Works about INTEGRATED circuit interconnections

Results: 861

THE MYSTERY OF THE SCHUBERT SONG: THE LINKED DATA PROMISE.

Published in:

Notes, 2017, v. 74, n. 1, p. 9, doi. 10.1353/not.2017.0071

By:

KIMMY SZETO

Publication type:

Article

Problems bubble to the top [metal interconnect systems].

Published in:

Electronics Systems & Software, 2006, v. 4, n. 3, p. 34, doi. 10.1049/ess:20060306

By:

Collins, L.

Publication type:

Article

Yield grows by X.

Published in:

Electronics Systems & Software, 2005, v. 3, n. 3, p. 26

By:

Strojwas, Andrzej J.;
Thurnaty, Kalyan;
Arora, Narain

Publication type:

Article

Selete spreads electrode for careful polishing.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 3, p. 10
Publication type:: Article

Cellulose Nanofiber Supported 3D Interconnected BN Nanosheets for Epoxy Nanocomposites with Ultrahigh Thermal Management Capability.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 5, p. n/a, doi. 10.1002/adfm.201604754

By:

Chen, Jin;
Huang, Xingyi;
Zhu, Yingke;
Jiang, Pingkai

Publication type:

Article

Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle Inks.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 43, p. 6834, doi. 10.1002/adfm.201401312

By:

Sadie, Jacob A.;
Subramanian, Vivek

Publication type:

Article

Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19543, doi. 10.1007/s10854-021-06473-6

By:

Wang, Cong;
Li, Chuanqiang;
Luo, Zhi;
Li, Ming;
Lin, Nai;
Ding, Kaiwen;
Man, Shu;
Duan, Ji'an

Publication type:

Article

Performance analysis of irradiation induced defected mixed CNT bundle based coupled VLSI interconnects.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 23, p. 21569, doi. 10.1007/s10854-020-04670-3

By:

Sharma, Manvi;
Rai, Mayank Kumar;
Khanna, Rajesh

Publication type:

Article

Influence of variable temperature on performance of mixed-MWCNT, MWCNT and SWCNT nanostructures as interconnects for high-performance VLSI-IC design.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 1828, doi. 10.1007/s10854-019-02699-7

By:

Jindal, Pardeep Kumar;
Sandha, Karmjit Singh

Publication type:

Article

Cantilever testing of sintered-silver interconnects.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 2, p. 1530, doi. 10.1007/s10854-017-8063-3

By:

Wereszczak, Andrew A.;
Chen, Branndon R.;
Jadaan, Osama M.;
Oistad, Brian A.;
Modugno, Max C.;
Sharp, Jeffrey W.;
Salvador, James R.

Publication type:

Article

Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13750, doi. 10.1007/s10854-017-7219-5

By:

Singh, Gurbinder;
Haseeb, A.

Publication type:

Article

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x

By:

Zhou, Guoyun;
Mao, Yingjie;
Wang, Chong;
Wang, Shouxu;
Chen, Yuanming;
He, Wei

Publication type:

Article

Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current stressing.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2278, doi. 10.1007/s10854-015-2681-4

By:

Huang, M.;
Zhang, F.;
Yang, F.;
Zhao, N.

Publication type:

Article

Deposition of Cu-Mn alloy film from supercritical carbon dioxide for advanced interconnects.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 11, p. 4439, doi. 10.1007/s10854-013-1422-9

By:

Zhao, Bin;
Zhang, Yanfei;
Yang, Junhe

Publication type:

Article

Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 211, doi. 10.1007/s10854-012-0714-9

By:

Liu, H.;
Zhu, Q.;
Wang, Z.;
Guo, J.;
Shang, J.

