Alessandro

Publication type:

Article

Effective Optimization Strategy for Electron Beam Lithography of Molecular Glass Negative Photoresist.

Published in:

Advanced Materials Interfaces, 2023, v. 10, n. 20, p. 1, doi. 10.1002/admi.202300194

By:

Gao, Jiaxing;
Zhang, Siliang;
Cui, Xuewen;
Cong, Xue;
Guo, Xudong;
Hu, Rui;
Wang, Shuangqing;
Chen, Jinping;
Li, Yi;
Yang, Guoqiang

Publication type:

Article

Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization.

Published in:

Lubricants (2075-4442), 2024, v. 12, n. 2, p. 63, doi. 10.3390/lubricants12020063

By:

Gamagedara, Kassapa;
Roy, Dipankar

Publication type:

Article

Through-Hole Buck Converters for Fast Prototyping: A Comparative Study.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 7, p. 1273, doi. 10.3390/electronics14071273

By:

Muñoz, Jose Vicente;
Nieto-Nieto, Luis M.;
Pulido-Lopez, Luis;
Aguilar-Peña, Juan D.;
Gonzalez-Rodriguez, Angel Gaspar

Publication type:

Article

FATE: A Flexible FPGA-Based Automatic Test Equipment for Digital ICs.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 9, p. 1667, doi. 10.3390/electronics13091667

By:

Zhang, Jin;
Liu, Zhenghui;
Hu, Xiao;
Liu, Peixin;
Hu, Zhiling;
Kuang, Lidan

Publication type:

Article

Research on Parallel Reading and Drawing Techniques for Chemical Mechanical Polishing Simulation Data Based on Multi-Thread.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 4, p. 706, doi. 10.3390/electronics13040706

By:

Ji, Zhenyu;
Chen, Lan;
Sun, Yan;
Cai, Hong

Publication type:

Article

Lightweight Strong PUF for Resource-Constrained Devices.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 2, p. 351, doi. 10.3390/electronics13020351

By:

Korona, Mateusz;
Giermakowski, Radosław;
Biernacki, Mateusz;
Rawski, Mariusz

Publication type:

Article

Noise Reduction of Atomic Force Microscopy Measurement Data for Fitting Verification of Chemical Mechanical Planarization Model.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 11, p. 2422, doi. 10.3390/electronics12112422

By:

Ren, Bowen;
Chen, Lan;
Chen, Rong;
Ji, Ruian;
Wang, Yali

Publication type:

Article

A Deep Learning Method Based on the Attention Mechanism for Hardware Trojan Detection.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 15, p. 2400, doi. 10.3390/electronics11152400

By:

Tang, Wenjing;
Su, Jing;
He, Jiaji;
Gao, Yuchan

Publication type:

Article

Lockit: A Logic Locking Automation Software.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 22, p. 2817, doi. 10.3390/electronics10222817

By:

Kajtez, Nemanja;
Zhang, Yue;
Halak, Basel

Publication type:

Article

Research Progress of Biomimetic Memristor Flexible Synapse.

Published in:

Coatings (2079-6412), 2022, v. 12, n. 1, p. 21, doi. 10.3390/coatings12010021

By:

Zhang, Huiling;
Liu, Ruping;
Zhao, Huiqing;
Sun, Zhicheng;
Liu, Zilong;
He, Liang;
Li, Ye

Publication type:

Article

INNOVATION CHARACTERISTICS, INDUSTRIAL CLUSTERS, AND INTRA-INDUSTRY SPILLOVER EFFECTS IN INTEGRATED CIRCUIT INDUSTRY.

Published in:

International Journal of Innovation & Technology Management, 2013, v. 10, n. 4, p. -1, doi. 10.1142/S021987701350020X

By:

TSAI, BI-HUEI;
CHEN, HUANG WEN

Publication type:

Article

Tuning Logic Simulator for Estimation of VLSI Timing Degradation under Aging.

