Works matching DE "INTEGRATED circuits industry"

Results: 174

Infrastructure matures as Flip chip takes off.

Published in:

Solid State Technology, 2001, v. 44, n. 9, p. 47

By:

Vardaman, E. Jaw

Publication type:

Article

Let's get on with using the Internet on the fab floor.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 166

By:

Parsons, Peter V. N.

Publication type:

Article

It's Europe's turn now.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. S1

By:

DeFerm, Ludo

Publication type:

Article

The view from Japan: Chipmakers giving up on doing it all themselves.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 40

By:

Kimura, Masahide;
Microdevices, Nikkei

Publication type:

Article

The Control of Oxygen Precipitation and the Impact of Internal Gettering.

Published in:: Solid State Technology, 2001, v. 44, n. 3, p. 113
Publication type:: Article

We need better factories.

Published in:

Solid State Technology, 2000, v. 43, n. 6, p. 14

By:

Haavind, Robert

Publication type:

Article

Flat January sales follow months of rapid growth.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Lunday, Christine

Publication type:

Article

Market indicators stay steady course; tool bookings reach $2.3B, says SEMI.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Villeneuve, Meg

Publication type:

Article

Worldwide highlights.

Published in:: Solid State Technology, 1999, v. 42, n. 11, p. 14
Publication type:: Article

Booming comm-IC markets increase GaAs use.

Published in:: Solid State Technology, 1999, v. 42, n. 3, p. 26
Publication type:: Article

IMEC-ASML alliance sees results.

Published in:: Solid State Technology, 1999, v. 42, n. 2, p. 24
Publication type:: Article

IBM goes mainstream with SiGe manufacturing.

Published in:

Solid State Technology, 1999, v. 42, n. 2, p. 18

By:

P.B.

Publication type:

Article

Equipment sales and chip sales tire in October.

Published in:: Solid State Technology, 1999, v. 42, n. 1, p. 14
Publication type:: Article

1998 capital spending trends: Boom to bust.

Published in:

Solid State Technology, 1998, v. 41, n. 10, p. 54

By:

McClean, Bill

Publication type:

Article

Fab for lease.

Published in:: Solid State Technology, 1998, v. 41, n. 4, p. 40
Publication type:: Article

Wet bench materials scrutinized after fires.

Published in:

Solid State Technology, 1998, v. 41, n. 3, p. 22

By:

Lunday, Christine

Publication type:

Article

Philips to build in the Philippines.

Published in:: Solid State Technology, 1997, v. 40, n. 12, p. 34
Publication type:: Article

Expect the unexpected.

Published in:

1997

By:

Korczynski, Ed

Publication type:

Editorial

Calendar.

Published in:: 2007
Publication type:: Calendar

News.

Published in:: Electronics Systems & Software, 2006, v. 4, n. 5, p. 4, doi. 10.1049/ess:20060510
Publication type:: Article

News.

Published in:: Electronics Systems & Software, 2006, v. 4, n. 1, p. 4, doi. 10.1049/ess:20060109
Publication type:: Article

Chip sales forecast pushed up.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 6, p. 9
Publication type:: Article

DSP micro family splits into four.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 46
Publication type:: Article

LSI Logic fabless move was 'timing driven'

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 5
Publication type:: Article

Fujitsu prepares 65nm process with 25% gate shrink.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 4
Publication type:: Article

Fabless road beckons even for companies on old processes.

Published in:

2005

By:

Edwards, Chris

Publication type:

Editorial

Design and construction of a variables switch-based sampling system for product acceptance determination.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 101, n. 9-12, p. 2643, doi. 10.1007/s00170-018-3147-7

By:

Wu, Chien-Wei;
Liu, Shih-Wen;
Chen, Jr-Tzung;
Lin, Jhih-Jia

Publication type:

Article

Nanoelectronics Based on Carbon Nanotubes: Technological Challenges and Recent Developments.

Published in:

Fullerenes, Nanotubes & Carbon Nanostructures, 2005, v. 13, p. 255, doi. 10.1081/FST-200039292

By:

Liebau, M.;
Graham, A. P.;
Duesberg, G. S.;
Unger, E.;
Seidel, R.;
Kreupl, F.

Publication type:

Article

Determination of the relative humidity at the parts-per-million (ppm) level in gases by a nanoporous alumina thin-film on a surface acoustic wave (SAW) resonator.

Published in:

Instrumentation Science & Technology, 2022, v. 50, n. 2, p. 118, doi. 10.1080/10739149.2021.1967973

By:

Alam, Shamim;
Khan, Shakeb A.;
Mittal, Upendra;
Islam, Tarikul

Publication type:

Article

Technological Performance and Alliances Over the Industry Life Cycle: Evidence from the ASIC Industry.

Published in:

Journal of Product Innovation Management, 2015, v. 32, n. 4, p. 556, doi. 10.1111/jpim.12253

By:

Vanhaverbeke, Wim;
Belderbos, Réne;
Duysters, Geert;
Beerkens, Bonnie

Publication type:

Article

Lithography Alignment Techniques Based on Moiré Fringe.

Published in:

Photonics, 2023, v. 10, n. 4, p. 351, doi. 10.3390/photonics10040351

By:

Jiang, Wenbo;
Wang, Huaran;
Xie, Wenda;
Qu, Zhefei

Publication type:

Article

Interfirm Cooperation in Japan's Integrated Circuit Industry, 1960s-1970s.

Published in:

Business History Review, 2012, v. 86, n. 4, p. 773, doi. 10.1017/S0007680512001821

By:

Kim, Yongdo

Publication type:

Article

Investigating make-or-buy decisions and the impact of learning-by-doing in the semiconductor industry.

