Works matching DE "INTEGRATED circuits manufacturing"

Results: 79

An approach to model and optimization of manufacturing of an enhanced swing differential Colpitts oscillator. on influence of miss-match induced stress.

Published in:

Journal of Kufa - Physics, 2020, v. 12, n. 2, p. 12, doi. 10.31257/2018/JKP/2020/120202

By:

Pankratov, E. L.

Publication type:

Article

Development of Photoresist Resins and Their Synthesis Methods for Extreme Ultraviolet Lithography.

Published in:

Imaging Science & Photochemistry, 2021, n. 4, p. 504, doi. 10.7517/issn.1674-0475.210122

By:

WEN Shuai;
LIU Qiang

Publication type:

Article

Design, synthesis and simulation of fractional-order element using MOS transistors as distributed resistive capacitive devices.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-96539-w

By:

Kubanek, David;
Shadrin, Aleksandr;
Seda, Pavel;
Dvorak, Jan;
Jerabek, Jan;
Kledrowetz, Vilem;
Christie, Cole;
Freeborn, Todd J.;
Ushakov, Pyotr A.

Publication type:

Article

Simultaneous Determination of Young's Modulus and Density of Ultrathin Low‐k Films Using Surface Acoustic Waves.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2024, v. 221, n. 7, p. 1, doi. 10.1002/pssa.202300860

By:

Zhang, Li;
Xiao, Xia;
Zhang, Jinsong;
Liu, Zhuo;
Huang, Yiting

Publication type:

Article

Discussion.

Published in:

Journal of Quality Technology, 2013, v. 45, n. 3, p. 236, doi. 10.1080/00224065.2013.11917933

By:

TRINDADE, DAVID C.

Publication type:

Article

Simulation of silicon etching in NF<sub>3</sub> plasma reactor.

Published in:

Pramana: Journal of Physics, 2023, v. 97, n. 3, p. 1, doi. 10.1007/s12043-023-02579-0

By:

Swami, H L;
Mehta, V;
Kumar, Yogendra;
Jariwala, Chetan;
Kumar, Rajesh

Publication type:

Article

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments.

Published in:

Nanomaterials (2079-4991), 2024, v. 14, n. 1, p. 127, doi. 10.3390/nano14010127

By:

Lin, Ziwei;
Zhu, Junli;
Huang, Qi;
Zhu, Lei;
Li, Weimin;
Yu, Wenjie

Publication type:

Article

Direct Application of Carbon Nanotubes (CNTs) Grown by Chemical Vapor Deposition (CVD) for Integrated Circuits (ICs) Interconnection: Challenges and Developments.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 20, p. 2791, doi. 10.3390/nano13202791

By:

Chu, Zhenbang;
Xu, Baohui;
Liang, Jie

Publication type:

Article

Characteristic Variabilities of Subnanometer EOT La 2 O 3 Gate Dielectric Film of Nano CMOS Devices.

Published in:

Nanomaterials (2079-4991), 2021, v. 11, n. 8, p. 2118, doi. 10.3390/nano11082118

By:

Wong, Hei;
Zhang, Jieqiong;
Iwai, Hiroshi;
Kakushima, Kuniyuki

Publication type:

Article

Research Progress of Biomimetic Memristor Flexible Synapse.

Published in:

Coatings (2079-6412), 2022, v. 12, n. 1, p. 21, doi. 10.3390/coatings12010021

By:

Zhang, Huiling;
Liu, Ruping;
Zhao, Huiqing;
Sun, Zhicheng;
Liu, Zilong;
He, Liang;
Li, Ye

Publication type:

Article

High density lithium niobate photonic integrated circuits.

Published in:

Nature Communications, 2023, v. 14, n. 1, p. 1, doi. 10.1038/s41467-023-40502-8

By:

Li, Zihan;
Wang, Rui Ning;
Lihachev, Grigory;
Zhang, Junyin;
Tan, Zelin;
Churaev, Mikhail;
Kuznetsov, Nikolai;
Siddharth, Anat;
Bereyhi, Mohammad J.;
Riemensberger, Johann;
Kippenberg, Tobias J.

Publication type:

Article

How many matchings cover the nodes of a graph?

Published in:

Mathematical Programming, 2024, v. 203, n. 1/2, p. 271, doi. 10.1007/s10107-022-01804-9

By:

Ferhat, Dehia Ait;
Király, Zoltán;
Sebő, András;
Stauffer, Gautier

Publication type:

Article

On the Lateral Recrystallization of Amorphous Silicon Nanostructures Using Nickel Silicide.

