Works matching DE "INTEGRATED circuit interconnections"

Results: 855

Integrated Visual and Geometric Search Tools for Locating Desired Parts in a Part Database.

Published in:

Computer-Aided Design & Applications, 2005, v. 2, n. 6, p. 727, doi. 10.1080/16864360.2005.10738336

By:

Karnik, M. V.;
Anand, D. K.;
Eick, E.;
Gupta, S. K.;
Kavetsky, R.

Publication type:

Article

Si-based and Si-containing compounds in composite matrices and coatings for bipolar plates/interconnects, and in sealant materials for fuel cells.

Published in:

Materials for Renewable & Sustainable Energy, 2025, v. 14, n. 2, p. 1, doi. 10.1007/s40243-025-00310-0

By:

Antolini, Ermete;
Passos, Raimundo Ribeiro

Publication type:

Article

Efficient interconnection charges and capacity-based pricing.

Published in:

International Economics & Economic Policy, 2007, v. 4, n. 2, p. 135, doi. 10.1007/s10368-007-0085-5

By:

Kennet, D.;
Ralph, Eric

Publication type:

Article

Hot spots on an interconnection network for broadcast communication.

Published in:

Computer Systems Science & Engineering, 2004, v. 19, n. 1, p. 49

By:

Katsinis, C.

Publication type:

Article

Problems bubble to the top [metal interconnect systems].

Published in:

Electronics Systems & Software, 2006, v. 4, n. 3, p. 34, doi. 10.1049/ess:20060306

By:

Collins, L.

Publication type:

Article

Selete spreads electrode for careful polishing.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 3, p. 10
Publication type:: Article

Yield grows by X.

Published in:

Electronics Systems & Software, 2005, v. 3, n. 3, p. 26

By:

Strojwas, Andrzej J.;
Thurnaty, Kalyan;
Arora, Narain

Publication type:

Article

Cantilever testing of sintered-silver interconnects.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 2, p. 1530, doi. 10.1007/s10854-017-8063-3

By:

Wereszczak, Andrew A.;
Chen, Branndon R.;
Jadaan, Osama M.;
Oistad, Brian A.;
Modugno, Max C.;
Sharp, Jeffrey W.;
Salvador, James R.

Publication type:

Article

Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13750, doi. 10.1007/s10854-017-7219-5

By:

Singh, Gurbinder;
Haseeb, A.

Publication type:

Article

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x

By:

Zhou, Guoyun;
Mao, Yingjie;
Wang, Chong;
Wang, Shouxu;
Chen, Yuanming;
He, Wei

Publication type:

Article

Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current stressing.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2278, doi. 10.1007/s10854-015-2681-4

By:

Huang, M.;
Zhang, F.;
Yang, F.;
Zhao, N.

Publication type:

Article

Deposition of Cu-Mn alloy film from supercritical carbon dioxide for advanced interconnects.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 11, p. 4439, doi. 10.1007/s10854-013-1422-9

By:

Zhao, Bin;
Zhang, Yanfei;
Yang, Junhe

Publication type:

Article

Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 211, doi. 10.1007/s10854-012-0714-9

By:

Liu, H.;
Zhu, Q.;
Wang, Z.;
Guo, J.;
Shang, J.

Publication type:

Article

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 703, doi. 10.1007/s10854-011-0357-2

By:

Doosoo Kim;
Jong-hyeon Chang;
Jungil Park;
Pak, James Jungo

Publication type:

Article

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8

By:

Sekhar, V. N.;
Chai, T. C.;
Balakumar, S.;
Lu Shen;
Sinha, S. K.;
Tay, A. A. O.;
Seung Wook Yoon

Publication type:

Article

Life expectancies of Pb-free SAC solder interconnects in electronic hardware.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 229

By:

Michael Osterman;
Abhijit Dasgupta

Publication type:

Article

EFFICIENT CHARACTERIZATION OF MULTILEVEL INTERCONNECTIONS ON THE GaAs-BASED VLSICs.

Published in:

Microwave & Optical Technology Letters, 1988, v. 1, n. 7, p. 252, doi. 10.1002/mop.4650010709

By:

Goel, A. K.;
Huang, Y. R.

