Works about EUTECTICS

Results: 2541

Competitive Growth Kinetics Between Primary Dendrites and Pseudobinary Eutectics Within Liquid CoCrFeNiSn Quinary Alloy.

Published in:

Metallurgical & Materials Transactions. Part A, 2025, v. 56, n. 6, p. 2102, doi. 10.1007/s11661-025-07761-0

By:

Yan, Pengxu;
Chang, Jian;
Wang, Weili;
Zhao, Xiaolei;
Hou, Niansi;
Wei, Bingbo

Publication type:

Article

Woven Eutectic Lamellar Structures Lead to Ultrahigh Strength and Energy Absorption Capacity in Additively Manufactured Lattice Structures.

Published in:

Small Structures, 2025, v. 6, n. 5, p. 1, doi. 10.1002/sstr.202400335

By:

Ji, Zhiyong;
Pan, Xingyu;
Wang, Longlong;
Wang, Xintian;
Chen, Xu;
Fu, Hanwei;
Qiu, Chunlei

Publication type:

Article

Formation of a nanoporous layer on the surface of silver and copper by dealloying of thermal diffusion coatings Me5Zn8 (Me=Ag, Cu) in a deep eutectic solvent.

Published in:

Surface Engineering, 2023, v. 39, n. 2, p. 198, doi. 10.1080/02670844.2023.2203440

By:

Kondina, A. I.;
Rozhentsev, D. A.;
Shurov, N. I.;
Tkachev, N. K.

Publication type:

Article

Pulse plating of Pd–Ag alloy films from deep eutectic solvents.

Published in:

Surface Engineering, 2019, v. 35, n. 12, p. 1081, doi. 10.1080/02670844.2019.1639320

By:

Manolova, Mila;
Böck, Reinhard;
Scharf, Ingolf;
Mehner, Thomas;
Lampke, Thomas

Publication type:

Article

Studies of electroslag cladding Inconel 52M multilayer.

Published in:

Surface Engineering, 2015, v. 31, n. 1, p. 52, doi. 10.1179/1743294414Y.0000000388

By:

Li, G.;
Zhang, M. L.;
Huang, J.;
Sun, Z. Y.;
Wu, Y. X.

Publication type:

Article

Electrodeposition of SnBi coatings based on deep eutectic solvent.

Published in:

Surface Engineering, 2014, v. 30, n. 1, p. 59, doi. 10.1179/1743294413Y.0000000198

By:

Gao, Y.;
Hu, W.;
Gao, X.;
Duan, B.

Publication type:

Article

Wear resistance of hypereutectic Fe-Cr-C hardfacing coatings with in situ formed TiC.

Published in:

Surface Engineering, 2013, v. 29, n. 5, p. 366, doi. 10.1179/1743294413Y.0000000120

By:

Zhou, Y F;
Yang, Y L;
Yang, J;
Zhang, P F;
Qi, X W;
Ren, X J;
Yang, Q X

Publication type:

Article

Electrodeposition of CdZn coatings based on deep eutectic solvent.

Published in:

Surface Engineering, 2012, v. 28, n. 8, p. 590, doi. 10.1179/1743294412Y.0000000023

By:

Gao, Y S;
Hu, W C;
Gao, X Q;
Duan, B X

Publication type:

Article

Laser fine cladding on miniature thin wall parts.

Published in:

Surface Engineering, 2011, v. 27, n. 6, p. 464, doi. 10.1179/026708410X12593178265580

By:

Shi, Y;
Zhang, H;
Liu, S Y

Publication type:

Article

Microwave‐Assisted Treatment of Waste Wood Biomass with Deep Eutectic Solvents.

Published in:: Macromolecular Symposia, 2022, v. 406, n. 1, p. 1, doi. 10.1002/masy.202270021
Publication type:: Article

Microwave‐Assisted Treatment of Waste Wood Biomass with Deep Eutectic Solvents.

Published in:

Macromolecular Symposia, 2022, v. 404, n. 1, p. 1, doi. 10.1002/masy.202100284

By:

Colella, Marco;
Romanazzi, Giuseppe;
Petrelli, Valentina;
Baldassarre, Francesca;
Ciccarella, Giuseppe;
Catauro, Michelina;
Mastrorilli, Pietro;
Dell'Anna, Maria Michela

Publication type:

Article

Thermal behavior and microstructure of a Methylnitroguanidine‐Nitroguanidine energetic eutectic.