Publication type:

Article

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 703, doi. 10.1007/s10854-011-0357-2

By:

Doosoo Kim;
Jong-hyeon Chang;
Jungil Park;
Pak, James Jungo

Publication type:

Article

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8

By:

Sekhar, V. N.;
Chai, T. C.;
Balakumar, S.;
Lu Shen;
Sinha, S. K.;
Tay, A. A. O.;
Seung Wook Yoon

Publication type:

Article

Life expectancies of Pb-free SAC solder interconnects in electronic hardware.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 229

By:

Michael Osterman;
Abhijit Dasgupta

Publication type:

Article

Vibration suppression for mass-spring-damper systems with a tuned mass damper using interconnection and damping assignment passivity-based control.

Published in:

International Journal of Robust & Nonlinear Control, 2016, v. 26, n. 2, p. 235, doi. 10.1002/rnc.3307

By:

Aoki, Takashi;
Yamashita, Yuh;
Tsubakino, Daisuke

Publication type:

Article

Reduction of the small gain condition for large-scale interconnections.

Published in:

International Journal of Robust & Nonlinear Control, 2015, v. 25, n. 6, p. 842, doi. 10.1002/rnc.3111

By:

Dashkovskiy, S.;
Kosmykov, M.

Publication type:

Article

Consensus of positive real systems cascaded with a single integrator.

Published in:

International Journal of Robust & Nonlinear Control, 2015, v. 25, n. 3, p. 418, doi. 10.1002/rnc.3093

By:

Oh, Kwang‐Kyo;
Lashhab, Fadel;
Moore, Kevin L.;
Vincent, Tyrone L.;
Ahn, Hyo‐Sung

Publication type:

Article

Distributed control of linear time-varying systems interconnected over arbitrary graphs.

Published in:

International Journal of Robust & Nonlinear Control, 2015, v. 25, n. 2, p. 179, doi. 10.1002/rnc.3081

By:

Farhood, Mazen;
Di, Zhe;
Dullerud, Geir E.

Publication type:

Article

A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 1/2, p. 47, doi. 10.1007/s00170-022-10775-2

By:

Yan, Han;
Niu, Xinhuan;
Qu, Minghui;
Luo, Fu;
Zhan, Ni;
Liu, Jianghao;
Zou, Yida

Publication type:

Article

Primary Frequency Regulation with Battery Energy Storage Systems in the Ecuadorian Power System.

Published in:

Leonardo, 2022, v. 55, n. 4, p. 13, doi. 10.37116/revistaenergia.v19.n1.2022.506

By:

Chamba, M. S.;
Vargas, W.;
Echeverría, D.;
Riofrio, J.

Publication type:

Article

Mathematical analysis of interconnected photovoltaic arrays under different shading conditions.

Published in:

Cogent Engineering, 2018, v. 5, n. 1, p. 1, doi. 10.1080/23311916.2018.1507442

By:

Nnamchi, S.N.;
Oko, C.O.C.;
Kamen, F.L;
Sanya, O.D.

Publication type:

Article

A NOVEL SCHEME OF CROSS BITLINES FOR FeRAM ARRAY.

Published in:

Integrated Ferroelectrics, 2006, v. 81, n. 1, p. 131, doi. 10.1080/10584580600660173

By:

Ze Jia;
Tian-Ling Ren;
Li-Tian Liu

Publication type:

Article

The Edge Connectivity of Expanded k-Ary n-Cubes.

Published in:

Discrete Dynamics in Nature & Society, 2018, p. 1, doi. 10.1155/2018/7867342

By:

Wang, Shiying;
Wang, Mujiangshan

Publication type:

Article

FOSquare: A Novel Optical HPC Interconnect Network Architecture Based on Fast Optical Switches with Distributed Optical Flow Control.

Published in:

Photonics, 2021, v. 8, n. 1, p. 11, doi. 10.3390/photonics8010011

By:

Yan, Fulong;
Yuan, Changshun;
Li, Chao;
Deng, Xiong

Publication type:

Article

Photodetector with Controlled Relocation of Carrier Density Peaks: Concept and Numerical Simulation.

