Works matching DE "INTEGRATED circuit packaging"

Results: 23

Reliability of lead-free solder joints in CSP device under thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1209, doi. 10.1007/s10854-014-1711-y

By:

Zhang, Liang;
Sun, Lei;
Guo, Yong-huan;
He, Cheng-wen

Publication type:

Article

METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING.

Published in:

Progress in Electromagnetics Research, 2012, v. 123, p. 1

By:

Wu, B.;
Lo, H. L.

Publication type:

Article

Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages.

Published in:

Journal of Microelectronic & Electronic Packaging, 2024, v. 21, n. 3, p. 67, doi. 10.4071/001c.124091

By:

Wenhao (Eric) Li;
Eid, Feras;
Yoshihiro Tomita;
Swan, Johanna

Publication type:

Article

Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.

Published in:

Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 2, p. 35, doi. 10.4071/imaps.1064487

By:

Thomas, Tina;
van Dijk, Marius;
Dreissigacker, Marc;
Hoffmann, Stefan;
Walter, Hans;
Becker, Karl-Friedrich;
Schneider-Ramelow, Martin

Publication type:

Article

Collective Cu-Cu Thermocompression Bonding Using Pillars.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 28, doi. 10.4071/imaps.741710

By:

Carroll, Robert;
La Tulipe, Douglas;
Coolbaugh, Douglas;
Geer, Robert

Publication type:

Article

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs).

Published in:

Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 123, doi. 10.4071/imaps.522798

By:

Lau, John;
Ming Li;
Fan, Nelson;
Kuah, Eric;
Zhang Li;
Kim Hwee Tan;
Chen, Tony;
Xu, Iris;
Li, Margie;
Cheung, Y. M.;
Wu Kai;
Ji Hao;
Beica, Rozalia;
Taylor, Tom;
Ko, C. T.;
Yang, Henry;
Chen, Y. H.;
Sze Pei Lim;
Lee, N. C.;
Jiang Ran

Publication type:

Article

Study on the Fluid-Structure Interaction at Different Layout of Stacked Chip in Molded Packaging.

Published in:

Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2017, v. 42, n. 11, p. 4743, doi. 10.1007/s13369-017-2659-z

By:

Ishak, M.;
Abdullah, M.;
Aziz, M.;
Saad, A.;
Loh, W.;
Ooi, R.;
Ooi, C.

Publication type:

Article

Optimal Parallel Machine Allocation Problem in IC Packaging Using IC-PSO: An Empirical Study.

Published in:

Asia-Pacific Journal of Operational Research, 2017, v. 34, n. 6, p. -1, doi. 10.1142/S0217595917500348

By:

Cuckler, Robert;
Chang, Kuo-Hao;
Hsieh, Liam Y.

Publication type:

Article

Electrochemical deposition of contact structures for integrated circuit packaging.

Published in:

Inorganic Materials, 2015, v. 51, n. 3, p. 294, doi. 10.1134/S0020168515030139

By:

Roshchin, V.;
Dshkhunyan, V.;
Petukhov, I.;
Sen'chenko, K.;
Kukhtyaeva, V.

Publication type:

Article

FORECAST SALES OF SEMICONDUCTOR INDUSTRY IN TAIWAN.

Published in:

CLEAR International Journal of Research in Commerce & Management, 2015, v. 6, n. 7, p. 1

By:

CHENG-WEN LEE;
TSAI-LUN CHO

Publication type:

Article

GEOLOCATION OF Cu WIRES DURING SENSITIVE 1C ACID DECAPSULATION.

Published in:

Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 30, doi. 10.31399/asm.edfa.2018-4.p030

By:

Obein, Michael

Publication type:

Article

PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.

Published in:

Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 30, doi. 10.31399/asm.edfa.2016-1.p030

By:

Madala, Surendra

Publication type:

Article

TSV Developments.

Published in:

Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 46, doi. 10.31399/asm.edfa.2012-3.p046

By:

Vardaman, E. Jan

Publication type:

Article

3-D System in Package--How to Cope with Increasing Challenges.

Published in:

Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 4, doi. 10.31399/asm.edfa.2012-3.p004

By:

Mack, Walter

Publication type:

Article

Space Domain Reflectometry for Opens Detection in Stacked-Die Packages.

Published in:

Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 22, doi. 10.31399/asm.edfa.2012-3.p022

By:

Gaudestad, Jan;
Talanov, Vladimir V.;
Huang, Po Chih

Publication type:

Article

Magnetic Microscopy to Reconstruct 3-D Currents in Complex Systems.

Published in:

Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 12, doi. 10.31399/asm.edfa.2012-3.p012

By:

Infante, Fulvio

Publication type:

Article

An analytical framework for social life cycle impact assessment-part 2: case study of labor impacts in an IC packaging company.

Published in:

International Journal of Life Cycle Assessment, 2017, v. 22, n. 5, p. 784, doi. 10.1007/s11367-016-1185-7

By:

Wang, Sheng-Wen;
Hsu, Chia-Wei;
Hu, Allen

Publication type:

Article

Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5191, doi. 10.1007/s11664-018-6385-4

By:

Pun, Kelvin P. L.;
Islam, M. N.;
Rotanson, Jason;
Cheung, Chee-wah;
Chan, Alan H. S.

Publication type:

Article

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x

By:

Lin, Shih-kang;
Cho, Cheng-liang;
Chang, Hao-miao

Publication type:

Article

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4

By:

Hsu, Hao;
Lin, Tzu-Yang;
Ouyang, Fan-Yi

Publication type:

Article

Observations of IMC Formation for Au Wire Bonds to Al Pads.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 748, doi. 10.1007/s11664-011-1805-8

By:

DeLucca, John;
Osenbach, John;
Baiocchi, Frank

Publication type:

Article

Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 774, doi. 10.1007/s11664-012-1918-8

By:

Chin, J.W.C.;
Kok, C.K.;
Rajmohan, M.M.;
Yeo, V.S.H.;
Said, M.R.

Publication type:

Article

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6

By:

Lee, K.-O.

Publication type:

Article