Works matching DE "INTEGRATED circuit passivation"
1
- Corrosion Engineering, Science & Technology, 2011, v. 46, n. 2, p. 159, doi. 10.1179/1743278210Y.0000000018
- Nakayama, G;
- Sakakibara, Y;
- Kawakami, S
- Article
2
- Corrosion Engineering, Science & Technology, 2009, v. 44, n. 4, p. 261, doi. 10.1179/174327808X326928
- Abd El-Haleem, S. M.;
- Abd El-Aal, E. E.;
- El-Wanees, S. Abd
- Article
3
- Scientific Reports, 2014, p. 1, doi. 10.1038/srep05548
- Le Huang;
- Huilong Xu;
- Zhiyong Zhang;
- Chengying Chen;
- Jianhua Jiang;
- Xiaomeng Ma;
- Bingyan Chen;
- Zishen Li;
- Hua Zhong;
- Lian-Mao Peng
- Article
4
- International Journal of Corrosion, 2011, p. 1, doi. 10.1155/2011/103785
- Naibao Huang;
- Chenghao Liang;
- Hongtao Wang;
- Lishuang Xu;
- Hongfeng Xu
- Article
5
- Journal of the American Ceramic Society, 2010, v. 93, n. 6, p. 1554, doi. 10.1111/j.1551-2916.2009.03577.x
- Deuk Ho Yeon;
- Kyung Kon Kim;
- Nam Gyu Park;
- Yong Soo Cho
- Article
6
- Journal of the American Ceramic Society, 2008, v. 91, n. 6, p. 2064, doi. 10.1111/j.1551-2916.2008.02378.x
- Wan Ping Chen;
- Kan Zhu;
- Yu Wang;
- Chan, Helen L. W.;
- Jun Wu;
- Chang He Ye
- Article
7
- Advances in OptoElectronics, 2008, p. 1, doi. 10.1155/2008/485467
- Hofmann, M.;
- Kambor, S.;
- Schmidt, C.;
- Grambole, D.;
- Rentsch, J.;
- Glunz, S. W.;
- Preu, R.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 20718, doi. 10.1007/s10854-018-0212-9
- Li, Chuang;
- Chen, Gang;
- Wang, Wenwu;
- Zhang, Jingquan;
- Wu, Lili;
- Hao, Xia;
- Feng, Lianghuan
- Article
9
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12459, doi. 10.1007/s10854-016-5706-8
- Shinde, Onkar;
- Funde, Adinath;
- Agarwal, Mohit;
- Jadkar, Sandesh;
- Mahamuni, Shailaja;
- Dusane, Rajiv;
- Dhere, Neelkanth;
- Ghaisas, Subhash
- Article
10
- Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 275, doi. 10.1002/qre.4680060410
- Pecht, Michael;
- Lall, Pradeep;
- Whelan, Stanley J.
- Article
11
- Nanomaterials (2079-4991), 2018, v. 8, n. 7, p. 460, doi. 10.3390/nano8070460
- Kanae Hori;
- Yaohong Zhang;
- Pimsiri Tusamalee;
- Naoki Nakazawa;
- Yasuha Yoshihara;
- Ruixiang Wang;
- Taro Toyoda;
- Shuzi Hayase;
- Qing Shen
- Article
12
- Journal of Adhesion Science & Technology, 2004, v. 18, n. 2, p. 275, doi. 10.1163/156856104772759467
- Article
13
- Energies (19961073), 2018, v. 11, n. 4, p. 939, doi. 10.3390/en11040939
- Dong, Peng;
- Zhang, Yuming;
- Guo, Hui;
- Zhang, Chenxu;
- Ma, Jikui;
- Qu, Xiaoyong;
- Zhang, Chunfu
- Article
14
- Energies (19961073), 2017, v. 10, n. 1, p. 14, doi. 10.3390/en10010014
- Feifan Ji;
- Ji Xiang;
- Wuhua Li;
- Quanming Yue
- Article
15
- Semiconductors, 2018, v. 52, n. 16, p. 2096, doi. 10.1134/S1063782618160145
- Kotlyar, K. P.;
- Soshnikov, I. P.;
- Morozov, I. A.;
- Berezovskaya, T. N.;
- Kryzhanovskaya, N. V.;
- Kudryashov, D. A.;
- Lysak, V. V.
- Article
16
- International Journal of Fracture, 2003, v. 122, n. 1/2, p. 47, doi. 10.1023/B:FRAC.0000005374.52613.83
- Yosibash, Z.;
- Adan, O.;
- Schneck, R.;
- Atlas, H.
- Article
17
- Microwave & Optical Technology Letters, 2010, v. 52, n. 7, p. 1614, doi. 10.1002/mop.25266
- Heng-Kuang Lin;
- Hsiang-Lin Yu;
- Huang, F.-H.