Published in:

Semiconductors, 2020, v. 54, n. 13, p. 1784, doi. 10.1134/S1063782620130035

By:

Belostotskaya, S. O.;
Kuznetsov, E. V.;
Rybachek, E. N.;
Gubanova, O. V.

Publication type:

Article

基于选择性激光烧结的结构电路一体化技术研究.

Published in:

Journal of Nanjing University of Aeronautics & Astronautics / Nanjing Hangkong Hangtian Daxue Xuebao, 2020, v. 52, n. 1, p. 87

By:

张鑫;
李冬;
赵剑峰;
谢德巧;
梁绘昕;
沈理达;
田宗军

Publication type:

Article

Enhancing ceria slurry performance for shallow trench isolation chemical mechanical polishing through non-ionic surfactant addition.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 11/12, p. 4997, doi. 10.1007/s00170-023-12254-8

By:

Zhang, Lifei;
Xie, Lile;
Lu, Xinchun

Publication type:

Article

Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 9/10, p. 4455, doi. 10.1007/s00170-023-12204-4

By:

Huy, Le Nam Quoc;
Hoa, Le Ngoc Quynh;
Chen, Chao-Chang A.

Publication type:

Article

Spectral purity systems applied for laser-produced plasma extreme ultraviolet lithography sources: a review.

Published in:

High Power Laser Science & Engineering, 2023, v. 11, p. 1, doi. 10.1017/hpl.2023.53

By:

Nan Lin;
Yunyi Chen;
Xin Wei;
Wenhe Yang;
Yuxin Leng

Publication type:

Article

An Improved YOLOv5 Model for Lithographic Hotspot Detection.

Published in:

Micromachines, 2025, v. 16, n. 5, p. 568, doi. 10.3390/mi16050568

By:

Lin, Mu;
He, Wenjing;
Liu, Jiale;
Li, Fencheng;
Luo, Jun;
Shen, Yijiang

Publication type:

Article

Raman Investigation on Silicon Nitride Chips after Soldering onto Copper Substrates.

Published in:

Micromachines, 2024, v. 15, n. 8, p. 990, doi. 10.3390/mi15080990

By:

Mezzalira, Claudia;
Conti, Fosca;
Pedron, Danilo;
Signorini, Raffaella

Publication type:

Article

An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit Usage.

Published in:

Micromachines, 2024, v. 15, n. 6, p. 769, doi. 10.3390/mi15060769

By:

Diaz-Fortuny, Javier;
Saraza-Canflanca, Pablo;
Bury, Erik;
Degraeve, Robin;
Kaczer, Ben

Publication type:

Article

Design and Fabrication of Micro/Nano Sensors and Actuators.

Published in:

Micromachines, 2024, v. 15, n. 6, p. 674, doi. 10.3390/mi15060674

By:

Wang, Weidong;
Yang, Ruiguo;
Liu, Min

Publication type:

Article

InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications.

Published in:

Micromachines, 2023, v. 14, n. 2, p. 408, doi. 10.3390/mi14020408

By:

Gibasiewicz, Krzysztof;
Kafar, Anna;
Schiavon, Dario;
Saba, Kiran;
Marona, Łucja;
Kamińska, Eliana;
Perlin, Piotr

Publication type:

Article

Editorial for the Special Issue on the Progress of Emerging Hardware Development for Post-Moore's Computing.

Published in:

Micromachines, 2023, v. 14, n. 1, p. 193, doi. 10.3390/mi14010193

By:

Chang, Yao-Feng

Publication type:

Article

STT-DPSA: Digital PUF-Based Secure Authentication Using STT-MRAM for the Internet of Things.

Published in:

Micromachines, 2020, v. 11, n. 5, p. 502, doi. 10.3390/mi11050502

By:

Chien, Wei-Chen;
Chang, Yu-Chian;
Tsou, Yao-Tung;
Kuo, Sy-Yen;
Chang, Ching-Ray

Publication type:

Article

Peering into the Future.

Published in:

TCE: The Chemical Engineer, 2016, n. 900, p. 42

By:

SHARROCK, CAYLE

Publication type:

Article

Study on the synergistic effect and mechanism of inhibitors benzotriazole and pyrazole on copper surface.

