Works matching DE "FLIP chip technology"

Results: 371

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging.

Published in:

Computers, Materials & Continua, 2025, v. 84, n. 1, p. 537, doi. 10.32604/cmc.2025.065330

By:

Hu, Ian;
Hung, Tzu-Chun;
Zhou, Mu-Heng;
Lin, Heng-Sheng;
Chen, Dao-Long

Publication type:

Article

Development and Evaluation of Multi-Module Retinal Devices for Artificial Vision Applications.

Published in:

Micromachines, 2025, v. 16, n. 5, p. 580, doi. 10.3390/mi16050580

By:

Tso, Kuang-Chih;
Sunaga, Yoshinori;
Nakanishi, Yuki;
Terasawa, Yasuo;
Haruta, Makito;
Sasagawa, Kiyotaka;
Ohta, Jun

Publication type:

Article

Effects of TiO<sub>2</sub> nanoparticles addition on physical and soldering properties of Sn–xTiO<sub>2</sub> composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Recent advances in nano-materials for packaging of electronic devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13855, doi. 10.1007/s10854-019-01790-3

By:

Zhang, Shuye;
Xu, Xiangyu;
Lin, Tiesong;
He, Peng

Publication type:

Article

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12869, doi. 10.1007/s10854-019-01648-8

By:

Lee, Choong-Jae;
Jeong, Haksan;
Jung, Kwang-Ho;
Min, Kyung Deuk;
Jung, Seung-Boo

Publication type:

Article

Analytical thermal stress model for a typical flip-chip (FC) package design.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2676, doi. 10.1007/s10854-017-8194-6

By:

Suhir, E.

Publication type:

Article

Electrical resistivity and creep behavior of hypoeutectic Sn-0.5Cu based solders for flip chip technology.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12176, doi. 10.1007/s10854-017-7032-1

By:

El-Khawas, E.;
El-Hosainy, H.;
El-Daly, A.

Publication type:

Article

Effect of sintering temperatures on properties of BaO-BO-SiO-AlO glass/silica composites for CBGA package.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2206, doi. 10.1007/s10854-015-4012-1

By:

Li, Bo;
Long, Quanyin;
Duan, Dinan

Publication type:

Article

Enhanced lead-free solder wettability of oxidized-nickel by Ar-H plasmas for flip chip bumping.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6853, doi. 10.1007/s10854-015-3301-z

By:

Lin, Yung-Sen;
Lai, Jin-Chu;
Tsai, Tzung-Han

Publication type:

Article

Characters of multicomponent lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3925, doi. 10.1007/s10854-013-1340-x

By:

Zhao, N.;
Liu, X.;
Huang, M.;
Ma, H.

Publication type:

Article

Temperature measurement at flip chip solder joint during electromigration test.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 53, doi. 10.1007/s10854-009-9868-5

By:

Yamanaka, Kimihiro;
Ooyoshi, Takafumi;
Nejime, Takayuki

Publication type:

Article

Co-W nanocrystalline electrodeposits as barrier for interconnects.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 11, p. 3057, doi. 10.1007/s10008-014-2488-x

By:

Tsyntsaru, N.;
Kaziukaitis, G.;
Yang, C.;
Cesiulis, H.;
Philipsen, H.;
Lelis, M.;
Celis, J.-P.

Publication type:

Article

Enhancement of the Unified Constitutive Model for Viscoplastic Solders in Wide Strain Rate and Temperature Ranges.

Published in:

Strength of Materials, 2019, v. 51, n. 6, p. 917, doi. 10.1007/s11223-020-00142-5

By:

Wang, W. J.;
Long, X.;
Du, C. Y.;
Fu, Y. H.;
Yao, Y.;
Wu, Y. P.

Publication type:

Article

Thermal Conductivity of Hybrid SiC/Si Substrates for the Growth of LED Heterostructures.

Published in:

Technical Physics Letters, 2023, v. 49, p. S327, doi. 10.1134/S1063785023010200

By:

Kukushkin, S. A.;
Markov, L. K.;
Osipov, A. V.;
Svyatets, G. V.;
Chernyakov, A. E.;
Pavlov, S. I.

Publication type:

Article

Recent 1D and 2D TD–NMR Pulse Sequences for Plant Science.

