Works matching DE "EUTECTIC alloys"

Results: 959

STATIC FRICTION IN TRIBOSYSTEMS COMPOSED OF ALUMINIUM-SILICON ALLOYS.

Published in:

Journal of the Balkan Tribological Association, 2025, v. 31, n. 2, p. 149

By:

KANDEVA, M.;
DOCHEV, B.;
ZAGORSKI, M.;
DIMOVA, D.;
KASABOV, P.;
TSONEV, V.

Publication type:

Article

Influence of Laser Thermal Cycling on the Structure Evolution and Tribological Properties of Plasma Coatings.

Published in:

Journal of Nano- & Electronic Physics, 2025, v. 17, n. 2, p. 1, doi. 10.21272/jnep.17(2).02013

By:

Kindrachuk, M. V.;
Kharchenko, V. V.;
Volchenko, O. I.;
Marchuk, V. Ye.;
Humeniuk, I. A.;
Voznyi, A. V.

Publication type:

Article

High hardness Ta doped eutectic high entropy alloy by wire arc additive manufacturing.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 3, p. 1251, doi. 10.1007/s00170-025-15384-3

By:

Zavdoveev, Anatoliy;
Baudin, Thierry;
Brisset, Francoise;
Speicher, Magdalena;
Klapatyuk, Andrey;
Gaivoronskiy, Aleksandr;
Poznyakov, Valeriy;
Vedel, Dmitry;
Klochkov, Illia;
Junwen, Ji;
Kopylov, Viacheslav;
Motrunich, Sviatoslav;
Bevz, Vitaliy;
Pashinska, Elena;
Poida, Andrey

Publication type:

Article

Advances in the Corrosion Behavior of High‐Entropy Alloys in Lead‐Bismuth Eutectic System.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402774

By:

Wu, Wenmin;
Hu, Xiaogang;
Peng, Xiangyang;
Qiu, Longshi;
Cao, PeiPei;
He, Huan;
Gao, Zhiwen;
Pan, Xiaolong;
Zhang, Yusheng

Publication type:

Article

Woven Eutectic Lamellar Structures Lead to Ultrahigh Strength and Energy Absorption Capacity in Additively Manufactured Lattice Structures.

Published in:

Small Structures, 2025, v. 6, n. 5, p. 1, doi. 10.1002/sstr.202400335

By:

Ji, Zhiyong;
Pan, Xingyu;
Wang, Longlong;
Wang, Xintian;
Chen, Xu;
Fu, Hanwei;
Qiu, Chunlei

Publication type:

Article

Effect of Ni foam addition on the microstructure and mechanical properties of In–48Sn eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 12594, doi. 10.1007/s10854-022-08209-6

By:

Liu, Kai;
Li, Jiaqi;
Zhang, Jian;
Xiao, Yong

Publication type:

Article

The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22155, doi. 10.1007/s10854-021-06691-y

By:

Raza, Mehdi;
Shewchenko, Lee;
Olofinjana, Ayodele;
Kent, Damon;
Mata, Jitendra;
Haque, Rezwanul

Publication type:

Article

A SnBiAgIn solder alloy with exceptional mechanical properties by rapid quenching.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 8167, doi. 10.1007/s10854-021-05539-9

By:

Ma, Hailan;
Zhao, Bingge;
Wu, Guanzhi;
Li, Zhen;
Gao, Yulai

Publication type:

Article

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article

Growth of rod structure with static electrical field in the Al–Ni eutectic system.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14055, doi. 10.1007/s10854-020-03960-0

By:

Basit, Sercan;
Birinci, Semih;
Maraşlı, Necmettin

Publication type:

Article

Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10731, doi. 10.1007/s10854-020-03623-0

By:

Gumaan, Mohammed S.

Publication type:

Article

Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2514, doi. 10.1007/s10854-019-02787-8

By:

Liu, Han;
Xue, Songbai;
Tao, Yu;
Long, Weimin;
Zhong, Sujuan

Publication type:

Article

The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18970, doi. 10.1007/s10854-019-02254-4

By:

Dobosz, A.;
Plevachuk, Yu.;
Sklyarchuk, V.;
Sokoliuk, B.;
Gancarz, T.

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7423, doi. 10.1007/s10854-019-01056-y

By:

Zhou, Shiqi;
Shen, Yu-An;
Uresti, Tiffani;
Shunmugasamy, Vasanth C.;
Mansoor, Bilal;
Nishikawa, Hiroshi

Publication type:

Article

Piezoelectricity, piezoresistivity and dielectricity discovered in solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4462, doi. 10.1007/s10854-019-00735-0

By:

Xi, Xiang;
Chung, D. D. L.

Publication type:

Article

Early stages of wetting of copper by Sn-Zn eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 20531, doi. 10.1007/s10854-018-0197-4

By:

Pstruś, J.

Publication type:

Article

Low temperature and low pressure bonding of plateless Cu-Cu substrates by Ag-based transient liquid phase sintering.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9351, doi. 10.1007/s10854-017-6674-3

By:

Muhammad, Khairi Faiz;
Yamamoto, Takehiro;
Yoshida, Makoto

Publication type:

Article

Harsh service environment effects on the microstructure and mechanical properties of Sn-Ag-Cu-1 wt% nano-Al solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11273, doi. 10.1007/s10854-016-5250-6

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

Erratum to: Study of off-eutectic Zn-xMg high temperature solder alloys.

