Works matching DE "INTEGRATED circuits"

Results: 5000

A Review: The Beauty of Serendipity Between Integrated Circuit Security and Artificial Intelligence.

Published in:

Sensors (14248220), 2025, v. 25, n. 15, p. 4880, doi. 10.3390/s25154880

By:

Dong, Chen;
Qiu, Decheng;
Li, Bolun;
Yang, Yang;
Lyu, Chenxi;
Cheng, Dong;
Zhang, Hao;
Chen, Zhenyi

Publication type:

Article

ChipletQuake: On-Die Digital Impedance Sensing for Chiplet and Interposer Verification.

Published in:

Sensors (14248220), 2025, v. 25, n. 15, p. 4861, doi. 10.3390/s25154861

By:

Khalaj Monfared, Saleh;
Saadat Safa, Maryam;
Tajik, Shahin

Publication type:

Article

Development of Low-Cost Single-Chip Automotive 4D Millimeter-Wave Radar.

Published in:

Sensors (14248220), 2025, v. 25, n. 15, p. 4640, doi. 10.3390/s25154640

By:

Cai, Yongjun;
Bai, Jie;
Shen, Hui-Liang;
Huang, Libo;
Rao, Bing;
Wang, Haiyang

Publication type:

Article

High-Quality Chemical Mechanical Polishing of Gold using the I<sub>2</sub>-I<sup>−</sup> System for Interconnects Application.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 9, p. 7717, doi. 10.1007/s11664-025-12088-y

By:

Shi, Zhikang;
Zhang, Yongshun;
Li, Xin;
Li, Xinzhu;
Tian, Yiming;
Han, Yanjun;
Sun, Pengfei;
Zhao, Qijian;
Jiang, Liang;
Qian, Linmao

Publication type:

Article

Quest for more Moore at the end of Device Downsizing.

Published in:

Journal of Circuits, Systems & Computers, 2025, v. 34, n. 16, p. 1, doi. 10.1142/S0218126624410032

By:

Wong, Hei;
Zhang, Jieqiong;
Liu, Jun

Publication type:

Article

Quantum clock synchronization with the silicon-chip based entangled photon source.

Published in:

2025

By:

Han, Hui;
Li, Jia-ao;
Tang, Bang-Ying;
Li, Jia-hao;
Huang, Jin-quan;
Chen, Huan;
Yu, Wan-Rong;
Liu, Bo;
Chen, Shu-hui

Publication type:

Conference Paper/Materials

Design and Fabrication of Cylindrical Fiber Backplanes with 2T1C Pixel Circuits for Truly Wearable Woven Displays.

Published in:

Small Structures, 2025, v. 6, n. 8, p. 1, doi. 10.1002/sstr.202500016

By:

Lee, Jiseong;
Park, Soyoon;
Kong, Seong Uk;
Park, Jiwoo;
Kim, Daehyun;
Choi, Kyung Cheol

Publication type:

Article

Work Function Engineering of Copper Sulfides for 2D Electronics.

Published in:

Small Structures, 2025, v. 6, n. 8, p. 1, doi. 10.1002/sstr.202500060

By:

Park, Hongju;
Lim, Jungmoon;
Kim, Taehun;
Byeon, Junsung;
Eom, Jaesik;
Lee, Seungsub;
Kim, Jaeseok;
Pak, Sangyeon;
Cha, SeungNam

Publication type:

Article

Arithmetic Logic Unit Circuit Based on Zinc Oxide Nanogap Schottky Diodes.

Published in:

Advanced Electronic Materials, 2025, v. 11, n. 12, p. 1, doi. 10.1002/aelm.202400940

By:

Bizak, Zhanibek;
Mazo‐Mantilla, Harold F.;
Luo, Linqu;
Florica, Camelia;
Melinte, Georgian;
Anthopoulos, Thomas D.;
Salama, Khaled N.

Publication type:

Article

Design of translinear circuit-based temperature-independent reference current.

