Works matching DE "HIGH temperature electronics"
Results: 97
Failure analysis and lifetime assessment of IGBT power modules at low temperature stress cycles.
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- IET Power Electronics (Wiley-Blackwell), 2021, v. 14, n. 7, p. 1271, doi. 10.1049/pel2.12083
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- Article
Coefficients of Thermal Expansion of Al- and Y-Substituted NaSICON Solid Solution Na<sub>3+2x</sub>Al<sub>x</sub>Y<sub>x</sub>Zr<sub>2-2x</sub>Si<sub>2</sub>PO<sub>12</sub>.
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- Batteries, 2018, v. 4, n. 3, p. 1, doi. 10.3390/batteries4030033
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- Article
Mechanically strong and thermally conductive paper made from aramid nanofiber and fluorinated graphene with excellent dielectric properties.
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- Composite Interfaces, 2022, v. 29, n. 6, p. 659, doi. 10.1080/09276440.2021.1990482
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- Article
Thermally conductive, mechanically strong dielectric film made from aramid nanofiber and edge-hydroxylated boron nitride nanosheet for thermal management applications.
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- Composite Interfaces, 2021, v. 28, n. 11, p. 1067, doi. 10.1080/09276440.2020.1855573
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- Article
Dielectric and Electrical Behavior of Apraseodymium Based Tungsten Bronze Ceramics.
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- Macromolecular Symposia, 2024, v. 413, n. 2, p. 1, doi. 10.1002/masy.202300105
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- Article
Editorial for the Special Issue on SiC Based Miniaturized Devices.
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- 2020
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- Editorial
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review.
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- Micromachines, 2019, v. 10, n. 6, p. 406, doi. 10.3390/mi10060406
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- Article
New cryogenic technology for cooling superconducting cables.
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- Chemical Engineering, 2015, v. 122, n. 5, p. 7
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- Article
Development of a High-Temperature Tensile Tester for Micromechanical Characterization of Materials Supporting Meso-Scale ICME Models.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2016, v. 68, n. 11, p. 2754, doi. 10.1007/s11837-016-2100-1
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- Article
Advances in High-Temperature Alloys.
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- 2016
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- Editorial
PdTe<sub>2</sub> Transition‐Metal Dichalcogenide: Chemical Reactivity, Thermal Stability, and Device Implementation.
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- Advanced Functional Materials, 2020, v. 30, n. 5, p. N.PAG, doi. 10.1002/adfm.201906556
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- Article
Ferroelectric Field Effect Transistors: Highly Robust Flexible Ferroelectric Field Effect Transistors Operable at High Temperature with Low‐Power Consumption (Adv. Funct. Mater. 1/2020).
- Published in:
- Advanced Functional Materials, 2020, v. 30, n. 1, p. N.PAG, doi. 10.1002/adfm.202070005
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- Article
Electrically Conducting Ceramics Based on Al-AlN-TiB<sub>2</sub>.
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- High Temperature, 2018, v. 56, n. 4, p. 527, doi. 10.1134/S0018151X18040089
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- Article
Study of MoN gate impact on GaN high electron mobility transistor.
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- Electronics Letters (Wiley-Blackwell), 2024, v. 60, n. 10, p. 1, doi. 10.1049/ell2.13236
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- Article
Thermal imaging system based on a high-temperature superconductor.
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- Instruments & Experimental Techniques, 2013, v. 56, n. 4, p. 485, doi. 10.1134/S0020441213030196
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- Article
63.4: High-Performance 4K x 2K 65-in. TV with BCE-Type Oxide TFTs.
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- SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 943, doi. 10.1002/sdtp.10419
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- Article
51.2: The Development of a High Mobility Zinc Oxynitride TFT for AMOLED.
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- SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 769, doi. 10.1002/sdtp.10213
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- Article
A 9-bit successive approximation ADC in SOI CMOS operating up to 300 °C.
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- International Journal of Circuit Theory & Applications, 2016, v. 44, n. 2, p. 418, doi. 10.1002/cta.2084
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- Article
High-Temperature Double-Layer Ceramic Packaging Substrates.
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- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 3, p. 99, doi. 10.4071/imaps.1123535
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- Article
Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
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- Article
Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313
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- Article
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
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- Article
A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250°C for Downhole Communications.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 17, doi. 10.4071/imaps.526
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- Article
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 39, doi. 10.4071/imaps.503
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- Article
Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 33, doi. 10.4071/imaps.487
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- Article
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 6, doi. 10.4071/imaps.492
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- Article
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections.