Published in:

Journal of Applied Electrochemistry, 2023, v. 53, n. 8, p. 1669, doi. 10.1007/s10800-023-01874-3

By:

Wang, Jing;
Gao, Baohong;
Liu, Shitong;
Liang, Bin;
Liu, Mingyu

Publication type:

Article

Reconfigurable missile‐borne SAR imaging SoC design.

Published in:

IET Radar, Sonar & Navigation (Wiley-Blackwell), 2019, v. 13, n. 5, p. 776, doi. 10.1049/iet-rsn.2018.5248

By:

Guo, Chenguang;
Xu, Jiancheng;
Xu, Wenyao;
Zhang, Hui

Publication type:

Article

Radio Frequency Properties of a 3D Printed Klystron Circuit.

Published in:

Instruments (2410-390X), 2024, v. 8, n. 1, p. 9, doi. 10.3390/instruments8010009

By:

Wehner, Charlotte;
Shirley, Bradley;
Mathesen, Garrett;
Merrick, Julian;
Weatherford, Brandon;
Nanni, Emilio Alessandro

Publication type:

Article

DVCCTAs-based current-mode MISO filters with separate adjustments for pole frequency, quality factor and amplitude.

Published in:

Przegląd Elektrotechniczny, 2023, v. 2023, n. 11, p. 75, doi. 10.15199/48.2023.11.13

By:

Thirasak PHIANGPRANTHONG;
Angkana CHAROENMEE;
Adirek JANTAKUN

Publication type:

Article

PROCESS TECHNOLOGY.

Published in:: Advanced Materials & Processes, 2018, v. 176, n. 8, p. 7
Publication type:: Article

Fluorinated MOF‐Based Hexafluoropropylene Nanotrap for Highly Efficient Purification of Octafluoropropane Electronic Specialty Gas.

Published in:

Angewandte Chemie, 2024, v. 136, n. 15, p. 1, doi. 10.1002/ange.202401770

By:

Zheng, Mingze;
Xue, Wenjuan;
Yan, Tongan;
Jiang, Zefeng;
Fang, Zhi;
Huang, Hongliang;
Zhong, Chongli

Publication type:

Article

AFIA: ATPG-Guided Fault Injection Attack on Secure Logic Locking.

Published in:

Journal of Electronic Testing, 2022, v. 38, n. 5, p. 527, doi. 10.1007/s10836-022-06028-5

By:

Zhong, Yadi;
Jain, Ayush;
Rahman, M. Tanjidur;
Asadizanjani, Navid;
Xie, Jiafeng;
Guin, Ujjwal

Publication type:

Article

Hardware Trojan Detection Leveraging a Novel Golden Layout Model Towards Practical Applications.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 4, p. 529, doi. 10.1007/s10836-019-05816-w

By:

Liu, Yanjiang;
He, Jiaji;
Ma, Haocheng;
Zhao, Yiqiang

Publication type:

Article

Activity Factor Based Hardware Trojan Detection and Localization.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 3, p. 293, doi. 10.1007/s10836-019-05803-1

By:

Tang, Yongkang;
Fang, Liang;
Li, Shaoqing

Publication type:

Article

Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry.

Published in:

Sustainability (2071-1050), 2018, v. 10, n. 1, p. 196, doi. 10.3390/su10010196

By:

Liu, Yun;
Yan, Zhe;
Cheng, Yijie;
Ye, Xuanting

Publication type:

Article

Single-Phase Energy Metering Chip with Built-in Calibration Function.

Published in:

KSII Transactions on Internet & Information Systems, 2015, v. 9, n. 8, p. 3103, doi. 10.3837/tiis.2015.08.021

By:

Youn-Sung Lee;
Jeongwook Seo;
Jungwook Wee;
Mingoo Kang;
Dong Ku Kim

Publication type:

Article

Growth and Selective Etch of Phosphorus-Doped Silicon/Silicon–Germanium Multilayers Structures for Vertical Transistors Application.

Published in:

Nanoscale Research Letters, 2020, v. 15, n. 1, p. 1, doi. 10.1186/s11671-020-03456-0

By:

Li, Chen;
Lin, Hongxiao;
Li, Junjie;
Yin, Xiaogen;
Zhang, Yongkui;
Kong, Zhenzhen;
Wang, Guilei;
Zhu, Huilong;
Radamson, Henry H.

Publication type:

Article

Improving Recognition of Defective Epoxy Images in Integrated Circuit Manufacturing by Data Augmentation.

Published in:

Sensors (14248220), 2024, v. 24, n. 3, p. 738, doi. 10.3390/s24030738

By:

Alam, Lamia;
Kehtarnavaz, Nasser

Publication type:

Article

Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN.

