Failure analysis of EOS-induced damage at final electrical testing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 596, doi. 10.1007/s10854-013-1521-7
- By:
- Publication type:
- Article
Works matching DE "INTEGRATED circuit failures"
Results: 8
1
2
Electrostatic Discharge Cross Talk Attenuation in Protective Meander Lines.
- Published in:
- Electrica, 2024, v. 24, n. 2, p. 385, doi. 10.5152/electrica.2024.23178
- By:
- Publication type:
- Article
3
A CASE STUDY OF ENCAPSULATED IC ACCELERATED FAILURE DUE TO THE KIRKENDALL EFFECT ON DOWNHOLE CIRCUITS.
- Published in:
- 2015
- By:
- Publication type:
- Case Study
4
IPFA 2015.
- Published in:
- 2015
- Publication type:
- Proceeding
5
Electromigration History and Failure Analysis.
- Published in:
- Electronic Device Failure Analysis, 2014, v. 16, n. 3, p. 14, doi. 10.31399/asm.edfa.2014-3.p014
- By:
- Publication type:
- Article
6
Research, Development, and Commercialization of Scanning Optical Microscope Technology for Failure Analysis of Advanced Integrated Circuits.
- Published in:
- Electronic Device Failure Analysis, 2013, v. 15, n. 3, p. 28
- By:
- Publication type:
- Article
7
Failure probability estimation with differently sized reference products for semiconductor burn-in studies.
- Published in:
- Applied Stochastic Models in Business & Industry, 2015, v. 31, n. 5, p. 732, doi. 10.1002/asmb.2100
- By:
- Publication type:
- Article
8
Fault recognition based test score for improving the accuracy of defect diagnosis.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 15, p. 597, doi. 10.1049/ell2.12195
- By:
- Publication type:
- Article