Works matching DE "INTEGRATED circuits industry"

Results: 174

Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters.

Published in:

Inventions (2411-5134), 2023, v. 8, n. 2, p. 61, doi. 10.3390/inventions8020061

By:

Brooks, Cameron K.;
Peplinski, Jack E.;
Pearce, Joshua M.

Publication type:

Article

Survey of Reliability Research on 3D Packaged Memory.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 12, p. 2709, doi. 10.3390/electronics12122709

By:

Zhou, Shuai;
Ma, Kaixue;
Wu, Yugong;
Liu, Peng;
Hu, Xianghong;
Nie, Guojian;
Ren, Yan;
Qiu, Baojun;
Cai, Nian;
Xu, Shaoqiu;
Wang, Han

Publication type:

Article

Çip Krizinin Otomotiv Sektörü Üzerindeki Etkileri.

Published in:

Journal of Aksaray University Faculty of Economics & Administrative Sciences / Aksaray Üniversitesi Iktisadi ve Idari Bilimler Fakültesi Dergisi, 2023, v. 15, n. 1, p. 67, doi. 10.52791/aksarayiibd.1089035

By:

Pınar Kaya, H.

Publication type:

Article

SiRF Acquires Motorola's GPS Chipsets.

Published in:

Geospatial Solutions, 2005, v. 15, n. 7, p. 20

By:

Stankiewicz, Amy

Publication type:

Article

RECENT PROGRESSES OF APPLICATION-ORIENTED MEMS THROUGH INDUSTRY-UNIVERSITY COLLABORATION.

Published in:

International Journal of High Speed Electronics & Systems, 2006, v. 16, n. 2, p. 693, doi. 10.1142/S0129156406003941

By:

Esashi, Masayoshi

Publication type:

Article

Present Status and Future Trends of the Asian Semiconductor Industry.

Published in:

International Journal of High Speed Electronics & Systems, 2000, v. 10, n. 1, p. 183, doi. 10.1142/S0129156400000222

By:

Chang, C. Y.

Publication type:

Article

Overview of the ULSI Session and Chapter.

Published in:

International Journal of High Speed Electronics & Systems, 2000, v. 10, n. 1, p. 171, doi. 10.1142/S0129156400000209

By:

Iwai, Hiroshi;
Ikoma, Toshiaki;
Kado, Yuichi

Publication type:

Article

MINIMIZING TOTAL WEIGHTED COMPLETION TIME ON IDENTICAL PARALLEL BATCH MACHINES.

Published in:

International Journal of Foundations of Computer Science, 2006, v. 17, n. 6, p. 1441, doi. 10.1142/S0129054106004509

By:

LI, SHUGUANG;
LI, GUOJUN;
QI, XINGQIN

Publication type:

Article

Does intellectual capital matter? Assessing the profitability and marketability of IC design companies.

Published in:

Quality & Quantity, 2012, v. 46, n. 6, p. 1865, doi. 10.1007/s11135-011-9562-6

By:

Kuo, Mei-Huan;
Yang, Chyan

Publication type:

Article

Understanding the Global Chip Shortage.

Published in:

ITNOW, 2023, v. 65, n. 2, p. 52, doi. 10.1093/combul/bwad063

By:

Cooper, Martin

Publication type:

Article

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4

By:

Jang, Jun-Ho;
Min, Kyung Deuk;
Lee, Choong-Jae;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

Fluorinated MOF‐Based Hexafluoropropylene Nanotrap for Highly Efficient Purification of Octafluoropropane Electronic Specialty Gas.

Published in:

Angewandte Chemie, 2024, v. 136, n. 15, p. 1, doi. 10.1002/ange.202401770

By:

Zheng, Mingze;
Xue, Wenjuan;
Yan, Tongan;
Jiang, Zefeng;
Fang, Zhi;
Huang, Hongliang;
Zhong, Chongli

Publication type:

Article

Predicting gate oxide reliability from statistical process control nodes in integrated circuit manufacturing — a case study.