- Article
18
- Microwave & Optical Technology Letters, 2001, v. 29, n. 2, p. 81, doi. 10.1002/mop.1090
- Li Hongqin;
- Sun Xiaowei;
- Xia Guanqun
- Article
19
- Microwave & Optical Technology Letters, 1999, v. 21, n. 4, p. 235, doi. 10.1002/(SICI)1098-2760(19990520)21:4<235::AID-MOP1>3.0.CO;2-W
- Driad, R.;
- McKinnon, W. R.;
- Laframboise, S.;
- McAlister, S. P.
- Article
20
- Protection of Metals, 2007, v. 43, n. 4, p. 321, doi. 10.1134/S0033173207040029
- Alekseev, Yu. V.;
- Alekseev, I. Yu.
- Article
21
- Integrated Ferroelectrics, 2007, v. 88, n. 1, p. 76, doi. 10.1080/10584580601099009
- Ki Yong Choi;
- Dae Sung Yoon;
- Tae Song Kim;
- Duck Kyun Choi
- Article
22
- Physica Status Solidi - Rapid Research Letters, 2019, v. 13, n. 2, p. N.PAG, doi. 10.1002/pssr.201800493
- Cheng, Chun‐Hu;
- Fan, Chia‐Chi;
- Hsu, Hsiao‐Hsuan;
- Wang, Shih‐An;
- Chang, Chun‐Yen
- Article
23
- Physica Status Solidi - Rapid Research Letters, 2019, v. 13, n. 2, p. N.PAG, doi. 10.1002/pssr.201800505
- Zhang, Wenwen;
- Lei, Xiaoli;
- Liu, Jihong;
- Dong, Jun;
- Yan, Xuewen;
- Gao, Wei;
- Dong, Hua;
- Ran, Chenxin;
- Wu, Zhaoxin
- Article
24
- International Journal of Control, 2008, v. 81, n. 9, p. 1424, doi. 10.1080/00207170701824163
- Hernandez-Briones, P. G.;
- Escobar, G.;
- Ortega, R.;
- Hernandez-Gomez, M.
- Article
25
- International Journal of Control, 2004, v. 77, n. 6, p. 517, doi. 10.1080/00207170410001682498
- Jiao, Xiaohong;
- Shen, Tielong;
- Tamura, Katsutoshi
- Article
26
- Journal of Supercomputing, 2013, v. 65, n. 2, p. 697, doi. 10.1007/s11227-013-0933-8
- Stafiej, Janusz;
- Caprio, Dung;
- Bartosik, Łukasz
- Article
27
- Crystals (2073-4352), 2018, v. 8, n. 5, p. 226, doi. 10.3390/cryst8050226
- Zhou, Lu;
- Bo, Baoxue;
- Yan, Xingzhen;
- Wang, Chao;
- Chi, Yaodan;
- Yang, Xiaotian
- Article
28
- NANO (1793-2920), 2008, v. 3, n. 3, p. 169, doi. 10.1142/S179329200800099X
- YANG, CHENG;
- RYU, SEUNG-HEON;
- LIM, YEONG-DAE;
- YOO, WON JONG
- Article
29
- Nature Nanotechnology, 2012, v. 7, n. 9, p. 577, doi. 10.1038/nnano.2012.127
- Ip, Alexander H.;
- Thon, Susanna M.;
- Hoogland, Sjoerd;
- Voznyy, Oleksandr;
- Zhitomirsky, David;
- Debnath, Ratan;
- Levina, Larissa;
- Rollny, Lisa R.;
- Carey, Graham H.;
- Fischer, Armin;
- Kemp, Kyle W.;
- Kramer, Illan J.;
- Ning, Zhijun;
- Labelle, André J.;
- Chou, Kang Wei;
- Amassian, Aram;
- Sargent, Edward H.
- Article
30
- Optica Applicata, 2011, v. 41, n. 2, p. 441
- DOMANOWSKA, ALINA;
- ADAMOWICZ, BOGUSŁAWA;
- BIDZINSKI, PIOTR;
- KLIMASEK, ANDRZEJ;
- SZEWCZENKO, JANUSZ;
- GUTT, TOMASZ;
- PRZEWŁOCKI, HENRYK
- Article
31
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 502, doi. 10.1007/s11664-012-2353-6
- Lim, D.;
- Fan, J.;
- Peng, L.;
- Leong, K.;
- Tan, C.