Published in:

Photonics, 2020, v. 7, n. 1, p. 21, doi. 10.3390/photonics7010021

By:

Pisarenko, Ivan;
Ryndin, Eugeny

Publication type:

Article

ENHANCED ONOS SDN CONTROLLERS DEPLOYMENT FOR FEDERATED MULTI-DOMAIN SDN-CLOUD WITH SD-ROUTING-EXCHANGE.

Published in:

Malaysian Journal of Computer Science, 2017, v. 30, n. 2, p. 134, doi. 10.22452/mjcs.vol30no2.5

By:

Risdianto, Aris Cahyadi;
Pang-Wei Tsai;
Teck Chaw Ling;
Chu-Sing Yang;
JongWon Kim

Publication type:

Article

Key technologies for flexible interconnection in urban power grid and pilot demonstration.

Published in:

International Transactions on Electrical Energy Systems, 2018, v. 28, n. 8, p. 1, doi. 10.1002/etep.2570

By:

Xiao, Jun;
Yi, Lida;
Bai, Linquan;
Yin, Changxin;
Huang, Renle;
Jiang, Xun;
Guo, Wei

Publication type:

Article

IDA-PB control design for VSC-HVDC transmission based on PCHD model.

Published in:

International Transactions on Electrical Energy Systems, 2015, v. 25, n. 10, p. 2133, doi. 10.1002/etep.1953

By:

Fan, Xinming;
Guan, Lin;
Xia, Chengjun;
Ji, Tianyao

Publication type:

Article

FE optimization of the ejection force of a spring-maintained connector.

Published in:

Mechanics & Industry, 2016, v. 17, n. 6, p. 1, doi. 10.1051/meca/2016002

By:

BOGARD, FABIEN;
MURER, SÉBASTIEN;
DEBRAY, KARL;
NING YU;
BARTKOWIAK, BENOIT

Publication type:

Article

Versatile Fabrication of Complex Shaped Metal Oxide Nano-Microstructures and Their Interconnected Networks for Multifunctional Applications.

Published in:

KONA: Powder & Particle Journal, 2014, n. 31, p. 92, doi. 10.14356/kona.2014015

By:

Mishra, Yogendra Kumar;
Kaps, Sören;
Schuchardt, Arnim;
Paulowicz, Ingo;
Xin Jin;
Gedamu, Dawit;
Wille, Sebastian;
Lupan, Oleg;
Adelung, Rainer

Publication type:

Article

Study on circuit modeling of stretchable serpentine interconnects.

Published in:

International Journal of Circuit Theory & Applications, 2022, v. 50, n. 3, p. 988, doi. 10.1002/cta.3174

By:

Wu, Zhenyu;
Peng, Chaoqun;
Liao, Jiao;
Chen, Quanxiu

Publication type:

Article

Kron‐Branin modeling of symmetric star tree interconnect.

Published in:

International Journal of Circuit Theory & Applications, 2019, v. 47, n. 3, p. 391, doi. 10.1002/cta.2575

By:

Xu, Zhifei;
Ravelo, Blaise;
Maurice, Olivier;
Lalléchère, Sébastien;
Wan, Fayu

Publication type:

Article

Modeling of CMS‐based nonuniform interconnects using FDTD technique.

Published in:

International Journal of Circuit Theory & Applications, 2019, v. 47, n. 1, p. 43, doi. 10.1002/cta.2568

By:

Kolanti, Tulasi Naga Jyothi;
Vemu, Sulochana;
Vobulapuram, Ramesh Kumar;
Karumuri, Srinivasa Rao

Publication type:

Article

Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects.

Published in:

International Journal of Circuit Theory & Applications, 2018, v. 46, n. 2, p. 299, doi. 10.1002/cta.2384

By:

Rai, Mayank Kumar;
Arora, Shubham;
Kaushik, B. K.

Publication type:

Article

Complete stability of feedback CNNs with dynamic memristors and second-order cells.