Published in:

Advances in Electrical & Computer Engineering, 2019, v. 19, n. 3, p. 75, doi. 10.4316/AECE.2019.03009

By:

MILIĆ, Miljana

Publication type:

Article

Improving Recognition of Defective Epoxy Images in Integrated Circuit Manufacturing by Data Augmentation.

Published in:

Sensors (14248220), 2024, v. 24, n. 3, p. 738, doi. 10.3390/s24030738

By:

Alam, Lamia;
Kehtarnavaz, Nasser

Publication type:

Article

Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN.

Published in:

Sensors (14248220), 2023, v. 23, n. 10, p. 4864, doi. 10.3390/s23104864

By:

Alam, Lamia;
Kehtarnavaz, Nasser

Publication type:

Article

ISTFA/2019 PREVIEW.

Published in:

Electronic Device Failure Analysis, 2019, v. 21, n. 3, p. 34

By:

Beaudoin, Felix

Publication type:

Article

基于选择性激光烧结的结构电路一体化技术研究.

Published in:

Journal of Nanjing University of Aeronautics & Astronautics / Nanjing Hangkong Hangtian Daxue Xuebao, 2020, v. 52, n. 1, p. 87

By:

张鑫;
李冬;
赵剑峰;
谢德巧;
梁绘昕;
沈理达;
田宗军

Publication type:

Article

Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry.

Published in:

Sustainability (2071-1050), 2018, v. 10, n. 1, p. 196, doi. 10.3390/su10010196

By:

Liu, Yun;
Yan, Zhe;
Cheng, Yijie;
Ye, Xuanting

Publication type:

Article

Peering into the Future.

Published in:

TCE: The Chemical Engineer, 2016, n. 900, p. 42

By:

SHARROCK, CAYLE

Publication type:

Article

Traditional detoxification of wild yam (Dioscorea hispida Dennst) tuber in chips processing at East Java, Indonesia.

Published in:

Journal of Ethnic Foods, 2022, v. 9, n. 1, p. 1, doi. 10.1186/s42779-022-00164-1

By:

Estiasih, Teti;
Ahmadi, Kgs.;
Sari, Irawati Nur Indah;
Kuliahsari, Dessy Eka;
Martati, Erryana

Publication type:

Article

Design, synthesis and simulation of fractional-order element using MOS transistors as distributed resistive capacitive devices.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-96539-w

By:

Kubanek, David;
Shadrin, Aleksandr;
Seda, Pavel;
Dvorak, Jan;
Jerabek, Jan;
Kledrowetz, Vilem;
Christie, Cole;
Freeborn, Todd J.;
Ushakov, Pyotr A.

Publication type:

Article

Design and Characterization of Integrated Microsensors for Heat Transfer Studies in Microchannels.

Published in:

Experimental Heat Transfer, 2014, v. 27, n. 4, p. 389, doi. 10.1080/08916152.2013.849465

By:

Vittoriosi, A.;
Brandner, J. J.;
Ruther, P.;
Paul, O.;
Dittmeyer, R.

Publication type:

Article

Raman Investigation on Silicon Nitride Chips after Soldering onto Copper Substrates.

Published in:

Micromachines, 2024, v. 15, n. 8, p. 990, doi. 10.3390/mi15080990

By:

Mezzalira, Claudia;
Conti, Fosca;
Pedron, Danilo;
Signorini, Raffaella

Publication type:

Article

An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit Usage.

Published in:

Micromachines, 2024, v. 15, n. 6, p. 769, doi. 10.3390/mi15060769

By:

Diaz-Fortuny, Javier;
Saraza-Canflanca, Pablo;
Bury, Erik;
Degraeve, Robin;
Kaczer, Ben

Publication type:

Article

Design and Fabrication of Micro/Nano Sensors and Actuators.

Published in:

Micromachines, 2024, v. 15, n. 6, p. 674, doi. 10.3390/mi15060674

By:

Wang, Weidong;
Yang, Ruiguo;
Liu, Min

Publication type:

Article