Publication type:

Article

THE SPECTRAL DISCRETIZATION OF TRANSMISSION LINE SYSTEM.

Published in:

Microwave & Optical Technology Letters, 1988, v. 1, n. 2, p. 53, doi. 10.1002/mop.4650010204

By:

Palusinski, O. A.;
Lee, Anyu

Publication type:

Article

Mathematical modeling of inhomogeneous traffic in a heterogeneous integrated corporate data control system.

Published in:

Automation & Remote Control, 2012, v. 73, n. 7, p. 1269, doi. 10.1134/S0005117912070168

By:

Govorskii, A.;
Kravets, O.

Publication type:

Article

FARCROSS PROJECT: INTRODUCTION TO DEVELOPING THE CO-OPTIMIZED MARKET DESIGN FOR ENERGY-RESERVE AUCTIONS OF CROSS-ZONAL CAPACITY WITH RESERVE CAPACITY.

Published in:

EMERG: Energy. Environment. Efficiency. Resources. Globalization, 2022, v. 8, n. 4, p. 36

By:

VASILE, Silvia Carmen;
BUNCEANU, Ramona Beatrice BUDAI

Publication type:

Article

Electric power transmission: An overview of associated burdens.

Published in:

International Journal of Energy Research, 2011, v. 35, n. 11, p. 979, doi. 10.1002/er.1745

By:

Doukas, H.;
Karakosta, C.;
Flamos, A.;
Psarras, J.

Publication type:

Article

Ultra‐Thin Chips with Printed Interconnects on Flexible Foils.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 5, p. 1, doi. 10.1002/aelm.202101029

By:

Ma, Sihang;
Kumaresan, Yogeenth;
Dahiya, Abhishek Singh;
Dahiya, Ravinder

Publication type:

Article

Self‐Healing Thin‐Film Transistor Circuits on Flexible Substrates.

Published in:

Advanced Electronic Materials, 2021, v. 7, n. 3, p. 1, doi. 10.1002/aelm.202001023

By:

Ding, Li;
Joshi, Pushkaraj;
Macdonald, James;
Parab, Virendra;
Sambandan, Sanjiv

Publication type:

Article

Ink Development and Printing of Conducting Polymers for Intrinsically Stretchable Interconnects and Circuits.

Published in:

Advanced Electronic Materials, 2020, v. 6, n. 1, p. N.PAG, doi. 10.1002/aelm.201900681

By:

Kraft, Ulrike;
Molina‐Lopez, Francisco;
Son, Donghee;
Bao, Zhenan;
Murmann, Boris

Publication type:

Article

A Stretchable‐Hybrid Low‐Power Monolithic ECG Patch with Microfluidic Liquid‐Metal Interconnects and Stretchable Carbon‐Black Nanocomposite Electrodes for Wearable Heart Monitoring.

Published in:

Advanced Electronic Materials, 2019, v. 5, n. 2, p. N.PAG, doi. 10.1002/aelm.201800463

By:

Li, Yida;
Luo, Yuxuan;
Nayak, Suryakanta;
Chichvarina, Olga;
Zamburg, Evgeny;
Zhang, Xiaoyang;
Liu, Yang;
Heng, Chun Huat;
Thean, Aaron Voon‐Yew;
Liu, Zhuangjian

Publication type:

Article

Paper‐Based Resistive Networks for Scalable Skin‐Like Sensing.

Published in:

Advanced Electronic Materials, 2018, v. 4, n. 8, p. 1, doi. 10.1002/aelm.201800131

By:

Zou, Xiyue;
Chen, Chuyang;
Liang, Tongfen;
Xie, Jingjin;
Gillette‐Henao, Eda‐Nicole;
Oh, Jihoon;
Tumalle, Jonathan;
Mazzeo, Aaron D.

Publication type:

Article

Carbon-Enriched Amorphous Hydrogenated Boron Carbide Films for Very-Low- k Interlayer Dielectrics.

Published in:

Advanced Electronic Materials, 2017, v. 3, n. 12, p. n/a, doi. 10.1002/aelm.201700116

By:

Nordell, Bradley J.;
Nguyen, Thuong D.;
Caruso, Anthony N.;
Purohit, Sudhaunshu S.;
Oyler, Nathan A.;
Lanford, William A.;
Gidley, David W.;
Gaskins, John T.;
Hopkins, Patrick E.;
Henry, Patrick;
King, Sean W.;
Paquette, Michelle M.