Published in:

Propellants, Explosives, Pyrotechnics, 2023, v. 48, n. 5, p. 1, doi. 10.1002/prep.202200253

By:

You, Ting;
Chen, An;
Liao, Yimei;
Tian, Qiang;
Duan, Xiaohui

Publication type:

Article

Characterization and Testing for Lowest Eutectic Mixture of TNBA/DNTF.

Published in:

Propellants, Explosives, Pyrotechnics, 2023, v. 48, n. 2, p. 1, doi. 10.1002/prep.202200201

By:

Yu, Zhihong;
Song, Xiaolan;
Kou, Yong;
Wang, Yi;
An, Chongwei

Publication type:

Article

High‐Performance and Insensitive DNTF‐DFTNAN Eutectic: Binary Phase Diagram and Characterization.

Published in:

Propellants, Explosives, Pyrotechnics, 2022, v. 47, n. 11, p. 1, doi. 10.1002/prep.202200166

By:

Xiao, Chun;
Yu, Qian;
Zheng, Xiangyang;
Zheng, Baohui;
Guo, Ya;
Luo, Guan;
Jin, Bo;
Li, Jinshan

Publication type:

Article

Identification of 2,2‐dinitropropanol, a Hydrolyzed Product of Aged Eutectic Bis(2,2‐dinitropropyl) Acetal – Bis(2,2‐dinitropropyl) Formal Mixture.

Published in:

Propellants, Explosives, Pyrotechnics, 2022, v. 47, n. 10, p. 1, doi. 10.1002/prep.202100345

By:

Edgar, Alexander S.;
Wong, Camille H.;
Chen, Kitmin;
Langlois, David A.;
Yang, Dali

Publication type:

Article

Liquid Chromatography Mass Spectrometry Study of a Eutectic Mixture of bis(2,2‐Dinitropropyl) Acetal/Formal.

Published in:

Propellants, Explosives, Pyrotechnics, 2021, v. 46, n. 12, p. 1849, doi. 10.1002/prep.202100189

By:

Wong, Camille Hing;
Edgar, Alexander Steven;
Yang, Dali

Publication type:

Article

Characterization, Thermolysis, and Energetic Properties of an MTNP/PETN Eutectic Prepared via the Solvent/Anti‐Solvent Method.

Published in:

Propellants, Explosives, Pyrotechnics, 2021, v. 46, n. 2, p. 299, doi. 10.1002/prep.202000196

By:

Kou, Yong;
Song, Xiaolan;
Guo, Kaige;
Cheng, Zhipeng;
Wang, Yi

Publication type:

Article

Deep Eutectic Solvent—A Novel Additive to Induce Gamma Crystallization and Alpha‐to‐Gamma Phase Transition of PVDF.

Published in:

Macromolecular Chemistry & Physics, 2022, v. 223, n. 4, p. 1, doi. 10.1002/macp.202100416

By:

Yuan, Muhua;
Wang, Haijun;
Li, Huihui;
Yuan, Chunlei;
Wang, Tong;
Yang, Haibo

Publication type:

Article

Kinetic Studies of Photopolymerization of Monomer‐Containing Deep Eutectic Solvents.

Published in:

Macromolecular Chemistry & Physics, 2020, v. 221, n. 6, p. 1, doi. 10.1002/macp.201900511

By:

Fazende, Kylee F.;
Gary, Daniel P.;
Mota‐Morales, Josué D.;
Pojman, John A.

Publication type:

Article

Preparation of a Noncytotoxic Hemocompatible Ion Gel by Self-Polymerization of HEMA in a Green Deep Eutectic Solvent.

Published in:

Macromolecular Chemistry & Physics, 2016, v. 217, n. 17, p. 1899, doi. 10.1002/macp.201600122

By:

Mukesh, Chandrakant;
Upadhyay, Kapil K.;
Devkar, Ranjitsinh V.;
Chudasama, Nishith A.;
Raol, Gopalkumar G.;
Prasad, Kamalesh

Publication type:

Article

Formation of Multiple Structural Formats of DNA in a Bio-Deep Eutectic Solvent.

