Works matching DE "FLIP chip technology"

Results: 372

Facile Synthesis of Conductive Flexible Composite Sn@Ag Microspheres and their Application in Anisotropic Conductive Films.

Published in:

Particle & Particle Systems Characterization, 2022, v. 39, n. 1, p. 1, doi. 10.1002/ppsc.202100161

By:

Zhang, Wen Hua;
Fan, Pei Yuan;
Yu, Xianglei;
Cheng, Jun Hua;
Cheng, Ding Xiang;
Liu, Cheng Bing;
Gan, Guo You;
Li, Jun Peng

Publication type:

Article

Graphenic Aerogels Decorated with Ag Nanoparticles as 3D SERS Substrates for Biosensing.

Published in:

Particle & Particle Systems Characterization, 2020, v. 37, n. 7, p. 1, doi. 10.1002/ppsc.202000095

By:

Biasotto, Glenda;
Chiadò, Alessandro;
Novara, Chiara;
Fontana, Marco;
Armandi, Marco;
Zaghete, Maria Aparecida;
Giorgis, Fabrizio;
Rivolo, Paola

Publication type:

Article

Temperature measurement at flip chip solder joint during electromigration test.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 53, doi. 10.1007/s10854-009-9868-5

By:

Yamanaka, Kimihiro;
Ooyoshi, Takafumi;
Nejime, Takayuki

Publication type:

Article

A 5–18 GHz Four-Channel Multifunction Chip Using 3D Heterogeneous Integration of GaAs pHEMT and Si-CMOS.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 12, p. 2342, doi. 10.3390/electronics14122342

By:

Du, Bai;
Wang, Zhiyu;
Yu, Faxin

Publication type:

Article

Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 22, p. 4463, doi. 10.3390/electronics13224463

By:

Yin, Yihui;
Yang, Jiayu;
Li, Haiou;
Yang, Wanli;
Li, Yue;
Li, Hanyu

Publication type:

Article

Research on Low-Insertion-Loss Packaging Materials for DC-6 GHz Attenuation Chips.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 9, p. 1785, doi. 10.3390/electronics13091785

By:

Wei, Zhijie;
Yu, Shenglin;
Wei, Pengcheng

Publication type:

Article

Designing Large Two-Dimensional Arrays of Josephson Junctions for RF Magnetic Field Detection.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 15, p. 3239, doi. 10.3390/electronics12153239

By:

Crété, Denis Gérard;
Menouni, Sarah;
Trastoy, Juan;
Mesoraca, Salvatore;
Kermorvant, Julien;
Lemaître, Yves;
Marcilhac, Bruno;
Ulysse, Christian

Publication type:

Article

A Reactive Power Injection Algorithm for Improving the Microgrid Operational Reliability.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 13, p. 2932, doi. 10.3390/electronics12132932

By:

Liu, Baoquan;
Li, Haoxuan;
Zhang, Haoming;
Han, Meng

Publication type:

Article

Mitigation of Thermal Stability Concerns in FinFET Devices †.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 20, p. 3305, doi. 10.3390/electronics11203305

By:

Bender, Emmanuel;
Bernstein, Joseph B.;
Boning, Duane S.

Publication type:

Article

Correction: Frick et al. Voltage Flip Efficiency Enhancement for Piezo Energy Harvesting. Electronics 2021, 10 , 2400.

Published in:

2022

By:

Frick, Vincent;
Wassouf, Liana;
Jamshidpour, Ehsan

Publication type:

Correction Notice

Die-Level Thinning for Flip-Chip Integration on Flexible Substrates.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 6, p. 849, doi. 10.3390/electronics11060849

By:

Malik, Muhammad Hassan;
Tsiamis, Andreas;
Zangl, Hubert;
Binder, Alfred;
Mitra, Srinjoy;
Roshanghias, Ali

Publication type:

Article

Voltage Flip Efficiency Enhancement for Piezo Energy Harvesting.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 19, p. 2400, doi. 10.3390/electronics10192400

By:

Frick, Vincent;
Wassouf, Liana;
Jamshidpour, Ehsan

Publication type:

Article

Topological Optimization of Interconnection of Multilayer Composite Structures.

