Ethernet: Infineon und Marvell.
- Published in:
- Elektronik Industrie, 2025, p. 11
- Publication type:
- Article
Works matching DE "INFINEON Technologies AG"
Results: 60
1
2
Japan.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 22
- Publication type:
- Article
3
EUROPE.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 22
- Publication type:
- Article
4
Tech Briefs.
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- Solid State Technology, 2001, v. 44, n. 4, p. 34
- Publication type:
- Article
5
Infineon launches IPO.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 30
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- Publication type:
- Article
6
IBM's vertical transistor.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 18
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- Article
7
Silicon Alps: Vacationland lures high-tech firms.
- Published in:
- Solid State Technology, 1999, v. 42, n. 8, p. 32
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- Publication type:
- Article
8
Tools.
- Published in:
- Electronics Systems & Software, 2006, v. 4, n. 3, p. 46, doi. 10.1049/ess:20060311
- Publication type:
- Article
9
Für Designs mit hoher Leistungsdichte.
- Published in:
- Elektronik Industrie, 2025, p. 62
- Publication type:
- Article
10
Neue Produkte.
- Published in:
- Elektronik Industrie, 2025, n. 3, p. 62
- Publication type:
- Article
11
28-nm-Technologie.
- Published in:
- Elektronik Industrie, 2024, p. 62
- Publication type:
- Article
12
Infineon: 300-mm-GaN-Wafer.
- Published in:
- Elektronik Industrie, 2024, n. 10, p. 10
- Publication type:
- Article
13
Unternehmen.
- Published in:
- Elektronik Industrie, 2024, n. 10, p. 65
- Publication type:
- Article
14
Unternehmen.
- Published in:
- Elektronik Industrie, 2024, n. 10, p. 65
- Publication type:
- Article
15
Infineon: 300-mm-GaN-Wafer.
- Published in:
- Elektronik Industrie, 2024, n. 10, p. 10
- Publication type:
- Article
16
Quantenelektronik und Power KI.
- Published in:
- Elektronik Industrie, 2023, p. 10
- Publication type:
- Article
17
UWB-Technologie in IoT-Geräte integrieren.
- Published in:
- Elektronik Industrie, 2023, p. 8
- Publication type:
- Article
18
Mit neuem Unternehmen.
- Published in:
- Elektronik Industrie, 2023, p. 10
- Publication type:
- Article
19
Position bei Power-Systems weiter ausgebaut.
- Published in:
- Elektronik Industrie, 2023, p. 10
- Publication type:
- Article
20
Fokus auf Halbleiter für raue Umgebungen.
- Published in:
- Elektronik Industrie, 2023, p. 10
- Publication type:
- Article
21
Infineon verkauft HiRel-Geschäft an Micross Components.
- Published in:
- Elektronik Industrie, 2023, n. 1/2, p. 10
- Publication type:
- Article
22
Infineon v European Commission: Reducing Cartel Fines in Light of Limited Participation.
- Published in:
- Journal of European Competition Law & Practice, 2020, v. 11, n. 10, p. 592, doi. 10.1093/jeclap/lpaa086
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- Publication type:
- Article
23
Model Control and Digital Implementation of the Three Phase Interleaved Parallel Bidirectional Buck–Boost Converter for New Energy Electric Vehicles.
- Published in:
- Energies (19961073), 2022, v. 15, n. 19, p. 7178, doi. 10.3390/en15197178
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- Publication type:
- Article
24
Identity of Applicants for Priority Rights and the EPO's CRISPR-Cas/Broad Institute Decision T 0844/18 - Scope of the EPO's 'Formal Review' to Establish Identity of the Holder of the Priority Right.
- Published in:
- GRUR International: Journal of European & International IP Law, 2021, v. 70, n. 9, p. 855, doi. 10.1093/grurint/ikab065
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- Publication type:
- Article
25
Creating an Entrepreneurial Mindset at Infineon Technologies: The Infineon-Babson Global Manager Development Programme.
- Published in:
- Journal of Change Management, 2008, v. 8, n. 3/4, p. 265, doi. 10.1080/14697010802479830
- By:
- Publication type:
- Article
26
Judgement of 26 September 2018, Case C-99/17 P, Infineon Technologies †.
- Published in:
- Journal of European Competition Law & Practice, 2018, v. 9, n. 10, p. 648, doi. 10.1093/jeclap/lpy078
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- Publication type:
- Article
27
BRIEFS.