Published in:

International Journal of Nanoelectronics & Materials, 2025, v. 18, n. 3, p. 374, doi. 10.58915/ijneam.v18i3.1143

By:

Mohammed, Alaa H.;
Muhamad, Maizan;
Burham, Norhafizah;
Hussin, Hanim

Publication type:

Article

Cladding‐Free On‐Chip Ultracompact Photonic Devices.

Published in:

Laser & Photonics Reviews, 2025, v. 19, n. 15, p. 1, doi. 10.1002/lpor.202402117

By:

Li, Xinrui;
Chen, Qiaolu;
Bai, Liga;
Li, Wenhao;
Chen, Fujia;
Ren, Yudong;
Pan, Yuang;
Han, Ning;
Tong, Mingyu;
Zhang, Lu;
Chen, Hongsheng;
Yang, Yihao

Publication type:

Article

Memristive Neural Network Circuit of Negative Emotion Inhibition With Self‐Repair and Memory.

Published in:

International Journal of Circuit Theory & Applications, 2025, v. 53, n. 8, p. 4890, doi. 10.1002/cta.4365

By:

Wan, Qiuzhen;
Sun, Kunliang;
Liu, Tieqiao;
Qin, Peng

Publication type:

Article

高密度集成电路散热用高导热金刚石/铜复合材料研究进展.

Published in:

Acta Materiae Compositae Sinica, 2025, v. 42, n. 8, p. 4205, doi. 10.13801/j.cnki.fhclxb.20241223.003

By:

李丹丹;
刘张慧;
冯劲松;
黄国杰;
王冰;
王如志

Publication type:

Article

高密度集成电路散热用高导热金刚石/铜复合材料研究进展.

Published in:

Acta Materiae Compositae Sinica, 2025, v. 42, n. 8, p. 4205, doi. 10.13801/j.cnki.fhclxb.20241223.003

By:

李丹丹;
刘张慧;
冯劲松;
黄国杰;
王冰;
王如志

Publication type:

Article

Design and Experimental Validation of the Versatile Voltage Conveyor‐Based Novel Mixed‐Mode Universal Filter Configurations and Quadrature Oscillator.

Published in:

Journal of Electrical & Computer Engineering, 2025, v. 2025, p. 1, doi. 10.1155/jece/8832002

By:

Faseehuddin, Mohammad;
Shireen, Sadia;
Channumsin, Orapin;
Bhanja, Mousumi;
Tangsrirat, Worapong;
Hazra, Arpan

Publication type:

Article

Timed array architectures and integrated true-time delay elements for wideband millimeter-wave antenna arrays.

Published in:

International Journal of Microwave & Wireless Technologies, 2025, v. 17, n. 2, p. 190, doi. 10.1017/S1759078724001053

By:

Koch, Manuel;
Schönhärl, Stefan;
Breun, Sascha;
Fischer, Georg;
Weigel, Robert

Publication type:

Article

Gysel combiners with high-selectivity filtering characteristics: analysis and design.

Published in:

International Journal of Microwave & Wireless Technologies, 2025, v. 17, n. 2, p. 257, doi. 10.1017/S1759078724000904

By:

Fahmi, Mohamed M.;
Ruiz-Cruz, Jorge A.;
Mansour, Raafat R.

Publication type:

Article

A Plot for a Science Fiction Fable.

Published in:

Teachers College Record, 1981, v. 82, n. 3, p. 523, doi. 10.1177/016146818108200309

By:

Bohm, David

Publication type:

Article

A Bandwidth-Efficient Ternary Signaling Scheme for 1-D Partial-Response Channels.

Published in:

Journal of Multiple-Valued Logic & Soft Computing, 2012, v. 19, n. 1-3, p. 271

By:

YASUSHI YUMINAKA;
KYOHEI KAWANO

Publication type:

Article

Editor's notes.

Published in:

1995

By:

Goldstein, Richard

Publication type:

Editorial

HIGH-RESOLUTION MICROSCOPY OF 2D MATERIALS AND THE IMPLICATIONS FOR FUTURE DEVICE TECHNOLOGIES.