Published in:

Computation, 2023, v. 11, n. 5, p. 87, doi. 10.3390/computation11050087

By:

Dunchenkin, P. V.;
Cherekaeva, V. A.;
Yakovleva, T. V.;
Krysko, A. V.

Publication type:

Article

Progress and Outlook of 10% Efficient AlGaN‐Based (290–310 nm) Band UVB LEDs.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2024, v. 221, n. 13, p. 1, doi. 10.1002/pssa.202470025

By:

Khan, M. Ajmal;
Yamada, Yoichi;
Hirayama, Hideki

Publication type:

Article

Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.

Published in:

Modern Physics Letters B, 2020, v. 34, n. 36, p. N.PAG, doi. 10.1142/S0217984920504138

By:

Liu, Yang;
Chang, Jian;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Sun, Fenglian

Publication type:

Article

Effect of aluminum trace dimension on electro-migration failure in flip-chip package.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2017, v. 31, n. 7, p. -1, doi. 10.1142/S0217979217410028

By:

Liu, Peisheng;
Fan, Guangming;
Liu, Yahong;
Yang, Longlong;
Miao, Xiaoyong

Publication type:

Article

Strain measurement in micro-electronic packages using the digital image correlation method.

Published in:

Welding International, 2011, v. 25, n. 11, p. 844, doi. 10.1080/09507116.2011.590654

By:

Ikeda, Toru;
Kanno, Toshifumi;
Shishido, Nobuyuki;
Miyazaki, Noriyuki;
Tanaka, Hiroyuki;
Hatao, Takuya

Publication type:

Article

A Positive Feedback Onto ENSO Due to Tropical Instability Wave (TIW)‐Induced Chlorophyll Effects in the Pacific.

Published in:

Geophysical Research Letters, 2019, v. 46, n. 2, p. 889, doi. 10.1029/2018GL081275

By:

Tian, Feng;
Zhang, Rong‐Hua;
Wang, Xiujun

Publication type:

Article

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3

By:

Lee, Jing Rou;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Ishak, Mohammad Hafifi Hafiz;
Kamarudin, Roslan;
Ani, F. Che

Publication type:

Article

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3

By:

Lee, Jing Rou;
Chong, Mun Xi;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Mohd Salleh, Mohd Arif Anuar;
Mohd Arif Zainol, Mohd Remy Rozainy;
Ani, F. Che

Publication type:

Article

Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x

By:

Njoku, Jude E.;
Amalu, Emeka H.;
Ekere, Ndy;
Mallik, Sabuj;
Ekpu, Mathias;
Ogbodo, Eugene A.

Publication type:

Article

Electrical Characterization in Ultra-Wide Band Gap III-Nitride Heterostructure IMPATT/HEMATT Diodes: A Room-Temperature Sub-Millimeter Wave Power Source.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 2, p. 1552, doi. 10.1007/s11664-022-10090-2

By:

Chatterjee, Sulagna;
Mukherjee, Moumita

Publication type:

Article

Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 1, p. 327, doi. 10.1007/s11664-022-09992-y

By:

Li, Kui;
Wu, Daowei;
Lu, Peiyuan;
Li, Zhankun;
Li, Junhui

Publication type:

Article

Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1597, doi. 10.1007/s11664-021-09426-1

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo

Publication type:

Article

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6584, doi. 10.1007/s11664-021-09234-7

By:

Lin, Y. X.;
Wang, J. Y.;
Chen, C. Y.;
Wu, C. Y.;
Chiu, C. Y.;
Lee, C. H.;
Yeh, C. Y.;
Huang, B. R.;
Chang, J. S.;
Yen, T. H.;
Fu, K. L.;
Liu, C. Y.

