Soldering and Bonding in Contemporary Electronic Device Packaging.
- Published in:
- Materials (1996-1944), 2025, v. 18, n. 9, p. 2015, doi. 10.3390/ma18092015
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- Publication type:
- Article
Works matching DE "FLIP chip technology"
Results: 369
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2
Synthesis and Luminescence Study of n‐UV Excitable Tm<sup>3+</sup>‐Activated Blue Phosphor.
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- Macromolecular Symposia, 2021, v. 400, n. 1, p. 1, doi. 10.1002/masy.202100019
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- Article
3
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0
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- Article
4
New concept of electret-based capacitance, as shown for solder and other conductors.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 36, p. 27022, doi. 10.1007/s10854-022-09366-4
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- Article
5
Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.
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- 2022
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- Publication type:
- Correction Notice
6
Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11002, doi. 10.1007/s10854-022-08079-y
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- Article
7
Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10002, doi. 10.1007/s10854-022-07991-7
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- Article
8
Solid-state diffusion studies of lead-free solders on gold and in polymer films.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7679, doi. 10.1007/s10854-022-07917-3
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- Article
9
Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3687, doi. 10.1007/s10854-021-07562-2
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- Publication type:
- Article
10
Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3535, doi. 10.1007/s10854-021-07545-3
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- Article
11
Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2259, doi. 10.1007/s10854-021-07437-6
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- Article
12
Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2360, doi. 10.1007/s10854-021-07435-8
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- Publication type:
- Article
13
Fractures of ultra-low-k material in a chip during a flip-chip process.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 2, p. 789, doi. 10.1007/s10854-021-07349-5
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- Article
14
Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28426, doi. 10.1007/s10854-021-07222-5
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- Publication type:
- Article
15
Room-temperature synthesis of Mn<sup>2+</sup>-doped CsPb(Br/Cl)<sub>3</sub> nanocrystal thin films with high Mn substitution ratio.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27647, doi. 10.1007/s10854-021-07141-5
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- Article
16
Recent advances on SnBi low-temperature solder for electronic interconnections.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22731, doi. 10.1007/s10854-021-06820-7
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- Article
17
Effect of water on the dielectric behavior of solder.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22196, doi. 10.1007/s10854-021-06700-0
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- Article
18
Effect of grain size on the interface structure and shear behavior of lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21620, doi. 10.1007/s10854-021-06673-0
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- Article
19
Electret behavior discovered in solder, specifically tin–silver.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19145, doi. 10.1007/s10854-021-06434-z
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- Article
20
First report of the ferroelectric behavior of a metal, as shown for solder.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16979, doi. 10.1007/s10854-021-06262-1
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- Article
21
Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 9, p. 11944, doi. 10.1007/s10854-021-05824-7
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- Article
22
Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 9, p. 11893, doi. 10.1007/s10854-021-05819-4
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- Article
23
Preparation and sintering characteristics of nanosilver-tin core–shell paste.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 8, p. 11202, doi. 10.1007/s10854-021-05785-x
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- Article
24
Effect of the cooling rate in solidification on the electrical behavior of solder.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7867, doi. 10.1007/s10854-021-05511-7
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- Article
25
Electric polarization and depolarization of solder, and their effects on electrical conduction.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6214, doi. 10.1007/s10854-021-05337-3
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- Article
26
Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 2865, doi. 10.1007/s10854-020-05040-9
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- Article
27
Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22926, doi. 10.1007/s10854-020-04819-0
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- Article
28
Permittivity tunable by Ti3SiC2 ceramics in sandwich-structured polymer composites.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 19778, doi. 10.1007/s10854-020-04502-4
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- Article
29
A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 18381, doi. 10.1007/s10854-020-04384-6
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- Publication type:
- Article
30
Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10170, doi. 10.1007/s10854-020-03562-w
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- Article
31
Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5731, doi. 10.1007/s10854-020-03141-z
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- Article
32
Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn–3.0Ag–0.5Cu(SAC305)/Cu–2.0Be solder joints during reflowing.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 6, p. 4905, doi. 10.1007/s10854-020-03054-x
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- Article
33
Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4224, doi. 10.1007/s10854-020-02975-x
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- Article
34
Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 3876, doi. 10.1007/s10854-020-02933-7
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- Publication type:
- Article
35
Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2514, doi. 10.1007/s10854-019-02787-8
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- Article
36
Effects of TiO<sub>2</sub> nanoparticles addition on physical and soldering properties of Sn–xTiO<sub>2</sub> composite solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3
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- Article
37
Recent advances in nano-materials for packaging of electronic devices.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13855, doi. 10.1007/s10854-019-01790-3
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- Article
38
Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12869, doi. 10.1007/s10854-019-01648-8
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- Publication type:
- Article
39
Analytical thermal stress model for a typical flip-chip (FC) package design.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2676, doi. 10.1007/s10854-017-8194-6
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- Publication type:
- Article
40
Electrical resistivity and creep behavior of hypoeutectic Sn-0.5Cu based solders for flip chip technology.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12176, doi. 10.1007/s10854-017-7032-1
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- Publication type:
- Article
41
Effect of sintering temperatures on properties of BaO-BO-SiO-AlO glass/silica composites for CBGA package.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2206, doi. 10.1007/s10854-015-4012-1
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- Publication type:
- Article
42
Enhanced lead-free solder wettability of oxidized-nickel by Ar-H plasmas for flip chip bumping.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6853, doi. 10.1007/s10854-015-3301-z
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- Article
43
Characters of multicomponent lead-free solders.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3925, doi. 10.1007/s10854-013-1340-x
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- Article
44
Temperature measurement at flip chip solder joint during electromigration test.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 53, doi. 10.1007/s10854-009-9868-5
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- Article
45
A review on numerical approach of reflow soldering process for copper pillar technology.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w
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- Article
46
Numerical analysis performance of microbump cutting tool in hot machining Ti-6Al-4V.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 3/4, p. 2005, doi. 10.1007/s00170-022-09477-6
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- Article
47
Enhancement of the Unified Constitutive Model for Viscoplastic Solders in Wide Strain Rate and Temperature Ranges.
- Published in:
- Strength of Materials, 2019, v. 51, n. 6, p. 917, doi. 10.1007/s11223-020-00142-5
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- Article
48
Evaluation of Residual Stress in Flip Chip Using 3-D Optical Interferometry/FEM Hybrid Technique.
- Published in:
- Strain, 2007, v. 43, n. 4, p. 289, doi. 10.1111/j.1475-1305.2007.00355.x
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- Article
49
Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints.
- Published in:
- Nondestructive Testing & Evaluation, 2024, v. 39, n. 6, p. 1599, doi. 10.1080/10589759.2023.2274007
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- Article
50
Thermal Resistance of LEDs Based on a Narrow-Gap InAsSb Solid Solution.
- Published in:
- Optics & Spectroscopy, 2024, v. 132, n. 2, p. 200, doi. 10.1134/S0030400X2402019X
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- Publication type:
- Article