Published in:

Quality & Reliability Engineering International, 1997, v. 13, n. 5, p. 269, doi. 10.1002/(SICI)1099-1638(199709/10)13:5<269::AID-QRE101>3.0.CO;2-H

By:

Prendergast, James G.;
Murphy, Eamonn;
Stephenson, Malcom

Publication type:

Article

ULTRASONIC MICROSCOPE INVESTIGATIONS OF DIE ATTACH QUALITY AND CORRELATIONS WITH THERMAL RESISTANCE.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 243, doi. 10.1002/qre.4680080312

By:

Pfannschmidt, Gabriele

Publication type:

Article

The implementation of SCM concepts and information technology to the photomask supply management of IC companies.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 49, n. 1-4, p. 227, doi. 10.1007/s00170-009-2370-7

By:

Ya-Ti Lin;
Shih-Chi Chang;
Hsiao-Cheng Yu

Publication type:

Article

An IC yield enhancement approach by ARMA modeling and dynamic process control.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 7/8, p. 749, doi. 10.1007/s00170-008-1631-1

By:

Liren Yan;
Wei Huang

Publication type:

Article

Automated defect recognition of C-SAM images in IC packaging using Support Vector Machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 11/12, p. 1191, doi. 10.1007/s00170-003-1942-1

By:

Zhang, Y. L.;
Guo, N.;
Du, H.;
Li, W. H.

Publication type:

Article

Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints.

Published in:

Crystals (2073-4352), 2023, v. 13, n. 12, p. 1630, doi. 10.3390/cryst13121630

By:

Tian, Yangning;
Jian, Xiaodong;
Zhao, Mingrui;
Liu, Jiahao;
Dai, Xuanjun;
Zhou, Bin;
Yang, Xiaofeng

Publication type:

Article

Before and after the millennium: productivity analysis of the supply chain of Taiwan's IC industry.

Published in:

Applied Economics, 2011, v. 43, n. 22, p. 2993, doi. 10.1080/00036840903357348

By:

Lu, LouisY. Y.

Publication type:

Article

Complex Network-Based Resilience Assessment of the Integrated Circuit Industry Chain.

Published in:

Sustainability (2071-1050), 2024, v. 16, n. 12, p. 5163, doi. 10.3390/su16125163

By:

Wang, Chuang;
Zhang, Tianyi;
Jia, Jing;
Wang, Jin;
Ren, Shan

Publication type:

Article

PICOSECOND LASER MICROMACHINING OF SILICON WAFER: CHARACTERIZATIONS AND ELECTRICAL PROPERTIES.

Published in:

Surface Review & Letters, 2020, v. 27, n. 5, p. N.PAG, doi. 10.1142/S0218625X19501427

By:

FANG, ZHIHAO;
CHEN, LONGFEI;
GUAN, YINGCHUN;
ZHENG, HONGYU

Publication type:

Article

Time-Based Embedded Test Instrument with Concurrent Voltage Measurement Capability.

Published in:

Journal of Electronic Testing, 2012, v. 28, n. 5, p. 653, doi. 10.1007/s10836-012-5299-y

By:

Kulovic, Kemal;
Margala, Martin

Publication type:

Article

A System-layer Infrastructure for SoC Diagnosis.

Published in:

Journal of Electronic Testing, 2007, v. 23, n. 5, p. 389, doi. 10.1007/s10836-007-5014-6

By:

P. Bernardi;
M. Grosso;
M. Rebaudengo;
M. Sonza Reorda

Publication type:

Article

Keeping the high-tech region open and dynamic: the organizational networks of Taiwan's integrated circuit industry.

Published in:

GeoJournal, 2001, v. 53, n. 1, p. 81, doi. 10.1023/A:1015865404820

By:

Sue-Ching Jou;
Dung-Sheng Chen

Publication type:

Article

A Prototype of Knowledge-Based System for Fault Diagnosis in Automatic Wire Bonding Machine.

Published in:

Turkish Journal of Engineering & Environmental Sciences, 2008, v. 32, n. 4, p. 235

By:

Chee-Fai Tan

Publication type:

Article

Technological Performance and Alliances Over the Industry Life Cycle: Evidence from the ASIC Industry.

Published in:

Journal of Product Innovation Management, 2015, v. 32, n. 4, p. 556, doi. 10.1111/jpim.12253

By:

Vanhaverbeke, Wim;
Belderbos, Réne;
Duysters, Geert;
Beerkens, Bonnie

Publication type:

Article

The Institutional Challenge for China’s Semiconductor Chip Industry.

