Works matching DE "GLASS bonding"
Results: 15
Influence of magnetic field on the properties of freshly precipitated calcium phosphate: implication in adhesion to glass surface.
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- Journal of Adhesion Science & Technology, 2006, v. 20, n. 4, p. 345, doi. 10.1163/156856106776381767
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- Article
NANOSTRUCTURED DENDRIMER MODIFIED GLASS SURFACES FOR PROTEIN MICROARRAY.
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- International Journal of Nanoscience, 2007, v. 6, n. 2, p. 161, doi. 10.1142/S0219581X07004432
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Carrier-glass technology handles ultrathin glass.
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- Advanced Materials & Processes, 2012, v. 170, n. 7, p. 4
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- Article
Direct Writing of Spot and Line Bonds for Microsystem Packaging Using Transmission Laser Bonding Technique.
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- Materials & Manufacturing Processes, 2007, v. 22, n. 1, p. 71, doi. 10.1080/10426910601015964
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- Article
Lead Titanate Granulometric Composition Effect on CLTE of Low-Melting Glass-Composition Materials for Vacuum-Tight Low-Temperature Soldering of Corundum Parts.
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- Glass & Ceramics, 2017, v. 74, n. 5/6, p. 176, doi. 10.1007/s10717-017-9956-6
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- Article
Double cantilever beam Mode-I testing for vacuum infused repairs of GFRP.
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- Journal of Adhesion Science & Technology, 2003, v. 17, n. 3, p. 309, doi. 10.1163/156856103762864642
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- Article
Interfacial debonding behavior of a rigid particle-filled polymer composite.
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- Composite Interfaces, 2003, v. 10, n. 2/3, p. 243, doi. 10.1163/156855403765826892
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Measurement of Mechanical Strength of Glass-to-Metal Joints.
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- Fuel Cells, 2015, v. 15, n. 4, p. 595, doi. 10.1002/fuce.201500028
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EPR AND SPECTRAL STUDIES OF Cu<sup>2+</sup> ion IN (30-x)CdO-xAl<sub>2</sub>O<sub>3</sub> - 35 Bi<sub>2</sub> O<sub>3</sub> - 34 B<sub>2</sub>O<sub>3</sub>-1CuO GLASSES.
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- i-Manager's Journal on Material Science, 2019, v. 6, n. 4, p. 67, doi. 10.26634/jms.6.4.15706
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- Article
Application of ultrasonic assisted soldering method to hard-to-solder material.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2018, v. 32, n. 19, p. N.PAG, doi. 10.1142/S0217979218400544
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Compliant Substrates for Heteroepitaxial Semiconductor Devices: Theory, Experiment, and Current Directions.
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- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1511, doi. 10.1007/s11664-008-0504-6
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- Article
Method for debonding of thin glass substrate and carrier for manufacturing thin flexible displays.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 18941, doi. 10.1007/s10854-018-0017-x
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Influence of morphology and processing on XPS characterisation of SrO–Ca–ZnO–SiO<sub>2</sub> glass.
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- Journal of Materials Science, 2010, v. 45, n. 11, p. 3102, doi. 10.1007/s10853-010-4298-6
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- Article
Metallization development for AIN/W cofired substrate at low temperature.
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- Journal of Materials Science, 2002, v. 37, n. 10, p. 2163, doi. 10.1023/A:1015262423689
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- Article
Optimization and reliability evaluation of COG bonding process.
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- Journal of Mechanical Science & Technology, 2016, v. 30, n. 3, p. 1305, doi. 10.1007/s12206-016-0235-1
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- Article