Published in:

Plants (2223-7747), 2021, v. 10, n. 5, p. 833, doi. 10.3390/plants10050833

By:

Monaretto, Tatiana;
Moraes, Tiago Bueno;
Colnago, Luiz Alberto;
Rigano, Daniela

Publication type:

Article

Suitable stacking sequence of glass fibre reinforcements for specific application of composite using Taguchi design and finite element method.

Published in:

Journal of Industrial Textiles, 2022, v. 52, p. 1, doi. 10.1177/15280837221128312

By:

Datta, Mallika;
Nath, Devarun;
Das, Srijan;
Malitha, Mainul

Publication type:

Article

The Construction of Force, Moment and Torque Diagrams of a Loaded Shaft in the Context of a Flipped Machine Design Classroom.

Published in:

Journal of Strategic Innovation & Sustainability, 2020, v. 15, n. 3, p. 124, doi. 10.33423/jsis.v15i3.2953

By:

Zalimidis, P.

Publication type:

Article

Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.

Published in:

Modern Physics Letters B, 2020, v. 34, n. 36, p. N.PAG, doi. 10.1142/S0217984920504138

By:

Liu, Yang;
Chang, Jian;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Sun, Fenglian

Publication type:

Article

A newly developed Cu(Rh) alloy film and its characteristics and applications.

Published in:

AAPPS Bulletin, 2024, v. 34, p. 57, doi. 10.1007/s43673-024-00118-6

By:

Chon‑Hsin Lin

Publication type:

Article

A Positive Feedback Onto ENSO Due to Tropical Instability Wave (TIW)‐Induced Chlorophyll Effects in the Pacific.

Published in:

Geophysical Research Letters, 2019, v. 46, n. 2, p. 889, doi. 10.1029/2018GL081275

By:

Tian, Feng;
Zhang, Rong‐Hua;
Wang, Xiujun

Publication type:

Article

Research on COB-LED light source with tunable CCT based on screen printing and flip chip technology.

Published in:

Optical & Quantum Electronics, 2022, v. 54, n. 2, p. 1, doi. 10.1007/s11082-021-03466-x

By:

Zhang, Rongrong;
Wen, Zuojie;
Li, Bingqian;
Liang, Shenghua;
Yang, Mingde;
Xia, Zhenghao

Publication type:

Article

Light extraction efficiency improvement through double sided periodic photonic structures for deep UV light emitting diodes.

Published in:

Optical & Quantum Electronics, 2021, v. 53, n. 4, p. 1, doi. 10.1007/s11082-021-02840-z

By:

Mondal, Ramit Kumar;
Pandey, Vipul;
Chatterjee, Vijay;
Pal, Suchandan

Publication type:

Article

Function reconsideration of indium bump in InSb IRFPAs.

Published in:

Optical & Quantum Electronics, 2019, v. 51, n. 9, p. N.PAG, doi. 10.1007/s11082-019-2021-7

By:

Meng, Qingduan;
Zhang, Xiaoling;
Lü, Yanqiu;
Si, Junjie

Publication type:

Article

Numerical analysis of temperature and stress fields in hybrid indium antimonide arrays detector with laser irradiation.

Published in:

Optical & Quantum Electronics, 2019, v. 51, n. 8, p. N.PAG, doi. 10.1007/s11082-019-1975-9

By:

Zhang, Liwen;
Li, Yang;
Zhang, Jincan;
Liu, Min;
Lei, Zhen;
Meng, Qingduan

Publication type:

Article

Fault Localization and Testability Approaches for FPGA Fabric Aware Canonic Signed Digit Recoding Implementations.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 6, p. 779, doi. 10.1007/s10836-019-05840-w

By:

Palchaudhuri, Ayan;
Dhar, Anindya Sundar

Publication type:

Article

Analysis and modeling of microstrip-to-coplanar flip chip package interconnects.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2001, v. 11, n. 4, p. 202, doi. 10.1002/mmce.1025

By:

Ghouz, Hussein H. M.;
El-Sharawy, El-Badawy

Publication type:

Article

A review on numerical approach of reflow soldering process for copper pillar technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w

By:

Lee, Jing Rou;
Aziz, Mohd Sharizal Abdul;
Ishak, Mohammad Hafifi Hafiz;
Khor, Chu Yee

Publication type:

Article

Numerical analysis performance of microbump cutting tool in hot machining Ti-6Al-4V.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 3/4, p. 2005, doi. 10.1007/s00170-022-09477-6

By:

Liu, Xin;
Zhang, Xu

Publication type:

Article

Meshfree particle simulation of micro channel flows with surface tension.

