Works matching DE "FLIP chip technology"
Results: 364
Experimental study on thermal cycling of nano-silver and nano-silver coated tin flip solder joints.
- Published in:
- Frequenz, 2025, v. 79, n. 3/4, p. 193, doi. 10.1515/freq-2024-0223
- By:
- Publication type:
- Article
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging.
- Published in:
- Micromachines, 2025, v. 16, n. 2, p. 121, doi. 10.3390/mi16020121
- By:
- Publication type:
- Article
Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with ultra-thin Ni-P deposit.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 6, p. 2724, doi. 10.1007/s10853-012-7070-2
- By:
- Publication type:
- Article
Review of microstructure and properties of low temperature lead-free solder in electronic packaging.
- Published in:
- Science & Technology of Advanced Materials, 2020, v. 21, n. 1, p. 689, doi. 10.1080/14686996.2020.1824255
- By:
- Publication type:
- Article
PACKAGING FOR MOBILE APPLICATIONS.
- Published in:
- Intel Technology Journal, 2014, v. 18, n. 3, p. 118
- By:
- Publication type:
- Article
Electrodeposition of Nanocrystalline Fe-P Coatings: Influence of Bath Temperature and Glycine Concentration on Structure, Mechanical and Corrosion Behavior.
- Published in:
- Coatings (2079-6412), 2019, v. 9, n. 3, p. 189, doi. 10.3390/coatings9030189
- By:
- Publication type:
- Article
Ultrafast Nucleic Acid Detection Equipment with Silicon-Based Microfluidic Chip.
- Published in:
- Biosensors (2079-6374), 2023, v. 13, n. 2, p. 234, doi. 10.3390/bios13020234
- By:
- Publication type:
- Article
Room-Temperature Synthesis of Air-Stable Near-Infrared Emission in FAPbI 3 Nanoparticles Embedded in Silica.
- Published in:
- Biosensors (2079-6374), 2021, v. 11, n. 11, p. 440, doi. 10.3390/bios11110440
- By:
- Publication type:
- Article
Flipped Classroom and Gamification Approach: Its Impact on Performance and Academic Commitment on Sustainable Learning in Education.
- Published in:
- Sustainability (2071-1050), 2022, v. 14, n. 9, p. 5428, doi. 10.3390/su14095428
- By:
- Publication type:
- Article
High Performance Flip-Structure Enhancement-Mode HEMT with Face-to-Face Double Gates.
- Published in:
- Nanoscale Research Letters, 2022, v. 17, n. 1, p. 1, doi. 10.1186/s11671-022-03713-4
- By:
- Publication type:
- Article
Strain measurement in micro-electronic packages using the digital image correlation method.
- Published in:
- Welding International, 2011, v. 25, n. 11, p. 844, doi. 10.1080/09507116.2011.590654
- By:
- Publication type:
- Article
LITERATURE REVIEW: Peer-Reviewed Literature of Interest to Failure Analysis: Cornucopia.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 55
- By:
- Publication type:
- Article
CHALLENGES FOR SYSTEM SUPPLIER FAILURE ANALYSIS ON SUBSYSTEM COMPONENTS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 2, p. 4, doi. 10.31399/asm.edfa.2022-2.p004
- By:
- Publication type:
- Article
INDEPENDENT FA PROVIDERS.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 2, p. 42
- By:
- Publication type:
- Article
PHYSICAL SECURITY ROADMAP FOR HETEROGENEOUS INTEGRATION TECHNOLOGY.
- Published in:
- Electronic Device Failure Analysis, 2022, v. 24, n. 2, p. 24, doi. 10.31399/asm.edfa.2022-2.p024
- By:
- Publication type:
- Article
METHODS TO ENABLE FAULT ISOLATION ON 2.5D MOLDED INTERPOSER PACKAGES.
- Published in:
- Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 14, doi. 10.31399/asm.edfa.2021-4.p014
- By:
- Publication type:
- Article
GUEST EDITORIAL.
- Published in:
- Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 2
- By:
- Publication type:
- Article
SAM THEORY AND CASE STUDIES IN RELIABILITY AND COUNTERFEIT DETECTION.
- Published in:
- Electronic Device Failure Analysis, 2020, v. 22, n. 4, p. 20, doi. 10.31399/asm.edfa.2020-4.p020
- By:
- Publication type:
- Article
INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS.
- Published in:
- Electronic Device Failure Analysis, 2020, v. 22, n. 2, p. 4, doi. 10.31399/asm.edfa.2020-2.p004
- By:
- Publication type:
- Article
MECHANICAL MILLING AND POLISHING OF CROSS SECTIONS USING A MICRO CNC MACHINE FOR FAILURE ANALYSIS.
- Published in:
- Electronic Device Failure Analysis, 2020, v. 22, n. 1, p. 14, doi. 10.31399/asm.edfa.2020-1.p014
- By:
- Publication type:
- Article
3-D ANALYSIS OF A COPPER FLIP-CHIP INTERCONNECTION USING FIB-SEM SLICE AND VIEW.
