Works matching DE "INTEGRATED circuit interconnections"
Results: 855
Testing the Reliability of Chips.
- Published in:
- Innovation, 2004, v. 4, n. 1, p. 5
- Publication type:
- Article
Query-driven soft traceability links for models.
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- Software & Systems Modeling, 2016, v. 15, n. 3, p. 733, doi. 10.1007/s10270-014-0436-y
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- Article
Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle Inks.
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- Advanced Functional Materials, 2014, v. 24, n. 43, p. 6834, doi. 10.1002/adfm.201401312
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- Article
Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration.
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- Journal of Materials Science, 2014, v. 49, n. 4, p. 1755, doi. 10.1007/s10853-013-7862-z
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- Article
Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications.
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- Journal of Materials Science, 2013, v. 48, n. 20, p. 7204, doi. 10.1007/s10853-013-7537-9
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- Article
The effect of metal layers on the morphology and optical properties of hydrothermally grown zinc oxide nanowires.
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- Journal of Materials Science, 2013, v. 48, n. 14, p. 4908, doi. 10.1007/s10853-013-7271-3
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- Publication type:
- Article
Synthesis and sintering of Sr- and Ca-doped lanthanum chromite ultrafine powder for SOFC interconnect.
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- Journal of Materials Science, 2013, v. 48, n. 4, p. 1401, doi. 10.1007/s10853-012-6889-x
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- Article
Reliability model of MMC-based flexible interconnection switch considering the effect of loading state uncertainty.
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- IET Power Electronics (Wiley-Blackwell), 2019, v. 12, n. 3, p. 358, doi. 10.1049/iet-pel.2018.5262
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- Publication type:
- Article
Ultra‐compact and ultra‐broadband hybrid plasmonic‐photonic vertical coupler with high coupling efficiency, directivity, and polarisation extinction ratio.
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- IET Optoelectronics (Wiley-Blackwell), 2022, v. 16, n. 3, p. 124, doi. 10.1049/ote2.12063
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- Publication type:
- Article
From Ideal Data Synchronization to Hybrid Forms of Interconnections: Architectures, Processes, and Data.
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- Journal of the Association for Information Systems, 2013, v. 14, n. 10, p. 550
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- Article
All-screen-printed back-contact back-junction silicon solar cells with aluminum-alloyed emitter and demonstration of interconnection of point-shaped metalized contacts.
- Published in:
- Progress in Photovoltaics, 2015, v. 23, n. 2, p. 226, doi. 10.1002/pip.2418
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- Article
A decentralized adaptive controller for multimachine power systems.
- Published in:
- International Journal of Energy Research, 2000, v. 24, n. 7, p. 571, doi. 10.1002/1099-114X(20000610)24:7<571::AID-ER601>3.0.CO;2-X
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- Publication type:
- Article
Out of the Blue: The Rise of CDN Networks.
- Published in:
- DigiWorld Economic Journal, 2016, n. 101, p. 107
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- Publication type:
- Article
Sketic: a machine learning-based digital circuit recognition platform.
- Published in:
- Turkish Journal of Electrical Engineering & Computer Sciences, 2020, v. 28, n. 4, p. 2030, doi. 10.3906/elk-1910-16
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- Article
A stable marriage-based request routing framework for interconnection CDNs.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2017, v. 25, n. 4, p. 3397, doi. 10.3906/elk-1604-172
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- Publication type:
- Article
Modeling and control of a 6-control-area interconnected power system to protect the network frequency applying different controllers.
- Published in:
- Turkish Journal of Electrical Engineering & Computer Sciences, 2016, v. 24, n. 4, p. 2205, doi. 10.3906/elk-1403-78
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- Article
Star-crossed cube: an alternative to star graph.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2014, v. 22, n. 3, p. 719, doi. 10.3906/elk-1202-44
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- Article
Microelectronic interconnect modeling with a periodical lumped RLC-network.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2013, v. 21, n. 3, p. 747, doi. 10.3906/elk-1105-52
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- Publication type:
- Article
Decentralized robust load-frequency control of power system based on quantitative feedback theory.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2011, v. 19, n. 4, p. 513, doi. 10.3906/elk-0808-22
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- Article
Construction and applications of the Dirichlet-to-Neumann operator in transmission line modeling.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2009, v. 17, n. 3, p. 205, doi. 10.3906/elk-0908-186
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- Article
Accurate Prediction of Crosstalk for RC Interconnects.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2009, v. 17, n. 1, p. 55
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- Publication type:
- Article
Toxicity remission of PAEs on multireceptors after molecular modification through a 3D-QSAR pharmacophore model coupled with a gray interconnect degree method.
- Published in:
- Turkish Journal of Chemistry, 2021, v. 45, n. 2, p. 307, doi. 10.3906/kim-2008-38
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- Publication type:
- Article
Metal on Graphenated Metal for VLSI Interconnects.
- Published in:
- Advanced Materials Interfaces, 2018, v. 5, n. 13, p. 1, doi. 10.1002/admi.201800270
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- Publication type:
- Article
Revealing Minor Electrical Losses in the Interconnecting Layers of Organic Tandem Solar Cells.
- Published in:
- Advanced Materials Interfaces, 2017, v. 4, n. 21, p. n/a, doi. 10.1002/admi.201700776
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- Publication type:
- Article
Facile Preparation of the Porous PDMS Oil-Absorbent for Oil/Water Separation.
- Published in:
- Advanced Materials Interfaces, 2017, v. 4, n. 3, p. n/a, doi. 10.1002/admi.201600862
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- Publication type:
- Article
Spontaneous Buckling of Multiaxially Flexible and Stretchable Interconnects Using PDMS/Fibrous Composite Substrates.