Published in:

Asia Policy, 2024, v. 19, n. 1, p. 51, doi. 10.1353/asp.2024.a918868

By:

Harjani, Manoj

Publication type:

Article

Global M&A and the Development of the IC Industry Ecosystem in China: What Can We Learn from the Case of Tsinghua Unigroup?

Published in:

Sustainability (2071-1050), 2019, v. 11, n. 1, p. 106, doi. 10.3390/su11010106

By:

Feng, Yunhao;
Wu, Jinxi;
He, Peng

Publication type:

Article

Examining the Linkage Between Political Skill, Emotional Labor Strategies, and Individual Outcomes: Evidence from Chinese Hotel Industry.

Published in:

Pakistan Journal of Commerce & Social Sciences, 2023, v. 17, n. 3, p. 484

By:

Usman, Muhammad;
LUO Fan;
ul Haq, Muhammad Anwar

Publication type:

Article

A COMBINED SIMPLEX–TRUST-REGION METHOD FOR ANALOG CIRCUIT OPTIMIZATION.

Published in:

Journal of Circuits, Systems & Computers, 2008, v. 17, n. 1, p. 123

By:

BŰRMEN, ÁRPÁD;
TUMA, TADEJ;
FAJFAR, IZTOK

Publication type:

Article

Optimal wire ordering and spacing in low power semiconductor design.

Published in:

Mathematical Programming, 2010, v. 121, n. 2, p. 201, doi. 10.1007/s10107-008-0231-z

By:

Gritzmann, Peter;
Ritter, Michael;
Zuber, Paul

Publication type:

Article

United Micro to buy Chinese chip maker.

Published in:

ComputerWorld Hong Kong, 2009, v. 26, n. 5, p. 75

By:

Nystedt, Dan

Publication type:

Article

Inflation Fears Easing Among Investors.

Published in:: Journal of Financial Planning, 2024, v. 37, n. 12, p. 14
Publication type:: Article

Infrastructure matures as Flip chip takes off.

Published in:

Solid State Technology, 2001, v. 44, n. 9, p. 47

By:

Vardaman, E. Jaw

Publication type:

Article

Let's get on with using the Internet on the fab floor.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 166

By:

Parsons, Peter V. N.

Publication type:

Article

It's Europe's turn now.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. S1

By:

DeFerm, Ludo

Publication type:

Article

The view from Japan: Chipmakers giving up on doing it all themselves.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 40

By:

Kimura, Masahide;
Microdevices, Nikkei

Publication type:

Article

The Control of Oxygen Precipitation and the Impact of Internal Gettering.

Published in:: Solid State Technology, 2001, v. 44, n. 3, p. 113
Publication type:: Article

We need better factories.

Published in:

Solid State Technology, 2000, v. 43, n. 6, p. 14

By:

Haavind, Robert

Publication type:

Article

Flat January sales follow months of rapid growth.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Lunday, Christine

Publication type:

Article

Market indicators stay steady course; tool bookings reach $2.3B, says SEMI.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Villeneuve, Meg

Publication type:

Article

Worldwide highlights.

Published in:: Solid State Technology, 1999, v. 42, n. 11, p. 14
Publication type:: Article

Booming comm-IC markets increase GaAs use.

Published in:: Solid State Technology, 1999, v. 42, n. 3, p. 26
Publication type:: Article

IMEC-ASML alliance sees results.

Published in:: Solid State Technology, 1999, v. 42, n. 2, p. 24
Publication type:: Article

IBM goes mainstream with SiGe manufacturing.

Published in:

Solid State Technology, 1999, v. 42, n. 2, p. 18

By:

P.B.

Publication type:

Article

Equipment sales and chip sales tire in October.

Published in:: Solid State Technology, 1999, v. 42, n. 1, p. 14
Publication type:: Article

1998 capital spending trends: Boom to bust.

Published in:

Solid State Technology, 1998, v. 41, n. 10, p. 54

By:

McClean, Bill

Publication type:

Article

Fab for lease.

Published in:: Solid State Technology, 1998, v. 41, n. 4, p. 40
Publication type:: Article

Wet bench materials scrutinized after fires.

Published in:

Solid State Technology, 1998, v. 41, n. 3, p. 22

By:

Lunday, Christine

Publication type:

Article

Philips to build in the Philippines.

Published in:: Solid State Technology, 1997, v. 40, n. 12, p. 34
Publication type:: Article