- Published in:
- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 14, doi. 10.31399/asm.edfa.2016-1.p014
- By:
- Publication type:
- Article
Meshfree particle simulation of micro channel flows with surface tension.
- Published in:
- Computational Mechanics, 2005, v. 35, n. 5, p. 332, doi. 10.1007/s00466-004-0620-y
- By:
- Publication type:
- Article
Microwave spectroscopy of Andreev states in InAs nanowire-based hybrid junctions using a flip-chip layout.
- Published in:
- Communications Physics, 2022, v. 5, n. 1, p. 1, doi. 10.1038/s42005-022-01035-6
- By:
- Publication type:
- Article
Noncontact excitation of multi-GHz lithium niobate electromechanical resonators.
- Published in:
- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00771-9
- By:
- Publication type:
- Article
Small-size temperature/high-pressure integrated sensor via flip-chip method.
- Published in:
- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00723-3
- By:
- Publication type:
- Article
Geometric modification and placement of high heat flux ic chips on substrates of different materials for enhanced heat transfer.
- Published in:
- Journal of Thermal Engineering, 2023, v. 9, n. 6, p. 1618, doi. 10.18186/thermal.1401524
- By:
- Publication type:
- Article
Research on the Wear Characteristics of a Bend Pipe with a Bump Based on the Coupled CFD-DEM.
- Published in:
- Journal of Marine Science & Engineering, 2021, v. 9, n. 6, p. 672, doi. 10.3390/jmse9060672
- By:
- Publication type:
- Article
밀리미터파 온-보드 측정을위한플립-칩본딩.
- Published in:
- Journal of Korean Institute of Electromagnetic Engineering & Science / Han-Guk Jeonjapa Hakoe Nonmunji, 2023, v. 34, n. 4, p. 273, doi. 10.5515/KJKIEES.2023.34.4.273
- By:
- Publication type:
- Article
Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections.
- Published in:
- Optical Engineering, 2013, v. 52, n. 12, p. 1, doi. 10.1117/1.OE.52.12.120502
- By:
- Publication type:
- Article
Forward-flipping architecture for lifting-based discrete wavelet transform.
- Published in:
- Optical Engineering, 2011, v. 50, n. 3, p. 037005, doi. 10.1117/1.3558741
- By:
- Publication type:
- Article
HgCdTe mid-Infrared photo response enhanced by monolithically integrated meta-lenses.
- Published in:
- Scientific Reports, 2020, v. 10, n. 1, p. 1, doi. 10.1038/s41598-020-62433-w
- By:
- Publication type:
- Article
Identification of Initial Crack and Fracture Development Monitoring under Uniaxial Compression of Coal with High Bump Proneness.
- Published in:
- Geofluids, 2021, v. 2021, p. 1, doi. 10.1155/2021/6561152
- By:
- Publication type:
- Article
Indium Bump Process for Low-Temperature Detectors and Readout.
- Published in:
- Journal of Low Temperature Physics, 2022, v. 209, n. 3/4, p. 293, doi. 10.1007/s10909-022-02728-6
- By:
- Publication type:
- Article
Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays.
- Published in:
- Journal of Low Temperature Physics, 2012, v. 167, n. 3/4, p. 535, doi. 10.1007/s10909-012-0560-4
- By:
- Publication type:
- Article
QML Class P: A New Standard for Radiation-Hardened Electronics in Plastic Packaging.
- Published in:
- Microwave Journal, 2024, v. 67, n. 10, p. 88
- Publication type:
- Article
InP HBT Technology: Advantages, Applications and Future Challenges.
- Published in:
- Microwave Journal, 2023, v. 66, n. 6, p. 18
- By:
- Publication type:
- Article
Packaging Technology Key to Enabling mmWave Antenna Arrays.
- Published in:
- Microwave Journal, 2020, v. 63, n. 9, p. 62
- By:
- Publication type:
- Article
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 303, doi. 10.1007/s11664-008-0599-9
- By:
- Publication type:
- Article
Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
- By:
- Publication type:
- Article
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5
- By:
- Publication type:
- Article
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 25, doi. 10.1007/s11664-008-0541-1
- By:
- Publication type:
- Article
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
- By:
- Publication type:
- Article
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 185, doi. 10.1007/s11664-007-0330-2
- By:
- Publication type:
- Article
Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 775, doi. 10.1007/s11664-007-0144-2
- By:
- Publication type:
- Article
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 753, doi. 10.1007/s11664-007-0139-z
- By:
- Publication type:
- Article
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 587, doi. 10.1007/s11664-007-0108-6
- By:
- Publication type:
- Article
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 159, doi. 10.1007/s11664-006-0060-x
- By:
- Publication type:
- Article
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 6, doi. 10.1007/s11664-006-0026-z
- By:
- Publication type:
- Article
Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2147, doi. 10.1007/s11664-006-0325-4
- By:
- Publication type:
- Article
Diffusion Behavior of Cu in Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints in Flip Chip Technology.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2164, doi. 10.1007/s11664-006-0327-2
- By:
- Publication type:
- Article