Publication type:

Article

Mathematical analysis of interconnected photovoltaic arrays under different shading conditions.

Published in:

Cogent Engineering, 2018, v. 5, n. 1, p. 1, doi. 10.1080/23311916.2018.1507442

By:

Nnamchi, S.N.;
Oko, C.O.C.;
Kamen, F.L;
Sanya, O.D.

Publication type:

Article

An Estimation Technique to Assign Contribution Factors for Loop Flows in an Interconnected Power System.

Published in:

Electric Power Components & Systems, 2004, v. 32, n. 8, p. 813, doi. 10.1080/15325000490466672

By:

Suryanarayanan, S.;
Heydt, G.T.;
Farmer, R.G.;
Chakka, S.

Publication type:

Article

A survey on pristine and intercalation doped graphene nanoribbon interconnect for future VLSI circuits.

Published in:

AIMS Materials Science, 2021, v. 8, n. 2, p. 247, doi. 10.3934/matersci.2021016

By:

Das, Subhajit;
Bhattacharya, Sandip;
Das, Debaprasad;
Rahaman, Hafizur

Publication type:

Article

Interconnection Design Technology among Single Direction Separated Motherboards.

Published in:

Telecommunication Engineering, 2015, v. 55, n. 4, p. 458, doi. 10.3969/j.issn.1001-893x.2015.04.019

By:

ZHENG Da'an

Publication type:

Article

Summarization of Intra/Inter Chip Wireless Interconnection Technology.

Published in:

Telecommunication Engineering, 2014, v. 54, n. 7, p. 1031, doi. 10.3969/j.issn.1001-893x.2014.07.030

By:

WANG Yi-wen;
LI Xue-hua

Publication type:

Article

Research Progress of U. S. Military Forces' Battlefield Airborne Communication Node.

Published in:

Telecommunication Engineering, 2014, v. 54, n. 6, p. 845, doi. 10.3969/j.issn.1001-893x.2014.06.028

By:

YU Yao

Publication type:

Article

Stretchable Passive Matrix LED Display with Thin-Film Based Interconnects.

Published in:

SID Symposium Digest of Technical Papers, 2016, v. 47, n. 1, p. 664, doi. 10.1002/sdtp.10768

By:

Verplancke, Rik;
Cauwe, Maarten;
Van Put, Steven;
Smits, Edsger C. P.;
Kusters, Roel;
van Heck, Gert;
van den Brand, Jeroen;
Murata, Mitsuhiro;
Ohmae, Hideki;
Tomita, Yoshihiro;
Nakata, Hideki;
Vanfleteren, Jan;
De Smet, Herbert

Publication type:

Article

Flexible Electrophoretic Displays with Novel Drive Schemes for Wearables and Mobiles.

Published in:

SID Symposium Digest of Technical Papers, 2016, v. 47, n. 1, p. 774, doi. 10.1002/sdtp.10787

By:

French, Ian;
Wu, James

Publication type:

Article

Versatile Fabrication of Complex Shaped Metal Oxide Nano-Microstructures and Their Interconnected Networks for Multifunctional Applications.

Published in:

KONA: Powder & Particle Journal, 2014, n. 31, p. 92, doi. 10.14356/kona.2014015

By:

Mishra, Yogendra Kumar;
Kaps, Sören;
Schuchardt, Arnim;
Paulowicz, Ingo;
Xin Jin;
Gedamu, Dawit;
Wille, Sebastian;
Lupan, Oleg;
Adelung, Rainer

Publication type:

Article

Resilient observer-based power system stabilizers.

Published in:

Transactions of the Institute of Measurement & Control, 2016, v. 38, n. 8, p. 981, doi. 10.1177/0142331215572418

By:

Soliman, Hisham M.

Publication type:

Article

Stabilization of a class of upper-triangular systems without a priori knowledge of control directions under the homogeneous domination.

