Works matching DE "INTEGRATED Sensing Systems Inc."
Results: 2
Acoustic Solution for Bonded Wafer Voids.
- Published in:
- EE: Evaluation Engineering, 2006, v. 45, n. 9, p. 60
- By:
- Publication type:
- Article
Wireless, batteryless, implantable sensors.
- Published in:
- Journal of Intellectual Property Rights, 2007, v. 12, n. 5, p. 540
- Publication type:
- Article