- Published in:
- Advanced Materials Interfaces, 2017, v. 4, n. 3, p. n/a, doi. 10.1002/admi.201600946
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- Publication type:
- Article
Efficient and Versatile Interconnection Layer by Solvent Treatment of PEDOT:PSS Interlayer for Air-Processed Organic Tandem Solar Cells.
- Published in:
- Advanced Materials Interfaces, 2016, v. 3, n. 23, p. n/a, doi. 10.1002/admi.201600770
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- Publication type:
- Article
CIRCUIT AND PROCESS INNOVATIONS TO ENABLE HIGH-PERFORMANCE, AND POWER AND AREA EFFICIENCY ON THE NEHALEM AND WESTMERE FAMILY OF INTEL PROCESSORS.
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- Intel Technology Journal, 2010, v. 14, n. 3, p. 104
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- Publication type:
- Article
THE FEEDING OF HIGH-PERFORMANCE PROCESSOR CORES--QUICKPATH INTERCONNECTS AND THE NEW I/O HUBS.
- Published in:
- Intel Technology Journal, 2010, v. 14, n. 3, p. 66
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- Publication type:
- Article
THE UNCORE: A MODULAR APPROACH TO FEEDING THE HIGH-PERFORMANCE CORES.
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- Intel Technology Journal, 2010, v. 14, n. 3, p. 30
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- Article
FLEXIBLE AND ADAPTIVE ON-CHIP INTERCONNECT FOR TERA-SCALE ARCHITECTURES.
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- Intel Technology Journal, 2009, v. 13, n. 4, p. 62
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- Publication type:
- Article
Materials Technology for Environmentally Green Micro-electronic Packaging.
- Published in:
- Intel Technology Journal, 2008, v. 12, n. 1, p. 1, doi. 10.1535/itj.1201.01
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- Article
On-Chip Optical Interconnects.
- Published in:
- Intel Technology Journal, 2004, v. 8, n. 2, p. 129
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- Publication type:
- Article
Seamless Connectivity to Wireless Local Area Networks.
- Published in:
- Intel Technology Journal, 2003, v. 7, n. 3, p. 58
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- Publication type:
- Article
130nm Logic Technology Featuring 60nm Transistors, Low-K Dielectrics, and Cu Interconnects.
- Published in:
- Intel Technology Journal, 2002, v. 6, n. 2, p. 5
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- Publication type:
- Article
High Density Interconnect Microstrip Patch Antenna for 5G Base Stations with Integrated Filtering Performance.
- Published in:
- Technologies (2227-7080), 2018, v. 6, n. 2, p. 45, doi. 10.3390/technologies6020045
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- Article
The Challenge of New Science.
- Published in:
- Performance Improvement Quarterly, 2007, v. 20, n. 2, p. 9
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- Publication type:
- Article
Stretchable electronic strips for electronic textiles enabled by 3D helical structure.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-61406-7
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- Publication type:
- Article
The Migration in and from the Community in the Knowledge-based Society.
- Published in:
- Annals of Philosophy, Social & Human Disciplines, 2014, v. 2, p. 77
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- Publication type:
- Article
Temperature Dependent IR-Drop Analysis in Graphene Nanoribbon Based Power Interconnect.
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- Journal of Nano- & Electronic Physics, 2016, v. 8, n. 1, p. 1, doi. 10.21272/jnep.8(1).01001
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- Publication type:
- Article
Simulation of Tunnel Junction in Cascade Solar Cell (GaAs/Ge) Using AMPS-1D.
- Published in:
- Journal of Nano- & Electronic Physics, 2014, v. 6, n. 4, p. 04001-1
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- Publication type:
- Article
FE optimization of the ejection force of a spring-maintained connector.
- Published in:
- Mechanics & Industry, 2016, v. 17, n. 6, p. 1, doi. 10.1051/meca/2016002
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- Publication type:
- Article
Stretchable strain-tolerant soft printed circuit board: a systematic approach for the design rules of stretchable interconnects.
- Published in:
- Journal of Information Display, 2020, v. 21, n. 1, p. 41, doi. 10.1080/15980316.2019.1680451
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- Publication type:
- Article
Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects.
- Published in:
- Applied Physics B: Lasers & Optics, 2012, v. 108, n. 1, p. 137, doi. 10.1007/s00340-012-5106-6
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- Publication type:
- Article
A study of using femtosecond LIBS in analyzing metallic thin film-semiconductor interface.
- Published in:
- Applied Physics B: Lasers & Optics, 2011, v. 102, n. 1, p. 197, doi. 10.1007/s00340-010-4144-1
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- Publication type:
- Article
Influence of distribution voltage control methods on maximum capacity of distributed generators.
- Published in:
- Electrical Engineering in Japan, 2005, v. 150, n. 1, p. 8, doi. 10.1002/eej.20050
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- Publication type:
- Article
Interconnection for Power Electronics Using Laser Ablation.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2018, v. 13, n. 2, p. 135, doi. 10.2961/jlmn.2018.02.0014
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- Publication type:
- Article
Low-Profile Interconnects via Laser-Induced Forward Transfer.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2018, v. 13, n. 2, p. 63, doi. 10.2961/jlmn.2018.02.0003
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- Publication type:
- Article
Laser-Induced Forward Transfer of Functional Materials: Advances and Future Directions.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2014, v. 9, n. 3, p. 192, doi. 10.2961/jlmn.2014.03.0002
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- Publication type:
- Article
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners.
- Published in:
- International Journal of Microwave & Optical Technology, 2014, v. 9, n. 1, p. 128
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- Publication type:
- Article