Published in:

Macromolecular Chemistry & Physics, 2015, v. 216, n. 10, p. 1061, doi. 10.1002/macp.201500009

By:

Mukesh, Chandrakant;
Prasad, Kamalesh

Publication type:

Article

FeIII‐Based Eutectic Mixtures as Multi‐task and Reusable Reaction Media for Efficient and Selective Conversion of Alkynes into Carbonyl Compounds.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 57, p. 1, doi. 10.1002/chem.202301736

By:

Ramos‐Martín, Marina;
Ríos‐Lombardía, Nicolas;
González‐Sabín, Javier;
García‐Garrido, Sergio E.;
Concellón, Carmen;
Presa Soto, Alejandro;
del Amo, Vicente;
García‐Álvarez, Joaquín

Publication type:

Article

Front Cover: FeIII‐Based Eutectic Mixtures as Multi‐task and Reusable Reaction Media for Efficient and Selective Conversion of Alkynes into Carbonyl Compounds (Chem. Eur. J. 57/2023).

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 57, p. 1, doi. 10.1002/chem.202301736

By:

Ramos‐Martín, Marina;
Ríos‐Lombardía, Nicolas;
González‐Sabín, Javier;
García‐Garrido, Sergio E.;
Concellón, Carmen;
Presa Soto, Alejandro;
del Amo, Vicente;
García‐Álvarez, Joaquín

Publication type:

Article

Efficient and Low‐Impact Acetalization Reactions in Deep Eutectic Solvents.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 36, p. 1, doi. 10.1002/chem.202300820

By:

Arnodo, Davide;
Meazzo, Carolina;
Baldino, Salvatore;
Blangetti, Marco;
Prandi, Cristina

Publication type:

Article

On the Mechanism of Cuprate Crystal Growth: The Role of Mixed Metal Carbonates.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 29, p. 4700, doi. 10.1002/adfm.201501058

By:

Green, David C.;
Boston, Rebecca;
Glatzel, Stefan;
Lees, Martin R.;
Wimbush, Stuart C.;
Potticary, Jason;
Ogasawara, Wataru;
Hall, Simon R.

Publication type:

Article

Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 15, p. 12321, doi. 10.1007/s10854-022-08190-0

By:

Wang, Chao-hong;
Chang, Tai-Yu

Publication type:

Article

Wetting behavior of eutectic Au–Sn solder on Ni/Au metallization at different temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 1774, doi. 10.1007/s10854-021-07227-0

By:

Wang, Jie;
Wu, Yiping;
Chen, Weimin;
Xie, Yangquan

Publication type:

Article

Nano-crystalline powders and microwave dielectric properties of Zr0.8Sn0.2TiO4 ceramics derived using deep eutectic solvents.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 23317, doi. 10.1007/s10854-021-06816-3

By:

Wang, Qi-feng;
Gu, Yong-jun;
Li, Qian;
Huang, Jin-liang;
Chen, Min;
Gao, Shun;
Kim, Bok-hee

Publication type:

Article

A mild process for the synthesis of Na2Ti3O7 as an anode material for sodium-ion batteries in deep eutectic solvent.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8422, doi. 10.1007/s10854-019-01159-6

By:

Wang, Cheng;
Yang, Yang;
Chen, Zongni;
He, Cui;
Su, Jing;
Wen, Yanxuan

Publication type:

Article

Surface and transport properties of liquid Ag-Sn alloys and a case study of Ag-Sn eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17108, doi. 10.1007/s10854-018-9897-z

By:

Novakovic, R.;
Delsante, S.;
Lee, J.;
Borzone, G.

Publication type:

Article

Scintillation and dosimeter properties of 6LiF/CaF2:Eu eutectic composites.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 8964, doi. 10.1007/s10854-018-8918-2

By:

Kawano, Naoki;
Kawaguchi, Noriaki;
Fukuda, Kentaro;
Okada, Go;
Yanagida, Takayuki

Publication type:

Article

Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7651, doi. 10.1007/s10854-018-8758-0

By:

Huang, J. Q.;
Zhou, M. B.;
Liang, S. B.;
Zhang, X. P.

