Works matching DE "INTEGRATED circuit failures"

Results: 8

Failure probability estimation with differently sized reference products for semiconductor burn-in studies.

Published in:

Applied Stochastic Models in Business & Industry, 2015, v. 31, n. 5, p. 732, doi. 10.1002/asmb.2100

By:

Kurz, Daniel;
Lewitschnig, Horst;
Pilz, Jürgen

Publication type:

Article

Fault recognition based test score for improving the accuracy of defect diagnosis.

Published in:

Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 15, p. 597, doi. 10.1049/ell2.12195

By:

Tian, Naiyu;
Ouyang, Dantong;
Song, Jincai;
Zhang, Liming

Publication type:

Article

Failure analysis of EOS-induced damage at final electrical testing.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 596, doi. 10.1007/s10854-013-1521-7

By:

Chen, Ming-Kun;
Huang, Yu-Jung;
Cheng, Chi-Chan;
Lin, Yi-Lung;
Fu, Shen-Li

Publication type:

Article

A CASE STUDY OF ENCAPSULATED IC ACCELERATED FAILURE DUE TO THE KIRKENDALL EFFECT ON DOWNHOLE CIRCUITS.

Published in:

2015

By:

Bescup, John

Publication type:

Case Study

IPFA 2015.

Published in:: 2015
Publication type:: Proceeding

Electromigration History and Failure Analysis.

Published in:

Electronic Device Failure Analysis, 2014, v. 16, n. 3, p. 14, doi. 10.31399/asm.edfa.2014-3.p014

By:

Burgess, David

Publication type:

Article

Research, Development, and Commercialization of Scanning Optical Microscope Technology for Failure Analysis of Advanced Integrated Circuits.

Published in:

Electronic Device Failure Analysis, 2013, v. 15, n. 3, p. 28

By:

Phang, Jacob C. H.

Publication type:

Article

Electrostatic Discharge Cross Talk Attenuation in Protective Meander Lines.

Published in:

Electrica, 2024, v. 24, n. 2, p. 385, doi. 10.5152/electrica.2024.23178

By:

Kim, Georgiy Y.;
Nosov, Alexander V.

Publication type:

Article