Publication type:

Article

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5965, doi. 10.1007/s11664-021-09107-z

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Li, Yang;
Guo, Chunfeng;
Hu, Rongrong;
Bao, Qijun

Publication type:

Article

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4

By:

Jang, Jun-Ho;
Min, Kyung Deuk;
Lee, Choong-Jae;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4433, doi. 10.1007/s11664-021-08968-8

By:

Ekpu, Mathias

Publication type:

Article

Reliability of Flip-Chip Filaments with Different Color Temperatures.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4261, doi. 10.1007/s11664-021-08864-1

By:

Lu, Qing;
Shang, Zhaojiang;
Zhu, Yuxuan;
Guan, Chengyu;
Wang, Li;
Yang, Bobo;
Shi, Mingming;
Zou, Jun

Publication type:

Article

Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4186, doi. 10.1007/s11664-021-08957-x

By:

Guan, Chengyu;
Zou, Jun;
Liu, Huizi;
Lu, Qing;
Li, Yang;
BoboYang;
Shi, Mingming

Publication type:

Article

Scaling effect on Ag<sub>3</sub>Sn growth behaviours in micro-joints for flip chip assemblies.

Published in:

Science & Technology of Welding & Joining, 2018, v. 23, n. 7, p. 551, doi. 10.1080/13621718.2018.1427835

By:

Tian, Ye;
Ren, Ning;
Jian, Xiaoxia;
Shang, Shuanjun;
Sitaraman, Suresh. K.

Publication type:

Article

Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with ultra-thin Ni-P deposit.

Published in:

Journal of Materials Science, 2013, v. 48, n. 6, p. 2724, doi. 10.1007/s10853-012-7070-2

By:

Ho, Cheng-Ying;
Duh, Jenq-Gong;
Lin, Chih-Wei;
Lin, Chun-Jen;
Wu, Yu-Hui;
Hong, Huei-Cheng;
Wang, Te-Hui

Publication type:

Article

Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 7/8, p. 708, doi. 10.1007/s00170-004-2245-x

By:

Zhong, Z.W.;
Wong, K.W.;
Shi, X.Q.

Publication type:

Article

Experimental studies on application of silver paste in thermosonic flip-chip bonding.

Published in:

Journal of Low Frequency Noise, Vibration & Active Control, 2023, v. 42, n. 1, p. 80, doi. 10.1177/14613484221118144

By:

Yang, Hui;
Zhan, Zhengbang

Publication type:

Article

Simple and low-loss flip-chip bonding based on ink-jet printing for RF applications.

Published in:

Electronics Letters (Wiley-Blackwell), 2018, v. 54, n. 25, p. 1440, doi. 10.1049/el.2018.7390

By:

Kang, H. L.;
Lee, Y. S.;
Sim, S. M.;
Kim, J. M.;
Yu, J. H.;
Shin, K. Y.;
Lee, S. H.

Publication type:

Article

Real-time observation of thermally induced warpage of flip-chip package using far-infrared Fizeau interferometry.

Published in:

Experimental Mechanics, 2004, v. 44, n. 6, p. 628, doi. 10.1007/BF02428253

By:

Verma, K.;
Han, B.

Publication type:

Article

Celebrating Ten Years of Excellent Electrochemistry.

Published in:

ChemElectroChem, 2024, v. 11, n. 1, p. 1, doi. 10.1002/celc.202300692

By:

Rincón, Rosalba A.

Publication type:

Article

Thermal Conductivity of Hybrid SiC/Si Substrates for the Growth of LED Heterostructures.

Published in:

Technical Physics Letters, 2023, v. 49, p. S327, doi. 10.1134/S1063785023010200

By:

Kukushkin, S. A.;
Markov, L. K.;
Osipov, A. V.;
Svyatets, G. V.;
Chernyakov, A. E.;
Pavlov, S. I.

Publication type:

Article

A Light-Emitting Diode Based on AlInGaN Heterostructures Grown on SiC/Si Substrates and Its Fabrication Technology.

Published in:

Technical Physics Letters, 2022, v. 48, n. 2, p. 31, doi. 10.1134/S1063785022020043

By:

Markov, L. K.;
Kukushkin, S. A.;
Smirnova, I. P.;
Pavlyuchenko, A. S.;
Grashchenko, A. S.;
Osipov, A. V.;
Svyatets, G. V.;
Nikolaev, A. E.;
Sakharov, A. V.;
Lundin, V. V.;
Tsatsulnikov, A. F.