Published in:

Texas Journal of Microscopy, 2018, v. 49, n. 1, p. 6

By:

WALLACE, ROBERT M.

Publication type:

Article

Where are they now?

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 32

By:

Xu, Arthur

Publication type:

Article

A new paradigm for evaluating IC yield loss.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 47

By:

Ciplickas, Dennis;
Lee, Sherry F.;
Strojwas, Andrzej J.

Publication type:

Article

Brittlestar eyes: Key to future microlenses?

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 28
Publication type:: Article

Higher-density packaging innovations continue.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 28

By:

Burggraaf, Pieter

Publication type:

Article

Is chipmaking skill still a differentiator?

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Cycle time, 300mm in spotlight at automation conference.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Patented IC measures time to trillionths of a second.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 28

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

SMIF Integration and mini-environments cause users most grief.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 20
Publication type:: Article

WORLDWIDE HIGHLIGHTS.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

Economics will dictate the future.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Safety solutions for high-pressure gas cylinders.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 153

By:

Dubois, Ray;
Mayer, James

Publication type:

Article

Better EDA tool integration needed for growing SoC market.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 58

By:

Raisanen, Walfred

Publication type:

Article

Chipmakers to compete with assembly houses for SiP.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 51
Publication type:: Article

System-on-a-chip challenged by stacked system-in-a-package technology*.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 48

By:

Asakura, Hiroshi

Publication type:

Article

Floating 3-D display seemingly out of sci-fi.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 28
Publication type:: Article

2001": The 'make or break' year for 300mm wafer transition goals.

Published in:

Solid State Technology, 2001, v. 44, n. 5, p. 174

By:

Ghiselli, Jack

Publication type:

Article

IBM, MOSIS get SiGe wit it.

Published in:: Solid State Technology, 2001, v. 44, n. 5, p. 28
Publication type:: Article

Advanced IC packaging: Markets and trends.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 44

By:

Winkler, Sandra

Publication type:

Article

Meeting ITRS Roadmap challenges with low-kappa dielectric etching.

Published in:

Solid State Technology, 2001, v. 44, n. 3, p. 107

By:

Thomas, D. J.;
Song, Y. P.;
Powell, K.

Publication type:

Article

Communicant Semiconductor Technologies.

Published in:: Solid State Technology, 2001, v. 44, n. 3, p. 46
Publication type:: Article

Integrating backend processes.

Published in:

Solid State Technology, 2001, v. 44, n. 2, p. 78

By:

Novitsky, John;
Miller, Chuck

Publication type:

Article

Emergence of atomic layer processes.

Published in:

Solid State Technology, 2001, v. 44, n. 1, p. 70

By:

Raaijmakers, Ivo

Publication type:

Article

Schlumberger makes progress in flip chip probing.

Published in:

Solid State Technology, 2001, v. 44, n. 1, p. 36

By:

Demmin, Jeffrey

Publication type:

Article

Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits.

Published in:

Solid State Technology, 2000, v. 43, n. 11, p. 125

By:

Wyant, J.L.;
Schuckert, C.C.

Publication type:

Article

Broadening the platforms for system-in-package solutions.

Published in:

Solid State Technology, 2000, v. 43, n. 11, p. 115

By:

Truzzi, Claudia;
Lerner, Steve

Publication type:

Article

Defects from substrate particles depend on the sputter deposition process.

Published in:

Solid State Technology, 2000, v. 43, n. 11, p. 95

By:

Mirkarimi, P.B.;
Baker, S.L.;
Wall, M.A.;
Kearney, P.A.;
Stearns, D.G.

Publication type:

Article

System-on-a-chip: Not as easy as it looks.

Published in:

2000

By:

Haavind, Robert

Publication type:

Editorial

A re-examination of silicon wafer specifications.

Published in:

Solid State Technology, 2000, v. 43, n. 10, p. 210

By:

Huff, Howard R.

Publication type:

Article

The SiGe IC market in a wireless, broadband world.

Published in:

Solid State Technology, 2000, v. 43, n. 9, p. 59

By:

Catalano, Anthony

Publication type:

Article