Works matching DE "HEAT resistant materials"


Results: 1695
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10
    11
    12
    13
    14
    15
    16
    17

    A New Material for High-Temperature Lead-Free Actuators.

    Published in:
    Advanced Functional Materials, 2014, v. 23, n. 47, p. 5881, doi. 10.1002/adfm.201300899
    By:
    • Kursumovic, Ahmed;
    • Defay, Emmanuel;
    • Lee, Oon Jew;
    • Tsai, Chen‐Fong;
    • Bi, Zhenxing;
    • Wang, Haiyan;
    • MacManus‐Driscoll, Judith L.
    Publication type:
    Article
    18
    19
    20
    21
    22
    23
    24
    25
    26
    27
    28
    29
    30

    Carbon nanofibers addition on transport and superconducting properties of bulk YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7−δ</sub> material prepared via co-precipitation.

    Published in:
    Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16983, doi. 10.1007/s10854-020-04255-0
    By:
    • Khalid, Nurul Auni;
    • Awang Kechik, Mohd Mustafa;
    • Baharuddin, Nur Atikah;
    • Kien, Chen Soo;
    • Baqiah, Hussein;
    • Pah, Lim Kean;
    • Shaari, Abdul Halim;
    • Talib, Zainal Abidin;
    • Hashim, Azhan;
    • Murakami, Masato;
    • Miryala, Muralidhar
    Publication type:
    Article
    31
    32
    33
    34
    35
    36
    37
    38
    39
    40
    41
    42
    43
    44
    45
    46

    Review on additive manufacturing of tooling for hot stamping.

    Published in:
    International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 1/2, p. 87, doi. 10.1007/s00170-020-05622-1
    By:
    • Chantzis, Dimitrios;
    • Liu, Xiaochuan;
    • Politis, Denis J.;
    • El Fakir, Omer;
    • Chua, Teun Yee;
    • Shi, Zhusheng;
    • Wang, Liliang
    Publication type:
    Article
    47
    48
    49

    A 3D Spark Model to Evaluate MRR in ECDM.

    Published in:
    Journal of Advanced Manufacturing Systems, 2019, v. 18, n. 3, p. 435, doi. 10.1142/S0219686719500239
    By:
    • Singh, Dilpreet;
    • Goud, Mudimallana
    Publication type:
    Article
    50