MEMS-based Ni-B probe with enhanced mechanical properties for fine pitch testing.
- Published in:
- 2017
- By:
- Publication type:
- Letter
Works matching DE "FINE pitch technology"
Results: 15
1
2
Octave Error Immune and Instantaneous Pitch Detection Algorithm.
- Published in:
- Journal of New Music Research, 2005, v. 34, n. 3, p. 273, doi. 10.1080/09298210500235301
- By:
- Publication type:
- Article
3
Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-µm Bump Pitch.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 3, p. 128, doi. 10.4071/imaps.504
- By:
- Publication type:
- Article
4
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 26, doi. 10.4071/imaps.348184
- By:
- Publication type:
- Article
5
Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 32, doi. 10.4071/imaps.348081
- By:
- Publication type:
- Article
6
INTERPRETATION OF THE PHÉBUS FPT0 AND FPT1 CIRCUIT RESULTS USING THE SOPHAEROS/ASTEC V1 MODULE.
- Published in:
- Nuclear Technology, 2010, v. 169, n. 1, p. 1, doi. 10.13182/NT10-A9339
- By:
- Publication type:
- Article
7
Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer.
- Published in:
- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 619, doi. 10.1049/mnl.2016.0267
- By:
- Publication type:
- Article
8
Fatigue life estimation of FBGA memory device under vibration.
- Published in:
- Journal of Mechanical Science & Technology, 2014, v. 28, n. 1, p. 107, doi. 10.1007/s12206-013-0946-5
- By:
- Publication type:
- Article
9
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 671, doi. 10.1007/s11664-013-2669-x
- By:
- Publication type:
- Article
10
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
- By:
- Publication type:
- Article
11
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1832, doi. 10.1007/s11664-008-0498-0
- By:
- Publication type:
- Article
12
Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1851, doi. 10.1007/s11664-008-0531-3
- By:
- Publication type:
- Article
13
Effects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2048, doi. 10.1007/s11664-006-0312-9
- By:
- Publication type:
- Article
14
Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1918, doi. 10.1007/s11664-006-0294-7
- By:
- Publication type:
- Article
15
Processability and Reliability of Nonconductive Adhesives (NCAs) in Fine-Pitch Chip-on-Flex Applications.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 443, doi. 10.1007/BF02690531
- By:
- Publication type:
- Article