Works matching DE "FIELD emission"
1
- Coatings (2079-6412), 2025, v. 15, n. 5, p. 531, doi. 10.3390/coatings15050531
- Yuan, Shidan;
- Ma, Ye;
- Yang, Hui;
- Ma, Zhen;
- Chen, Lei
- Article
2
- Soft Materials, 2014, v. 12, n. 2, p. 179, doi. 10.1080/1539445X.2013.847458
- Bao, Shiyong;
- Zhang, Ming;
- Du, MingLiang;
- Zhu, Han;
- Wang, Pan
- Article
3
- Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1553, doi. 10.1007/s11664-024-11682-w
- Parveen, Shama;
- Sarvar, Mohd;
- Zulfequar, Mohammad;
- Ali, Javid
- Article
4
- Journal of Electronic Materials, 2024, v. 53, n. 11, p. 6711, doi. 10.1007/s11664-024-11353-w
- Cao, Lijun;
- Xiao, Yixin;
- Wang, Mingming;
- Jiang, Boyu;
- Zhang, Xin;
- Huang, Wei;
- Jin, Zhengyang
- Article
5
- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2773, doi. 10.1007/s11664-023-10894-w
- Doundoulakis, G.;
- Pavlidis, D.
- Article
6
- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2798, doi. 10.1007/s11664-024-10966-5
- Spencer, Joseph A.;
- Jacobs, Alan G.;
- Hobart, Karl D.;
- Koehler, Andrew D.;
- Anderson, Travis J.;
- Zhang, Yuhao;
- Tadjer, Marko J.
- Article
7
- Surface Engineering, 2023, v. 39, n. 4, p. 445, doi. 10.1080/02670844.2023.2233256
- Kumaran, V.;
- Muralidharan, B.
- Article
8
- Surface Engineering, 2011, v. 27, n. 4, p. 294, doi. 10.1179/026708410X12786785573634
- Article
9
- Surface Engineering, 2010, v. 26, n. 8, p. 596, doi. 10.1179/026708410X12459349720097
- Shah, H. N.;
- Jayaganthan, R.;
- Kaur, D.
- Article
10
- Surface Engineering, 2010, v. 26, n. 8, p. 629, doi. 10.1179/174329409X389326
- Shah, H. N.;
- Jayaganthan, R.;
- Kaur, D.
- Article
11
- Surface Engineering, 2009, v. 25, n. 4, p. 303, doi. 10.1179/026708409X364939
- Kamal, S.;
- Jayaganthan, R.;
- Prakash, S.
- Article
12
- Surface Engineering, 2006, v. 22, n. 6, p. 462, doi. 10.1179/174329406X150413
- Chen, Y. M.;
- Lu, Y. P.;
- Li, M. S.
- Article
13
- Surface Engineering, 2003, v. 19, n. 3, p. 169
- Article
14
- Angewandte Chemie, 2014, v. 126, n. 23, p. 6046, doi. 10.1002/ange.201311053
- Narayanan, Rahul;
- Sarkar, Depanjan;
- Cooks, R. Graham;
- Pradeep, Thalappil
- Article
15
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16579, doi. 10.1007/s10854-019-02037-x
- Deepa, S.;
- Thomas, Boben;
- PrasannaKumari, K.
- Article
16
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16554, doi. 10.1007/s10854-019-02032-2
- Kumar, Ashish;
- Agrawal, Jitesh;
- Sharma, Ashok Kumar;
- Singh, Vipul;
- Agarwal, Ajay
- Article
17
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 9029, doi. 10.1007/s10854-019-01233-z
- Durmuş, Haziret;
- Yıldırım, Mert;
- Altındal, Şemsettin
- Article
18
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19013, doi. 10.1007/s10854-018-0027-8
- Gupta, Rashi;
- Chauhan, R. P.;
- Chakarvarti, S. K.;
- Jaiswal, M. K.;
- Ghoshal, D.;
- Basu, S.;
- Suresh, S.;
- Bartolucci, Stephen F.;
- Koratkar, N.;
- Kumar, Rajesh
- Article
19
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 14116, doi. 10.1007/s10854-018-9544-8
- Pujari, R. B.;
- Lokhande, A. C.;
- Ghogare, T. T.;
- Kale, S. B.;
- Lokhande, C. D.
- Article
20
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13620, doi. 10.1007/s10854-018-9490-5
- Jain, Vaibhav;
- Tripathi, Amit Kumar;
- Saini, Krishna;
- Deva, Dinesh;
- Lahiri, Indranil
- Article
21
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6260, doi. 10.1007/s10854-018-8603-5
- Gedekar, K. A.;
- Wankhede, S. P.;
- Moharil, S. V.;
- Belekar, R. M.