Published in:

International Journal of Production Research, 2024, v. 62, n. 11, p. 3835, doi. 10.1080/00207543.2023.2250009

By:

Longauer, Dóra;
Vasvári, Tamás;
Hauck, Zsuzsanna

Publication type:

Article

Shop floor control in the VLSI circuit manufacturing: a simulation approach and a case study.

Published in:

International Journal of Production Research, 2022, v. 60, n. 18, p. 5450, doi. 10.1080/00207543.2021.1959954

By:

Cigolini, Roberto;
Franceschetto, Simone;
Sianesi, Andrea

Publication type:

Article

>Single machine parallel-batching scheduling problem with fuzzy due-date and fuzzy precedence relation.

Published in:

International Journal of Production Research, 2015, v. 53, n. 9, p. 2707, doi. 10.1080/00207543.2014.975866

By:

Li, Xuesong;
Ishii, Hiroaki;
Chen, Minghao

Publication type:

Article

Before and after the millennium: productivity analysis of the supply chain of Taiwan's IC industry.

Published in:

Applied Economics, 2011, v. 43, n. 22, p. 2993, doi. 10.1080/00036840903357348

By:

Lu, LouisY. Y.

Publication type:

Article

Synchronizing the Supply of Components for Automotive Assembly amid Chip Shortages and Other Supply Delays.

Published in:

Production & Operations Management, 2024, v. 33, n. 9, p. 1821, doi. 10.1177/10591478241260432

By:

Clottey, Toyin;
Benton Jr., WC

Publication type:

Article

Simulation of cooling system using internal air flow with bending flow passages.

Published in:

Advances in Mechanical Engineering (Sage Publications Inc.), 2016, v. 8, n. 7, p. 1, doi. 10.1177/1687814016656104

By:

Chongho Youn;
Tomohiro Takahashi;
Toshiharu Kagawa

Publication type:

Article

RECENT PROGRESSES OF APPLICATION-ORIENTED MEMS THROUGH INDUSTRY-UNIVERSITY COLLABORATION.

Published in:

International Journal of High Speed Electronics & Systems, 2006, v. 16, n. 2, p. 693, doi. 10.1142/S0129156406003941

By:

Esashi, Masayoshi

Publication type:

Article

Overview of the ULSI Session and Chapter.

Published in:

International Journal of High Speed Electronics & Systems, 2000, v. 10, n. 1, p. 171, doi. 10.1142/S0129156400000209

By:

Iwai, Hiroshi;
Ikoma, Toshiaki;
Kado, Yuichi

Publication type:

Article

Present Status and Future Trends of the Asian Semiconductor Industry.

Published in:

International Journal of High Speed Electronics & Systems, 2000, v. 10, n. 1, p. 183, doi. 10.1142/S0129156400000222

By:

Chang, C. Y.

Publication type:

Article

US Chip-Decoupling Against China: Implications for BRI Initiative.

Published in:

Pakistan Horizon, 2024, v. 77, n. 4, p. 95

By:

Riaz, Haadia;
Khurshid, Tayyaba

Publication type:

Article

Risk-transmission Mechanism of Industry Chain under a Multi-parameter Grey-GERT Network.

Published in:

Journal of Grey System, 2024, v. 36, n. 3, p. 63

By:

Lan Xu;
Yingying Shang

Publication type:

Article

When Size Does Matter.

Published in:

Manufacturing Engineer, 2005, v. 84, n. 2, p. 6, doi. 10.1049/me:20050212

By:

Venables, Mark

Publication type:

Article

Current Trends in Integrated Circuits.

Published in:

Financial Analysts Journal, 1967, v. 23, n. 5, p. 65, doi. 10.2469/faj.v23.n5.65

By:

Sarlo, George S.;
Longley, F. Alan

Publication type:

Article

Taiwan's Divisive Monopoly Over Semiconductors.

Published in:

Hemispheres, 2025, v. 48, n. 1, p. 37

By:

LYLE, KARSTEN;
XIA, ALEXANDER

Publication type:

Article

The Future of Computer Technology and its Implications for the Computer Industry.

Published in:: Computer Journal, 2008, v. 51, n. 6, p. 735, doi. 10.1093/comjnl/bxn022
Publication type:: Article

Printed Circuit Board (PCB) Surface Micro Defect Detection Model Based on Residual Network with Novel Attention Mechanism.

Published in:

Computers, Materials & Continua, 2024, v. 78, n. 1, p. 915, doi. 10.32604/cmc.2023.046376

By:

Xinyu Hu;
Defeng Kong;
Xiyang Liu;
Junwei Zhang;
Daode Zhang

Publication type:

Article

Examining the Linkage Between Political Skill, Emotional Labor Strategies, and Individual Outcomes: Evidence from Chinese Hotel Industry.

Published in:

Pakistan Journal of Commerce & Social Sciences, 2023, v. 17, n. 3, p. 484

By:

Usman, Muhammad;
LUO Fan;
ul Haq, Muhammad Anwar

Publication type:

Article

X-RAY PROPAGATION IN MULTIWALL CARBON NANOTUBES.

Published in:

International Journal of Modern Physics A: Particles & Fields; Gravitation; Cosmology; Nuclear Physics, 2010, v. 25, p. 208, doi. 10.1142/S0217751X10050056

By:

CHILDS, P. A.;
ONG, S. Y.;
HERBERT, D. C.;
O'NEILL, A. G.

Publication type:

Article