Works matching DE "INTEGRATED circuit bonding"
1
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13750, doi. 10.1007/s10854-017-7219-5
- Singh, Gurbinder;
- Haseeb, A.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 9091, doi. 10.1007/s10854-017-6642-y
- Yao, Mingjun;
- Fan, Jun;
- Zhao, Ning;
- Xiao, Zhiyi;
- Yu, Daquan;
- Ma, Haitao
- Article
3
- International Journal of Production Research, 2017, v. 55, n. 9, p. 2431, doi. 10.1080/00207543.2016.1213914
- Gong, Dah-Chuan;
- Kang, Jia-Lun;
- Lin, Gary C.;
- Hou, T. C.
- Article
4
- IET Computers & Digital Techniques (Wiley-Blackwell), 2021, v. 15, n. 4, p. 251, doi. 10.1049/cdt2.12020
- Shantagiri, Pralhadrao V.;
- Kapur, Rohit;
- Shastry, Chandrasekar
- Article
