Works matching DE "FINE pitch technology"
Results: 14
Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer.
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- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 619, doi. 10.1049/mnl.2016.0267
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- Article
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1832, doi. 10.1007/s11664-008-0498-0
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- Article
Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection.
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- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1851, doi. 10.1007/s11664-008-0531-3
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- Article
Effects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2048, doi. 10.1007/s11664-006-0312-9
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- Article
Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1918, doi. 10.1007/s11664-006-0294-7
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- Article
Processability and Reliability of Nonconductive Adhesives (NCAs) in Fine-Pitch Chip-on-Flex Applications.
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- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 443, doi. 10.1007/BF02690531
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- Article
Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 32, doi. 10.4071/imaps.348081
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- Article
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 26, doi. 10.4071/imaps.348184
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- Article
Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-µm Bump Pitch.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 128, doi. 10.4071/imaps.504
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- Article
MEMS-based Ni-B probe with enhanced mechanical properties for fine pitch testing.
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- 2017
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- Letter
Fatigue life estimation of FBGA memory device under vibration.
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- Journal of Mechanical Science & Technology, 2014, v. 28, n. 1, p. 107, doi. 10.1007/s12206-013-0946-5
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- Article
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies.
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- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 671, doi. 10.1007/s11664-013-2669-x
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- Article
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
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- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
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- Article
Octave Error Immune and Instantaneous Pitch Detection Algorithm.
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- Journal of New Music Research, 2005, v. 34, n. 3, p. 273, doi. 10.1080/09298210500235301
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- Article