Works matching DE "INTEGRATED circuit metallization"

40 µm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C.

Published in:

Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 3, p. 120, doi. 10.4071/imaps.379

By:

• Wen P. Lin;
• Chu-Hsuan Sha;
• Chin C. Lee

Publication type:

Article