Published in:

Computational Mechanics, 2005, v. 35, n. 5, p. 332, doi. 10.1007/s00466-004-0620-y

By:

Liu, M. B.;
Liu, G. R.

Publication type:

Article

Microwave spectroscopy of Andreev states in InAs nanowire-based hybrid junctions using a flip-chip layout.

Published in:

Communications Physics, 2022, v. 5, n. 1, p. 1, doi. 10.1038/s42005-022-01035-6

By:

Zellekens, Patrick;
Deacon, Russell S.;
Perla, Pujitha;
Grützmacher, Detlev;
Lepsa, Mihail Ion;
Schäpers, Thomas;
Ishibashi, Koji

Publication type:

Article

THERMAL STRESS ANALYSIS AND DESIGN OPTIMIZATION OF DIRECT CHIP ATTACH (DCA) AND CHIP SCALE PACKAGE (CSP) IN FLIP CHIP TECHNOLOGY.

Published in:

Engineering Optimization, 2002, v. 34, n. 6, p. 591, doi. 10.1080/03052150215718

By:

Liu, D.S.;
Ni, C.Y.;
Tsay, T.C.;
Kao, C.Y.

Publication type:

Article

Thermal Resistance of LEDs Based on a Narrow-Gap InAsSb Solid Solution.

Published in:

Optics & Spectroscopy, 2024, v. 132, n. 2, p. 200, doi. 10.1134/S0030400X2402019X

By:

Zakgeim, A. L.;
Klimov, A. A.;
Lukhmyrina, T. S.;
Matveev, B. A.;
Chernyakov, A. E.

Publication type:

Article

PACKAGING FOR MOBILE APPLICATIONS.

Published in:

Intel Technology Journal, 2014, v. 18, n. 3, p. 118

By:

Meyer, Thorsten;
Albers, Sven;
Geissler, Christian;
Ofner, Gerald;
Reingruber, Klaus;
Seidemann, Georg;
Wolter, Andreas

Publication type:

Article

Flat Optical Frequency Comb Generation Based on Monolithic Integrated LNOI Intensity and Phase Modulator.

Published in:

Photonics, 2022, v. 9, n. 7, p. N.PAG, doi. 10.3390/photonics9070495

By:

Zhang, Yujia;
Wang, Xuanhao;
Li, Zhengkai;
Lyu, Weiqiang;
Lyu, Yanjia;
Zeng, Cheng;
Zhang, Zhiyao;
Zhang, Shangjian;
Zhang, Yali;
Li, Heping;
Xia, Jinsong;
Liu, Yong

Publication type:

Article

Perspectives on UVC LED: Its Progress and Application.

Published in:

Photonics, 2021, v. 8, n. 6, p. 196, doi. 10.3390/photonics8060196

By:

Hsu, Tsung-Chi;
Teng, Yu-Tsai;
Yeh, Yen-Wei;
Fan, Xiaotong;
Chu, Kuo-Hsiung;
Lin, Su-Hui;
Yeh, Kuo-Kuang;
Lee, Po-Tsung;
Lin, Yue;
Chen, Zhong;
Wu, Tingzhu;
Kuo, Hao-Chung

Publication type:

Article

Size-Dependent Quantum Efficiency of Flip-Chip Light-Emitting Diodes at High Current Injection Conditions.

Published in:

Photonics, 2021, v. 8, n. 4, p. 88, doi. 10.3390/photonics8040088

By:

Zhang, Xingfei;
Li, Yan;
Li, Zhicong;
Miao, Zhenlin;
Liang, Meng;
Zhang, Yiyun;
Yi, Xiaoyan;
Wang, Guohong;
Li, Jinmin

Publication type:

Article

Effect of Die Shape and Size on Performance of III-Nitride Micro-LEDs: A Modeling Study.

Published in:

Photonics, 2018, v. 5, n. 4, p. 41, doi. 10.3390/photonics5040041

By:

Bulashevich, Kirill A.;
Konoplev, Sergey S.;
Karpov, Sergey Yu.

Publication type:

Article

Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction.