Published in:

International Journal of Circuit Theory & Applications, 2016, v. 44, n. 11, p. 1959, doi. 10.1002/cta.2205

By:

Di Marco, Mauro;
Forti, Mauro;
Pancioni, Luca

Publication type:

Article

Temperature dependant crosstalk analysis in coupled single-walled carbon nanotube (SWCNT) bundle interconnects.

Published in:

International Journal of Circuit Theory & Applications, 2015, v. 43, n. 10, p. 1367, doi. 10.1002/cta.2013

By:

Rai, Mayank Kumar;
Sarkar, Sankar

Publication type:

Article

A PRIMER OF THE EUCLIDEAN STEINER PROBLEM.

Published in:

Annals of Operations Research, 1991, v. 33, n. 1-4, p. 73, doi. 10.1007/BF02061658

By:

Hwang, F. K.

Publication type:

Article

OPTIMAL GUARANTEED COST CONTROL FOR NEUTRAL INTERCONNECTED SYSTEMS WITH A CLASS OF CONTROLLER GAIN PERTURBATIONS.

Published in:

International Journal of Information & Systems Sciences, 2011, v. 7, n. 4, p. 323

By:

HELI HU;
QINGLING ZHANG;
DAN ZHAO

Publication type:

Article

Methods for Division of Road Traffic Network for Distributed Simulation Performed on Heterogeneous Clusters.

Published in:

Computer Science & Information Systems, 2013, v. 10, n. 1, p. 321, doi. 10.2298/CSIS120601006P

By:

Potuzak, Tomas

Publication type:

Article

Reflection Budgeting Methodology for High-Speed Serial Link Signal Integrity Design.

Published in:

Progress in Electromagnetics Research B, 2021, v. 91, p. 59

By:

Allred, Richard J.;
Furse, Cynthia M.

Publication type:

Article

New De-Embedding Method with Look-Up Table for Characterization of High Speed Interconnects.

Published in:

Progress in Electromagnetics Research B, 2016, v. 65, p. 129, doi. 10.2528/pierb15110602

By:

Shaowu Huang;
Beomtaek Lee

Publication type:

Article

Identification of Main Factors of Uncertainty in a Microstrip Line Network.

Published in:

Progress in Electromagnetics Research, 2018, v. 162, p. 61, doi. 10.2528/pier18040607

By:

Larbi, Mourad;
Stievano, Igor S.;
Canavero, Flavio G.;
Besnier, Philippe

Publication type:

Article

A critical review of constitutive models for solders in electronic packaging.

Published in:

Advances in Mechanical Engineering (Sage Publications Inc.), 2017, v. 9, n. 8, p. 1, doi. 10.1177/1687814017714976

By:

Chen, Gang;
Zhao, Xiaochen;
Wu, Hao

Publication type:

Article

Symmetry-guided design of topologies for supercomputer networks.

Published in:

International Journal of Modern Physics C: Computational Physics & Physical Computation, 2018, v. 29, n. 7, p. N.PAG, doi. 10.1142/S0129183118500481

By:

Sabino, Alan U.;
Vasconcelos, Miguel F. S.;
Deng, Yuefan;
Ramos, Alexandre F.

Publication type:

Article

Can the structural robustness of complex networks be enhanced by interconnection?

Published in:

International Journal of Modern Physics C: Computational Physics & Physical Computation, 2015, v. 26, n. 4, p. -1, doi. 10.1142/S0129183115500400

By:

Ye, Bin;
Jia, Jia-Jia;
Zuo, Kang-Wei;
Ma, Xiao-Ping

Publication type:

Article

Scaling Challenges for Advanced CMOS Devices.

Published in:

International Journal of High Speed Electronics & Systems, 2017, v. 26, n. 1/2, p. -1, doi. 10.1142/S0129156417400018

By:

Jacob, Ajey P.;
Xie, Ruilong;
Sung, Min Gyu;
Liebmann, Lars;
Lee, Rinus T. P.;
Taylor, Bill

Publication type:

Article