- Published in:
- Bio-IT World, 2003, v. 2, n. 5, p. 12
- Publication type:
- Article
28
BRIEFS.
- Published in:
- Bio-IT World, 2003, v. 2, n. 4, p. 14
- Publication type:
- Article
29
Modelling CoolMOSC3 transistor characteristics in SPICE.
- Published in:
- International Journal of Numerical Modelling, 2010, v. 23, n. 2, p. 127, doi. 10.1002/jnm.727
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- Publication type:
- Article
30
SPICE modelling of power Schottky diodes.
- Published in:
- International Journal of Numerical Modelling, 2008, v. 21, n. 6, p. 551, doi. 10.1002/jnm.688
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- Publication type:
- Article
31
Electrothermal compact model of CoolSET voltage regulators for SPICE.
- Published in:
- International Journal of Numerical Modelling, 2007, v. 20, n. 4, p. 181, doi. 10.1002/jnm.643
- By:
- Publication type:
- Article
32
Project-Based Learning as a Tool to Meet Learning Results: A Case Study of Teaching Microcontrollers.
- Published in:
- International Journal of Online & Biomedical Engineering, 2023, v. 19, n. 11, p. 4, doi. 10.3991/ijoe.v19i11.39277
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- Publication type:
- Article
33
Infineon Technologies AG v Commission: A Referral from the Court of Justice on Proportionality Grounds.
- Published in:
- European Competition & Regulatory Law Review, 2020, v. 4, n. 4, p. 328, doi. 10.21552/core/2020/4/14
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- Publication type:
- Article
34
GaN on SiC Power Transistors for 3.5 GHz Cellular.
- Published in:
- 2017
- Publication type:
- Product Review
35
Infineon Launches Productive4.0 Research Project.
- Published in:
- Microwave Journal, 2017, v. 60, n. 7, p. 45
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- Publication type:
- Article
36
Infineon Joins 5G Automotive Association.
- Published in:
- Microwave Journal, 2017, v. 60, n. 6, p. 47
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- Publication type:
- Article
37
Infineon and Google ATAP Develop Advanced Radar Technology.
- Published in:
- Microwave Journal, 2015, v. 58, n. 7, p. 57
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- Publication type:
- Article
38
Single-Chip 24 GHz Radar Front End.
- Published in:
- 2014
- Publication type:
- Product Review
39
Single-Chip Packaged RF Transceivers for Mobile Backhauln.
- Published in:
- 2013
- Publication type:
- Product Review
40
Research Project Strengthens Europe's Role in Semiconductor Production.
- Published in:
- Microwave Journal, 2013, v. 56, n. 6, p. 51
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- Publication type:
- Article
41
HIGHLY INTEGRATED GPS/GLONASS Rx FRONT-END MODULES.
- Published in:
- 2011
- Publication type:
- Product Review
42
Major Investment in BioP@ss European Research Project.
- Published in:
- Microwave Journal, 2009, v. 52, n. 12, p. 43
- Publication type:
- Article
43
Radar on Chip for Cars Cooperative Formed in Germany.
- Published in:
- Microwave Journal, 2009, v. 52, n. 7, p. 51
- Publication type:
- Article
44
INTERNATIONAL REPORT.
- Published in:
- Microwave Journal, 2008, v. 51, n. 9, p. 121
- Publication type:
- Article
45
Romanian R&D Centre for Infineon.
- Published in:
- Microwave Journal, 2006, v. 49, n. 3, p. 43
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- Publication type:
- Article
46
Infineon Builds Research Centre in Bucharest.
- Published in:
- Microwave Journal, 2005, v. 48, n. 11, p. 44
- Publication type:
- Article
47
Infineon Transfers RFID Software Solutions to RF-iT Solutions.
- Published in:
- Microwave Journal, 2005, v. 48, n. 10, p. 43
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- Publication type:
- Article
48
New Development for Infineon in Romania.
- Published in:
- Microwave Journal, 2005, v. 48, n. 5, p. 147
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- Publication type:
- Article
49
Expansion Plans for Infineon Technologies in Virginia.
- Published in:
- Microwave Journal, 2004, v. 47, n. 6, p. 51
- Publication type:
- Article
50
Chip and power-device makers offer diversity.
- Published in:
- 2016
- By:
- Publication type:
- Product Review