Works about HIGH performance processors


Results: 150
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    Flip-Chip Packaging Technology for Enabling 45nm Products.

    Published in:
    Intel Technology Journal, 2008, v. 12, n. 2, p. 145
    By:
    • Patel, Neha M.;
    • Wakharkar, Vijay;
    • Agrahram, Sairam;
    • Deshpande, Nitin;
    • Mengzhi Pang;
    • Tanikella, Ravindra;
    • Manepalli, Rahul;
    • Stover, Pat;
    • Jackson, James;
    • Mahajan, Ravi;
    • Tiwari, Prabhat
    Publication type:
    Article
    34

    45nm Transistor Reliability.

    Published in:
    Intel Technology Journal, 2008, v. 12, n. 2, p. 131
    By:
    • Hicks, Jeffrey;
    • Bergstrom, Daniel;
    • Hattendorf, Mike;
    • Jopling, Jason;
    • Maiz, Jose;
    • Sangwoo Pae;
    • Prasad, Chetan;
    • Wiedemer, Jami
    Publication type:
    Article
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    Foreword.

    Published in:
    2006
    By:
    • Perlmutter, Dadi
    Publication type:
    Book Chapter
    43

    Preface.

    Published in:
    2006
    Publication type:
    Book Chapter
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