- Article
22
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10799, doi. 10.1007/s10854-017-6857-y
- Paulraj, Rajendran;
- Shankar, Prabakaran;
- Mani, Ganesh;
- Nallathambi, Lawrence;
- Rayappan, John
- Article
23
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 8, p. 6292, doi. 10.1007/s10854-016-6312-5
- Valian, Movlud;
- Beshkar, Farshad;
- Salavati-Niasari, Masoud
- Article
24
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3709, doi. 10.1007/s10854-016-5977-0
- Mao, Junwei;
- Hou, Xianhua;
- Chen, Hedong;
- Ru, Qiang;
- Hu, Shejun;
- Lam, Kwok-ho
- Article
25
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 3, p. 2723, doi. 10.1007/s10854-016-5851-0
- Ding, Yujie;
- Zhang, Zhiyuan;
- Wang, Lixi;
- Zhang, Qitu;
- Pan, Shibing
- Article
26
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1159, doi. 10.1007/s10854-016-5641-8
- Ye, Xiaona;
- Xu, Xiaoyun;
- Li, Lingwei;
- Xue, Shaolin;
- Han, Xiaojing;
- Wang, Kehui;
- Zhou, Weikang;
- Han, Junwei;
- Zou, Rujia
- Article
27
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1785, doi. 10.1007/s10854-016-5726-4
- Yang, Jun;
- Xu, Chao;
- Ye, Ting;
- Wang, Yongqian;
- Meng, Dawei
- Article
28
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 12100, doi. 10.1007/s10854-016-5360-1
- Golsefidi, Mazyar;
- Ramandi, Mostafa;
- Shahkooie, Mohammad
- Article
29
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9044, doi. 10.1007/s10854-016-4937-z
- Article
30
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5735, doi. 10.1007/s10854-016-4486-5
- Liu, Chang;
- Liu, Yunfei;
- Lyu, Yinong;
- Lyu, Chongguang
- Article
31
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5779, doi. 10.1007/s10854-016-4492-7
- Article
32
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6096, doi. 10.1007/s10854-016-4535-0
- Article
33
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6413, doi. 10.1007/s10854-016-4579-1
- Article
34
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2839, doi. 10.1007/s10854-013-1180-8
- Liu, Xiaomiao;
- Hu, Mingzhe;
- Chu, Xiangchegn;
- Yan, Qingfeng
- Article
35
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 1775, doi. 10.1007/s10854-012-1011-3
- Article
36
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 752, doi. 10.1007/s10854-012-0805-7
- Choudhary, Meenakshi;
- Singh, Nitish;
- Dwivedi, R.;
- Mishra, V.
- Article
37
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 368, doi. 10.1007/s10854-012-0758-x
- Nalage, S.;
- Chougule, M.;
- Sen, Shashvati;
- Patil, V.
- Article
38
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 10, p. 1823, doi. 10.1007/s10854-012-0669-x
- Jing, Hongjun;
- Jiang, Yadong;
- Du, Xiaosong
- Article
39
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1649, doi. 10.1007/s10854-011-0340-y
- Zhu, Tingting;
- Liu, Yafei;
- Hu, Zhonghua;
- Wang, Chenchen;
- Wen, Zubiao
- Article
40
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1730, doi. 10.1007/s10854-011-0353-6
- Yuan, Zhaolin;
- Yu, Junsheng;
- Wang, Nana;
- Jiang, Yadong
- Article
41
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1269, doi. 10.1007/s10854-011-0298-9
- Wen-Ching Shih;
- Jian-Min Jeng;
- Chin-Tze Huang;
- Jyi-Tsong Lo
- Article
42
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 724, doi. 10.1007/s10854-010-0200-1
- Yan, H. L.;
- Wang, J. B.;
- Zhong, X. L.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 4, p. 444, doi. 10.1007/s10854-010-0157-0
- Article
44
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 2, p. 174, doi. 10.1007/s10854-010-0109-8
- Guo Zhou;
- Shibing Ni;
- Xiaolei Sun;
- Xinghui Wang;
- Qi Wang;
- Deyan He
- Article
45
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 926, doi. 10.1007/s10854-009-0019-9
- Wen-Ching Shih;
- Jian-Min Jeng;
- Jyi-Tsong Lo;
- Huang-Chin Chen;
- I-Nan Lin
- Article
46
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 4, p. 385, doi. 10.1007/s10854-009-9929-9
- Chun-Shin Yeh;
- Dau-Chung Wang;
- Bohr-Ran Huang;
- Shih-Fong Lee;
- Jung-Fu Hsu;
- Jen-Yuan Mao
- Article
47
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 851, doi. 10.1007/s10854-008-9805-z
- Shih-Fong Lee;
- Yung-Ping Chang;
- Li-Ying Lee
- Article
48
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 996, doi. 10.1007/s10854-007-9438-7
- Aw, K. C.;
- Tjitra Salim, N.;
- Peng, Hui;
- Zhang, Lijuan;
- Travas-Sejdic, J.;
- Gao, W.
- Article
49
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 493, doi. 10.1007/s10854-008-9604-6
- Basu, P. K.;
- Saha, N.;
- Maji, S.;
- Saha, H.;
- Basu, Sukumar
- Article
50
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 893, doi. 10.1007/s10854-007-9125-8
- Jihoon Oh;
- Sunyoung Chang;
- Jiyoung Jang;
- Seungkwang Roh;
- Jaehong Park;
- Jungwoo Lee;
- Daewon Sohn;
- Whikun Yi;
- Yeongri Jung;
- Sung-Jin Kim
- Article