Published in:

Sensors (14248220), 2023, v. 23, n. 10, p. 4864, doi. 10.3390/s23104864

By:

Alam, Lamia;
Kehtarnavaz, Nasser

Publication type:

Article

ISTFA/2019 PREVIEW.

Published in:

Electronic Device Failure Analysis, 2019, v. 21, n. 3, p. 34

By:

Beaudoin, Felix

Publication type:

Article

PBGFMEA: A Belief Jensen–Shannon Theory and Gray Relational Projection-Based Enhanced FMEA Approach for Risk Evaluation of Integrated Circuit Process.

Published in:

Journal of Failure Analysis & Prevention, 2025, v. 25, n. 3, p. 1200, doi. 10.1007/s11668-025-02199-3

By:

Diao, Yue;
Chen, Kaiyu;
Gao, Hanmei;
Wang, Xuanlin;
Wang, Yucheng;
Li, Wei;
Wang, Shaoxi

Publication type:

Article

Experimental realization of electromigration at high power for copper wires.

Published in:

Journal of Energy Systems, 2019, v. 3, n. 4, p. 158, doi. 10.30521/jes.616982

By:

Mahariq, Ibrahim;
Berjozkina, Svetlana

Publication type:

Article

Traditional detoxification of wild yam (Dioscorea hispida Dennst) tuber in chips processing at East Java, Indonesia.

Published in:

Journal of Ethnic Foods, 2022, v. 9, n. 1, p. 1, doi. 10.1186/s42779-022-00164-1

By:

Estiasih, Teti;
Ahmadi, Kgs.;
Sari, Irawati Nur Indah;
Kuliahsari, Dessy Eka;
Martati, Erryana

Publication type:

Article

Effective Optimization Strategy for Electron Beam Lithography of Molecular Glass Negative Photoresist.

Published in:

Advanced Materials Interfaces, 2023, v. 10, n. 20, p. 1, doi. 10.1002/admi.202300194

By:

Gao, Jiaxing;
Zhang, Siliang;
Cui, Xuewen;
Cong, Xue;
Guo, Xudong;
Hu, Rui;
Wang, Shuangqing;
Chen, Jinping;
Li, Yi;
Yang, Guoqiang

Publication type:

Article

Design and Characterization of Integrated Microsensors for Heat Transfer Studies in Microchannels.

Published in:

Experimental Heat Transfer, 2014, v. 27, n. 4, p. 389, doi. 10.1080/08916152.2013.849465

By:

Vittoriosi, A.;
Brandner, J. J.;
Ruther, P.;
Paul, O.;
Dittmeyer, R.

Publication type:

Article

Tuning Logic Simulator for Estimation of VLSI Timing Degradation under Aging.

Published in:

Advances in Electrical & Computer Engineering, 2019, v. 19, n. 3, p. 75, doi. 10.4316/AECE.2019.03009

By:

MILIĆ, Miljana

Publication type:

Article

Analyzing Hardware Trojans in FPGA-Based SoCs Using Machine Learning.

Published in:

Journal of Integrated Circuits & Systems, 2025, v. 20, n. 1, p. 1, doi. 10.29292/jics.v20i1.971

By:

Khamitkar, Ravikant;
Dube, R. R.

Publication type:

Article

INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.

Published in:

Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, n. 1s, p. 71, doi. 10.53656/str2024-1s-5-int

By:

Nachev, Ivan;
Tomova, Yuliana;
Konstantinov, Iskren;
Spasova, Marina

Publication type:

Article

Plasma and Gas‐based Semiconductor Technologies for 2D Materials with Computational Simulation & Electronic Applications.

Published in:

Advanced Electronic Materials, 2024, v. 10, n. 6, p. 1, doi. 10.1002/aelm.202300835

By:

Kim, Changmin;
Kim, Muyoung;
Kim, Seongho;
Kang, Minji;
Choi, Min Sup;
Kim, Hyeong‐U

Publication type:

Article

INNOVATION CHARACTERISTICS, INDUSTRIAL CLUSTERS, AND INTRA-INDUSTRY SPILLOVER EFFECTS IN INTEGRATED CIRCUIT INDUSTRY.

Published in:

International Journal of Innovation & Technology Management, 2013, v. 10, n. 4, p. -1, doi. 10.1142/S021987701350020X

By:

TSAI, BI-HUEI;
CHEN, HUANG WEN

Publication type:

Article