Published in:

Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-13776-z

By:

Wan, Yang;
Zhou, Longzao;
Wu, Fengshun

Publication type:

Article

Achieving 9.6% efficiency in 304 nm p-AlGaN UVB LED via increasing the holes injection and light reflectance.

Published in:

Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-04876-x

By:

Khan, M. Ajmal;
Maeda, Noritoshi;
Yun, Joosun;
Jo, Masafumi;
Yamada, Yoichi;
Hirayama, Hideki

Publication type:

Article

Identification of Initial Crack and Fracture Development Monitoring under Uniaxial Compression of Coal with High Bump Proneness.

Published in:

Geofluids, 2021, v. 2021, p. 1, doi. 10.1155/2021/6561152

By:

Bi, Zuoqing;
Liang, Han;
Hui, Qianjia

Publication type:

Article

Spin-sate reconfiguration induced by alternating magnetic field for efficient oxygen evolution reaction.

Published in:

Nature Communications, 2021, v. 12, n. 1, p. 1, doi. 10.1038/s41467-021-25095-4

By:

Zhou, Gang;
Wang, Peifang;
Li, Hao;
Hu, Bin;
Sun, Yan;
Huang, Rong;
Liu, Lizhe

Publication type:

Article

Random augmentation pipe for hyperspectral image classification with few samples.

Published in:

International Journal of Remote Sensing, 2022, v. 43, n. 18, p. 6581, doi. 10.1080/01431161.2022.2132123

By:

Wang, Ying;
Deng, Chuanqi;
Zuo, Fang

Publication type:

Article

Strain measurement in micro-electronic packages using the digital image correlation method.

Published in:

Welding International, 2011, v. 25, n. 11, p. 844, doi. 10.1080/09507116.2011.590654

By:

Ikeda, Toru;
Kanno, Toshifumi;
Shishido, Nobuyuki;
Miyazaki, Noriyuki;
Tanaka, Hiroyuki;
Hatao, Takuya

Publication type:

Article

Indium Arsenide-Based Spontaneous Emission Sources (Review: a Decade Later).

Published in:

Semiconductors, 2019, v. 53, n. 2, p. 139, doi. 10.1134/S1063782619020131

By:

Karandashev, S. A.;
Matveev, B. A.;
Remennyi, M. A.

Publication type:

Article

Spatial redistribution of radiation in flip-chip photodiodes based on InAsSbP/InAs double heterostructures.

Published in:

Semiconductors, 2017, v. 51, n. 2, p. 260, doi. 10.1134/S1063782617020269

By:

Zakgeim, A.;
Il'inskaya, N.;
Karandashev, S.;
Lavrov, A.;
Matveev, B.;
Remennyy, M.;
Stus', N.;
Usikova, A.;
Cherniakov, A.

Publication type:

Article

Comparison of the properties of AlGaInN light-emitting diode chips of vertical and flip-chip design using silicon as the a submount.

Published in:

Semiconductors, 2013, v. 47, n. 3, p. 409, doi. 10.1134/S1063782613030160

By:

Markov, L.;
Smirnova, I.;
Pavlyuchenko, A.;
Kukushkin, M.;
Vasil'eva, E.;
Chernyakov, A.;
Usikov, A.

Publication type:

Article

Flip-chip LEDs with deep mesa emitting at 4.2 µm.

Published in:

Semiconductors, 2006, v. 40, n. 6, p. 697, doi. 10.1134/S1063782606060169

By:

Zotova, N. V.;
Il'inskaya, N. D.;
Karandashev, S. A.;
Matveev, B. A.;
Remennyi, M. A.;
Stus', N. M.

Publication type:

Article

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3

By:

Lee, Jing Rou;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Ishak, Mohammad Hafifi Hafiz;
Kamarudin, Roslan;
Ani, F. Che

Publication type:

Article

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3

By:

Lee, Jing Rou;
Chong, Mun Xi;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Mohd Salleh, Mohd Arif Anuar;
Mohd Arif Zainol, Mohd Remy Rozainy;
Ani, F. Che

Publication type:

Article

Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x

By:

Njoku, Jude E.;
Amalu, Emeka H.;
Ekere, Ndy;
Mallik, Sabuj;
Ekpu, Mathias;
Ogbodo, Eugene A.

Publication type:

Article