Published in:

Transactions of the Institute of Measurement & Control, 2016, v. 38, n. 8, p. 929, doi. 10.1177/0142331215590650

By:

Wenhui Liu;
Shengyuan Xu;
Zhidong Qi;
Yun Zou

Publication type:

Article

Decentralized control design for a class of non-linear large-scale systems with matched and unmatched uncertainties.

Published in:

Transactions of the Institute of Measurement & Control, 2011, v. 33, n. 5, p. 631, doi. 10.1177/0142331210364782

By:

Liu, Wen-Jeng

Publication type:

Article

Design of an Angle Detector for Laser Beams Based on Grating Coupling.

Published in:

Micromachines, 2012, v. 3, n. 1, p. 36, doi. 10.3390/mi3010036

By:

Saha, Tapas Kumar;
Mingyu Lu;
Zhenqiang Ma;
Weidong Zhou

Publication type:

Article

The g-Good-Neighbor Diagnosability of Bubble-Sort Graphs under Preparata, Metze, and Chien's (PMC) Model and Maeng and Malek's (MM)* Model.

Published in:

Information (2078-2489), 2019, v. 10, n. 1, p. 21, doi. 10.3390/info10010021

By:

Wang, Shiying;
Wang, Zhenhua

Publication type:

Article

g-Good-Neighbor Diagnosability of Arrangement Graphs under the PMC Model and MM* Model.

Published in:

Information (2078-2489), 2018, v. 9, n. 11, p. 275, doi. 10.3390/info9110275

By:

Wang, Shiying;
Ren, Yunxia

Publication type:

Article

Passivity-Based Nonlinear Excitation Control of Power Systems with Structure Matrix Reassignment.

Published in:

Information (2078-2489), 2013, v. 4, n. 3, p. 342, doi. 10.3390/info4030342

By:

Jianyong Li;
Yanhong Liu;
Chunwen Li;
Bing Chu

Publication type:

Article

Design and Simulation of CMOS Circuit Structure for CTL-CTM Crosstalk Cancellation Method in High-Speed Interconnects.

Published in:

Progress in Electromagnetics Research Letters, 2021, v. 95, p. 115, doi. 10.2528/pierl20092303

By:

Huifang Sun;
Yafei Wang;
Yanxiao Zhao;
Xuehua Li

Publication type:

Article

A Design of Compact Microwave Six-Port Device for Ultra-Wideband Applications.

Published in:

Progress in Electromagnetics Research Letters, 2017, v. 65, p. 57, doi. 10.2528/pierl16111303

By:

Hongyan Li;
Jun Zhu;
En Li

Publication type:

Article

INTEGRATED METAL-INSULATOR-METAL PLASMONIC NANO RESONATOR: AN ANALYTICAL APPROACH.

Published in:

Progress in Electromagnetics Research Letters, 2013, v. 43, p. 83, doi. 10.2528/pierl13071507

By:

Kotb, Rehab;
Ismail, Yehea;
Swillam, Mohamed A.

Publication type:

Article

Elektronik Haberleşme Sektöründe Arabağlantı Ücretleri Düzenlemesinde Maliyet Bazlı Fiyatlama Yöntemi ile Faturala ve Sakla Yönteminin Karşılaştırılması: Optimum Arabağlantı Ücreti Önerisi

Published in:

Journal of Management & Economics / Yönetim ve Ekonomi, 2013, v. 20, n. 1, p. 221

By:

YAZICI, Kuddusi

Publication type:

Article

Time-Domain Analysis of Coupled Carbon Nanotube Interconnects.

Published in:

Journal of Nanotechnology, 2014, p. 1, doi. 10.1155/2014/750959

By:

Fathi, Davood

Publication type:

Article

Impact of Bundle Structure on Performance of on-Chip CNT Interconnects.

Published in:

Journal of Nanotechnology, 2014, p. 1, doi. 10.1155/2014/217519

By:

Kuruvilla, Nisha;
Raina, J. P.

Publication type:

Article

The evolution to global burst synchronization in a modular neuronal network.

Published in:

Modern Physics Letters B, 2016, v. 30, n. 14, p. -1, doi. 10.1142/S0217984916502109

By:

Yang, Xiaoli;
Wang, Manman

Publication type:

Article