Publication type:

Article

Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 1, p. 436, doi. 10.1007/s10854-017-7932-0

By:

Huang, Yufeng;
Liu, Wensheng;
Ma, Yunzhu;
Wang, Yikai;
Tang, Siwei

Publication type:

Article

Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin-bismuth solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15718, doi. 10.1007/s10854-017-7465-6

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

Behavior of eutectic Sn-Bi powder in Cu nanoparticle joints during the thermal treatment.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8764, doi. 10.1007/s10854-017-6602-6

By:

Tajima, S.;
Satoh, T.;
Ishizaki, T.;
Usui, M.

Publication type:

Article

High temperature MEMS packages: die-attach solutions for LiNbO under low bonding pressures.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8784, doi. 10.1007/s10854-017-6605-3

By:

Roshanghias, Ali;
Bruckner, Gudrun;
Binder, Alfred

Publication type:

Article

Harsh service environment effects on the microstructure and mechanical properties of Sn-Ag-Cu-1 wt% nano-Al solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11273, doi. 10.1007/s10854-016-5250-6

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

Effect of aluminum addition on the electrochemical corrosion behavior of Sn-3Ag-0.5Cu solder alloy in 3.5 wt% NaCl solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 12193, doi. 10.1007/s10854-016-5374-8

By:

Fayeka, M.;
Fazal, M.;
Haseeb, A.

Publication type:

Article

Effects of temperature and dispersants on the phases and morphology of Ag-Cu nanoparticles.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10065, doi. 10.1007/s10854-016-5079-z

By:

Liu, Xiaojian;
Zheng, Zhen;
Wang, Chunqing;
Liu, Wei;
Kong, Lingchao

Publication type:

Article

Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 5000, doi. 10.1007/s10854-013-1515-5

By:

Garnier, Arnaud;
Baillin, Xavier;
Hodaj, Fiqiri

Publication type:

Article

Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2052, doi. 10.1007/s10854-012-1055-4

By:

Goh, Yingxin;
Lee, Seen;
Haseeb, A.

Publication type:

Article

Phase formation sequence of high-temperature Zn-4Al-3Mg solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 336, doi. 10.1007/s10854-012-0751-4

By:

Li, Li;
Liu, Yongchang;
Gao, Huixia;
Gao, Zhiming

Publication type:

Article

Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu-xPOSS composite solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1640, doi. 10.1007/s10854-012-0641-9

By:

Shen, Jun;
Peng, Changfei;
Yin, Heng;
Chen, Jie

Publication type:

Article

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 8, p. 1543, doi. 10.1007/s10854-012-0626-8

By:

Zhou, M.;
Ma, X.;
Zhang, X.

Publication type:

Article

Reliability of printed circuit boards containing lead-free solder in aggressive environments.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 4, p. 400, doi. 10.1007/s10854-010-0150-7

By:

Moshrefi-Torbati, M.;
Swingler, J.

Publication type:

Article

Effect of Sn-doping on the sintering process of MgB and its superconductive properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 233, doi. 10.1007/s10854-010-0120-0

By:

Huo, J.;
Liu, Y.;
Dong, Z.;
Jiang, H.

Publication type:

Article

Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 499, doi. 10.1007/s10854-008-9757-3

By:

Ning Zhang;
Yaowu Shi;
Zhidong Xia;
Yongping Lei;
Fu Guo;
Xiaoyan Li

Publication type:

Article

Electromigration-induced cracks in eutectic SnPb solder reaction couple at room temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 3, p. 276, doi. 10.1007/s10854-008-9720-3

By:

Xu, G.;
He, H.;
Guo, F.

Publication type:

Article

Nanoindentation for measuring individual phase mechanical properties of lead free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 514, doi. 10.1007/s10854-007-9374-6

By:

Yong Sun;
Jin Liang;
Zhi-Hui Xu;
Guofeng Wang;
Xiaodong Li

Publication type:

Article

Design of solder joints for fundamental studies on the effects of electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 6, p. 569, doi. 10.1007/s10854-007-9263-z

By:

Ho, C.;
Lee, A.;
Subramanian, K.

Publication type:

Article