Works matching DE "INTEGRATED circuit packaging"
Results: 23
Study on the Fluid-Structure Interaction at Different Layout of Stacked Chip in Molded Packaging.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2017, v. 42, n. 11, p. 4743, doi. 10.1007/s13369-017-2659-z
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- Article
FORECAST SALES OF SEMICONDUCTOR INDUSTRY IN TAIWAN.
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- CLEAR International Journal of Research in Commerce & Management, 2015, v. 6, n. 7, p. 1
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METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING.
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- Progress in Electromagnetics Research, 2012, v. 123, p. 1
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- Article
Optimal Parallel Machine Allocation Problem in IC Packaging Using IC-PSO: An Empirical Study.
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- Asia-Pacific Journal of Operational Research, 2017, v. 34, n. 6, p. -1, doi. 10.1142/S0217595917500348
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- Article
GEOLOCATION OF Cu WIRES DURING SENSITIVE 1C ACID DECAPSULATION.
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- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 30, doi. 10.31399/asm.edfa.2018-4.p030
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- Article
PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.
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- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 30, doi. 10.31399/asm.edfa.2016-1.p030
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TSV Developments.
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- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 46, doi. 10.31399/asm.edfa.2012-3.p046
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Space Domain Reflectometry for Opens Detection in Stacked-Die Packages.
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- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 22, doi. 10.31399/asm.edfa.2012-3.p022
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- Article
Magnetic Microscopy to Reconstruct 3-D Currents in Complex Systems.
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- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 12, doi. 10.31399/asm.edfa.2012-3.p012
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3-D System in Package--How to Cope with Increasing Challenges.
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- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 4, doi. 10.31399/asm.edfa.2012-3.p004
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- Article
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x
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- Article
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4
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- Article
Observations of IMC Formation for Au Wire Bonds to Al Pads.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 748, doi. 10.1007/s11664-011-1805-8
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Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 774, doi. 10.1007/s11664-012-1918-8
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- Article
Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6
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Reliability of lead-free solder joints in CSP device under thermal cycling.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1209, doi. 10.1007/s10854-014-1711-y
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- Article
Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages.
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- Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 3, p. 67, doi. 10.4071/001c.124091
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Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.
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- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 2, p. 35, doi. 10.4071/imaps.1064487
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Collective Cu-Cu Thermocompression Bonding Using Pillars.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 28, doi. 10.4071/imaps.741710
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Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs).
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 123, doi. 10.4071/imaps.522798
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An analytical framework for social life cycle impact assessment-part 2: case study of labor impacts in an IC packaging company.
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- International Journal of Life Cycle Assessment, 2017, v. 22, n. 5, p. 784, doi. 10.1007/s11367-016-1185-7
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- Article
Electrochemical deposition of contact structures for integrated circuit packaging.
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- Inorganic Materials, 2015, v. 51, n. 3, p. 294, doi. 10.1134/S0020168515030139
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- Article
Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection.
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- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5191, doi. 10.1007/s11664-018-6385-4
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- Article