Works matching DE "INTEGRATED circuit reliability"

Results: 15

Reliability of printed circuit boards containing lead-free solder in aggressive environments.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 4, p. 400, doi. 10.1007/s10854-010-0150-7

By:

Moshrefi-Torbati, M.;
Swingler, J.

Publication type:

Article

A thermal protection module for automotive integrated circuits.

Published in:

Modern Physics Letters B, 2017, v. 31, n. 19-21, p. -1, doi. 10.1142/S0217984917400978

By:

Han, Yifeng;
Zhai, Mingjing;
Zhou, Junfeng

Publication type:

Article

A Reliability-Aware Methodology to Isolate Timing-Critical Paths under Aging.

Published in:

Journal of Electronic Testing, 2017, v. 33, n. 6, p. 721, doi. 10.1007/s10836-017-5692-7

By:

Srivastava, Ankush;
Singh, Virendra;
Singh, Adit;
Saluja, Kewal

Publication type:

Article

Performance Degradation Tolerance Analysis and Design for Effective Yield Enhancement.

Published in:

Journal of Electronic Testing, 2015, v. 31, n. 5/6, p. 427, doi. 10.1007/s10836-015-5546-0

By:

Hsieh, Tong-Yu;
Wang, Chih-Hao;
Kuo, Chun-Wei;
Huang, Shu-Yu;
Chih, Tsung-Liang

Publication type:

Article

Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development.

Published in:

Journal of Electronic Testing, 2015, v. 31, n. 1, p. 107, doi. 10.1007/s10836-014-5495-z

By:

Vock, Stefan;
Escalona, Omar;
Turner, Colin

Publication type:

Article

Using Error Correcting Codes Without Speed Penalty in Embedded Memories: Algorithm, Implementation and Case Study.

Published in:

Journal of Electronic Testing, 2013, v. 29, n. 3, p. 383, doi. 10.1007/s10836-013-5386-8

By:

Bonnoit, Thierry;
Nicolaidis, Michael;
Zergainoh, Nacer-Eddine

Publication type:

Article

Fault Diagnosis In Vlsi Chips Using Different Strategies.

Published in:

International Journal of Advanced Research in Computer Science, 2012, v. 3, n. 2, p. 309

By:

Sharma, Divya;
Kaushik, B. K.;
Agarwal, R. P.

Publication type:

Article

Programmed Tool for Quantifying Reliability and Its Application in Designing Circuit Systems.

Published in:

Journal of Electrical & Computer Engineering, 2014, p. 1, doi. 10.1155/2014/410758

By:

Singh, N. S. S.

Publication type:

Article

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6

By:

Lee, K.-O.

Publication type:

Article

IARPA Workshop on Circuit Analysis Tools.

Published in:

2009

By:

Vanderlinde, Bill

Publication type:

Proceeding

Simultaneous large-scale reliability analysis of ultra-thin MOS gate dielectrics using an automated test system.

Published in:

Advances in Radio Science, 2008, v. 6, p. 205, doi. 10.5194/ars-6-205-2008

By:

Domdey, A.;
Hafkemeyer, K. M.;
Krautschneider, W. H.;
Schroeder, D.

Publication type:

Article

Worth the paper it's printed on.

Published in:: Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 5, p. 231, doi. 10.1049/el.2019.0508
Publication type:: Article

Interview.

Published in:

2019

By:

Kossel, Marcel

Publication type:

Interview

Process Optimization for 3-D IC Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 4, p. 219, doi. 10.4071/imaps.474

By:

Woychik, Charles G.;
Lee, Sangil;
McGrath, Scott;
Arkalgud, Sitaram

Publication type:

Article

Post-layout Redundant Via Insertion Approach Considering Multiple Via Configuration.

Published in:

Circuits, Systems & Signal Processing, 2015, v. 34, n. 10, p. 3353, doi. 10.1007/s00034-015-0010-z

By:

Kan, Tsang-Chi;
Ruan, Shanq-Jang;
Chang, Ting-Feng;
Yang, Shih-Hsien

Publication type:

Article