Publication type:

Article

Identification of Initial Crack and Fracture Development Monitoring under Uniaxial Compression of Coal with High Bump Proneness.

Published in:

Geofluids, 2021, v. 2021, p. 1, doi. 10.1155/2021/6561152

By:

Bi, Zuoqing;
Liang, Han;
Hui, Qianjia

Publication type:

Article

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials.

Published in:

Crystals (2073-4352), 2023, v. 13, n. 10, p. 1462, doi. 10.3390/cryst13101462

By:

Chen, Ming;
Li, Jiasheng;
Su, Wei;
Nie, Zhenhua;
Zhong, Butian;
Dong, Xianshan

Publication type:

Article

Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions.

Published in:

Crystals (2073-4352), 2022, v. 12, n. 6, p. 775, doi. 10.3390/cryst12060775

By:

Al Athamneh, Raed;
Abueed, Mohammed;
Bani Hani, Dania;
Hamasha, Sa'd

Publication type:

Article

Material Properties of Zr–Cu–Ni–Al Thin Films as Diffusion Barrier Layer.

Published in:

Crystals (2073-4352), 2020, v. 10, n. 6, p. 540, doi. 10.3390/cryst10060540

By:

Sung, Po-Hsien;
Chen, Tei-Chen

Publication type:

Article

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder.

Published in:

Crystals (2073-4352), 2020, v. 10, n. 2, p. 59, doi. 10.3390/cryst10020059

By:

Zhao, Zhihuan;
Gong, Guanghao;
Jiang, Mingming;
Chen, Chuanzhong;
Pan, Yingyue;
Liu, Weili;
Zhang, Li

Publication type:

Article

SiC/Si Hybrid Substrate Synthesized by the Method of Coordinated Substitution of Atoms: A New Type of Substrate for LEDs.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 7, p. 1142, doi. 10.3390/coatings13071142

By:

Kukushkin, Sergey A.;
Markov, Lev K.;
Pavlyuchenko, Alexey S.;
Smirnova, Irina P.;
Osipov, Andrey V.;
Grashchenko, Alexander S.;
Nikolaev, Andrey E.;
Sakharov, Alexey V.;
Tsatsulnikov, Andrey F.;
Sviatets, Genadii V.

Publication type:

Article

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 4, p. 748, doi. 10.3390/coatings13040748

By:

Wu, Wenyu;
Li, Geng;
Wang, Shang;
Wang, Yiping;
Feng, Jiayun;
Sun, Xiaowei;
Tian, Yanhong

Publication type:

Article

Technologies of Coatings and Surface Hardening: Industrial Applications.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 3, p. 511, doi. 10.3390/coatings13030511

By:

Grigoriev, Sergey N.

Publication type:

Article

Electrodeposition of Nanocrystalline Fe-P Coatings: Influence of Bath Temperature and Glycine Concentration on Structure, Mechanical and Corrosion Behavior.

Published in:

Coatings (2079-6412), 2019, v. 9, n. 3, p. 189, doi. 10.3390/coatings9030189

By:

Kovalska, Natalia;
Tsyntsaru, Natalia;
Cesiulis, Henrikas;
Gebert, Annet;
Fornell, Jordina;
Pellicer, Eva;
Sort, Jordi;
Hansal, Wolfgang;
Kautek, Wolfgang

Publication type:

Article

Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review.

Published in:

Aerospace (MDPI Publishing), 2018, v. 5, n. 3, p. 74, doi. 10.3390/aerospace5030074

By:

Suhir, Ephraim;
Ghaffarian, Reza

Publication type:

Article

Adhesion characteristics of underfill resins with flip chip package components.

Published in:

Journal of Adhesion Science & Technology, 2003, v. 17, n. 14, p. 1923, doi. 10.1163/156856103770572052

By:

Man-Lung Sham, Marta;
Jang-Kyo Kim

Publication type:

Article