- Article
32
- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6
- Article
33
- Journal of Electronic Materials, 2012, v. 41, n. 3, p. 624, doi. 10.1007/s11664-011-1832-5
- Article
34
- Journal of Electronic Materials, 2011, v. 40, n. 8, p. 1668, doi. 10.1007/s11664-011-1640-y
- Licausi, Nicholas;
- Rao, Sunil;
- Bhat, Ishwara
- Article
35
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2681, doi. 10.1007/s11664-010-1367-1
- Arslan, Engin;
- Bütün, Serkan;
- Şafak, Yasemin;
- Ozbay, Ekmel
- Article
36
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2452, doi. 10.1007/s11664-010-1343-9
- Tadjer, Marko;
- Anderson, Travis;
- Hobart, Karl;
- Mastro, Michael;
- Hite, Jennifer;
- Caldwell, Joshua;
- Picard, Yoosuf;
- Kub, Fritz;
- Eddy, Charles
- Article
37
- Journal of Electronic Materials, 2010, v. 39, n. 7, p. 1019, doi. 10.1007/s11664-010-1083-x
- Zhang, J.;
- Tsen, G. K. O.;
- Antoszewski, J.;
- Dell, J. M.;
- Faraone, L.;
- Hu, W. D.
- Article
38
- Journal of Electronic Materials, 2010, v. 39, n. 7, p. 1015, doi. 10.1007/s11664-010-1090-y
- Kim, K. H.;
- Carcelén, V.;
- Bolotnikov, A. E.;
- Camarda, G. S.;
- Gul, R.;
- Hossain, A.;
- Yang, G.;
- Cui, Y.;
- James, R. B.
- Article
39
- Journal of Electronic Materials, 2010, v. 39, n. 7, p. 951, doi. 10.1007/s11664-010-1152-1
- Jaime-Vasquez, M.;
- Jacobs, R. N.;
- Benson, J. D.;
- Stoltz, A. J.;
- Almeida, L. A.;
- Bubulac, L. O.;
- Chen, Y.;
- Brill, G.
- Article
40
- Journal of Electronic Materials, 2010, v. 39, n. 7, p. 924, doi. 10.1007/s11664-010-1176-6
- Zhao, W. F.;
- Cook, J.;
- Parodos, T.;
- Tobin, S.;
- Smith, David
- Article
41
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1793, doi. 10.1007/s11664-006-0159-0
- Pal, R.;
- Malik, A.;
- Srivastav, V.;
- Sharma, B. L.;
- Dhar, V.;
- Sreedhar, B.;
- Vyas, H. P.
- Article
42
- Journal of Electronic Materials, 2006, v. 35, n. 6, p. 1429, doi. 10.1007/s11664-006-0279-6
- Min Yung Lee;
- Young Ho Kim;
- Nam Ho Lee;
- Yong Soo Lee;
- Hee Chul Lee
- Article
43
- Journal of Electronic Materials, 2006, v. 35, n. 6, p. 1385, doi. 10.1007/s11664-006-0272-0
- Boieriu, P.;
- Grein, C. H.;
- Garland, J.;
- Velicu, S.;
- Fulk, C.;
- Stoltz, A.;
- Bubulac, L.;
- Dinan, J. H.;
- Sivananthan, S.
- Article
44
- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1368, doi. 10.1007/s11664-005-0192-4
- Teynor, W. A.;
- Vaccaro, K.;
- Buchwald, W. R.;
- Dauplaise, H. M.;
- Morath, C. P.;
- Davis, A.;
- Roland, M. A.;
- Clark, W. R.
- Article
45
- Journal of Electronic Materials, 2004, v. 33, n. 7, p. 802, doi. 10.1007/s11664-004-0245-0
- Article
46
- Journal of Electronic Materials, 2004, v. 33, n. 5, p. 436
- Bernát, J.;
- Javorka, P.;
- Fox, A.;
- Marso, M.;
- Kordoš, P.
- Article
47
- Philosophical Magazine, 2010, v. 90, n. 21, p. 2925, doi. 10.1080/14786431003745294
- Karazhanov, S. Zh.;
- Ulyashin, A. G.
- Article
48
- Journal of Applied Electrochemistry, 2011, v. 41, n. 8, p. 973, doi. 10.1007/s10800-011-0324-x
- Suresh, Girija;
- Kamachi Mudali, U.;
- Baldev Raj
- Article
49
- Journal of Applied Electrochemistry, 2011, v. 41, n. 7, p. 873, doi. 10.1007/s10800-011-0308-x
- Ulaganathan, Jaganathan;
- Senior, Nick A.;
- Newman, Roger C.
- Article
50
- Journal of Applied Electrochemistry, 2009, v. 39, n. 9, p. 1633, doi. 10.1007/s10800-009-9849-7
- Heakal, Fakiha El-Taib;
- Fekry, Amany Mohammed;
- Fatayerji, Mohamad Ziad
- Article