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- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 163, doi. 10.4071/imaps.392
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- Publication type:
- Article
Impact of Wide-Bandgap Technology on Renewable Energy and Smart-Grid Power Conversion Applications Including Storage.
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- Energies (19961073), 2019, v. 12, n. 23, p. 4462, doi. 10.3390/en12234462
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- Article
Investigation of a Quasi-Diamagnetic Machine Based on High-Temperature Superconductor-Based Rotor.
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- Journal of Superconductivity & Novel Magnetism, 2015, v. 28, n. 2, p. 663, doi. 10.1007/s10948-014-2792-9
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- Article
High-Temperature Superconducting Fiber.
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- Journal of Superconductivity & Novel Magnetism, 2014, v. 27, n. 4, p. 891, doi. 10.1007/s10948-014-2483-6
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- Article
Superconducting emitters of THz radiation.
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- Nature Photonics, 2013, v. 7, n. 9, p. 702, doi. 10.1038/nphoton.2013.216
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- Article
Transient liquid phase bonding method of SnIn for high-temperature packaging.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 19, p. 1, doi. 10.1007/s10854-024-13079-1
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- Article
Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 24, p. 1, doi. 10.1007/s10854-023-11083-5
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- Article
Waterproof wearable sensing electronics of thin film with high stretchability, high temperature sensitivity and low cost.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22654, doi. 10.1007/s10854-021-06750-4
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- Article
Growth kinetics of bismuth nickel intermetallics.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19034, doi. 10.1007/s10854-018-0029-6
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- Article
Thermoelectric properties of MgSiSb (0 ≤ x ≤ 0.025) synthesized by the high-temperature high-pressure method.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9535, doi. 10.1007/s10854-017-6700-5
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- Article
A review of high-temperature electronics technology and applications.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9226, doi. 10.1007/s10854-015-3459-4
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- Article
Electrode kinetics at the Pt, O|LaSrScO interface.
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- Journal of Solid State Electrochemistry, 2017, v. 21, n. 8, p. 2457, doi. 10.1007/s10008-017-3593-4
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- Article
Crystal structure and high-temperature electrical conductivity of novel perovskite-related gallium and indium oxides.
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- Journal of Solid State Electrochemistry, 2014, v. 18, n. 5, p. 1415, doi. 10.1007/s10008-013-2190-4
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- Article
PROGRESS TOWARDS BALLOON-BASED SEISMOLOGY ON VENUS IN 2019-2020.
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- LPI Contribution, 2021, p. 1
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- Article
High Temperature Batteries for Venus Surface Missions.
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- LPI Contribution, 2021, p. 1
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- Publication type:
- Article
HYBRID AUTOMATON ROVER-VENUS.
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- LPI Contribution, 2019, p. 1
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- Article
HIGH TEMPERATURE DIAMOND ELECTRONICS FOR ACTUATORS AND SENSORS.
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- LPI Contribution, 2019, p. 1
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- Publication type:
- Article
PROGRESS TOWARDS BALLOON-BASED SEISMOLOGY ON VENUS.
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- LPI Contribution, 2019, p. 1
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- Publication type:
- Article
Formation of exotic states in the s-d exchange and t-J models.
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- JETP Letters, 2017, v. 106, n. 3, p. 167, doi. 10.1134/S0021364017150073
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- Article
Temperature dependence of the thermo-optic coefficient in 4H-SiC and GaN slabs at the wavelength of 1550 nm.
- Published in:
- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-08232-x
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- Article
High-temperature Processing and Recovery of Decommissioned Electrochemical Cells and Batteries.
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- Acta Mechanica Slovaca, 2019, v. 23, n. 2, p. 56, doi. 10.21496/ams.2019.007
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- Article
Special Issue "Technologies for Future Distributed Engine Control Systems".
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- Aerospace (MDPI Publishing), 2021, v. 8, n. 12, p. 379, doi. 10.3390/aerospace8120379
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- Article
Directly Confirming the Z<sub>1/2</sub> Center as the Electron Trap in SiC Through Accessing the Nonradiative Recombination.
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- Physica Status Solidi - Rapid Research Letters, 2022, v. 16, n. 2, p. 1, doi. 10.1002/pssr.202100458
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- Article
Effects of High-Temperature Treatments in Inert Atmosphere on 4H-SiC Substrates and Epitaxial Layers.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 23, p. 5761, doi. 10.3390/ma17235761
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- Publication type:
- Article