Published in:

2016

By:

Galib, Roisul;
Hasan, Rahat;
Sharif, Ahmed

Publication type:

Erratum

Performance and stability of PTB7:PCBM based polymer solar cells, with ECZ and/or PVK dopants, under the application of an external electric field.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6271, doi. 10.1007/s10854-016-4559-5

By:

Álvarez-Fernández, Armando;
Maldonado, José-Luis;
Pérez-Gutiérrez, Enrique;
Rodríguez, Mario;
Ramos-Ortíz, Gabriel;
Barbosa-García, Oracio;
Meneses-Nava, Marco-Antonio;
Zolotukhin, Mikhail

Publication type:

Article

Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3182, doi. 10.1007/s10854-015-4143-4

By:

Lai, Zhongmin;
Ye, Dan

Publication type:

Article

Fluidity of Sn-based eutectic solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9478, doi. 10.1007/s10854-015-3415-3

By:

Morando, Carina;
Fornaro, Osvaldo;
Garbellini, Olga;
Palacio, Hugo

Publication type:

Article

Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 345, doi. 10.1007/s10854-014-2406-0

By:

Zhao, N.;
Huang, M.;
Zhong, Y.;
Ma, H.;
Pan, X.

Publication type:

Article

Comparative corrosion behaviour of different Sn-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 464, doi. 10.1007/s10854-014-2422-0

By:

Farina, Silvia;
Morando, Carina

Publication type:

Article

Composition control of co-electroplating Au-Sn deposits using experimental strategies.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4933, doi. 10.1007/s10854-014-2254-y

By:

Huang, M.;
Huang, F.;
Pan, J.;
Zhang, T.

Publication type:

Article

The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1446, doi. 10.1007/s10854-014-1749-x

By:

Sona, Mrunali;
Prabhu, K.

Publication type:

Article

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5

By:

Spinelli, José;
Garcia, Amauri

Publication type:

Article

A simple process for electrodeposition of Sn-rich, Au-Sn solder films.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 827, doi. 10.1007/s10854-012-0828-0

By:

Watt, Charles;
Liu, Qi;
Ivey, Douglas

Publication type:

Article

Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 5, p. 1108, doi. 10.1007/s10854-011-0557-9

By:

Han, Y.;
Jing, H.;
Nai, S.;
Xu, L.;
Tan, C.;
Wei, J.

Publication type:

Article

The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn-3.5Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 484, doi. 10.1007/s10854-011-0422-x

By:

Şahin, Mevlüt;
Çadirli, Emin

Publication type:

Article

Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 31, doi. 10.1007/s10854-011-0398-6

By:

Çadırlı, E.;
Şahin, M.

Publication type:

Article

Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 94, doi. 10.1007/s10854-011-0469-8

By:

Negm, Samia

Publication type:

Article

Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1709, doi. 10.1007/s10854-011-0350-9

By:

Çadırlı, E.;
Şahin, M.;
Kayalı, R.;
Arı, M.;
Durmuş, S.

Publication type:

Article

Shear strength of the Zn-Sn high-temperature lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 8, p. 1168, doi. 10.1007/s10854-010-0279-4

By:

Mahmudi, R.;
Eslami, M.

Publication type:

Article

A novel method of reducing melting temperatures in SnAg and SnCu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 281, doi. 10.1007/s10854-010-0128-5

By:

Chukka, Rami N.;
Telu, Suresh;
NRMR, Bhargava;
Chen, Lang

Publication type:

Article

Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 58, doi. 10.1007/s10854-009-9870-y

By:

Mahmudi, R.;
Geranmayeh, A. R.;
Zahiri, B.;
Marvasti, M. H.

Publication type:

Article

Stability of AuSn eutectic solder cap on Au socket during reflow.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 55, doi. 10.1007/s10854-008-9606-4

By:

Yu, D. Q.;
Oppermann, H.;
Kleff, J.;
Hutter, M.

Publication type:

Article

The relation between microstructure and corrosion behavior of Mg-Gd-Zn alloy with long period stacking ordered structure.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2015, v. 66, n. 6, p. 542, doi. 10.1002/maco.201407696

By:

Zhang, J.‐S.;
Wang, D.;
Zhang, W.‐B.;
Pei, H.‐X.;
You, Z.‐Y.;
Xu, C.‐X.;
Cheng, W.‐L.

Publication type:

Article

Assessment of the effect of 3D printed sand mold thickness on solidification process of AlSi13 casting alloy.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 114, n. 5/6, p. 1753, doi. 10.1007/s00170-021-06999-3

By:

Ben Saada, Mariem;
El Mansori, Mohamed

Publication type:

Article

Comparative study of eutectic Al-Si alloys manufactured by WAAM and casting.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 110, n. 3/4, p. 935, doi. 10.1007/s00170-020-05735-7

By:

Langelandsvik, Geir;
Horgar, Annbjørg;
Furu, Trond;
Roven, Hans J.;
Akselsen, Odd M.

Publication type:

Article

Aggregation or dispersion of Si atoms in Al–Si alloys? from the view point of energetics.

Published in:

Theoretical Chemistry Accounts: Theory, Computation, & Modeling, 2022, v. 141, n. 3, p. 1, doi. 10.1007/s00214-022-02873-x

By:

Zhang, Lin;
Chen, Hongshan

Publication type:

Article

Structure, stability and bonding features of AlnSim clusters.

Published in:

Theoretical Chemistry Accounts: Theory, Computation, & Modeling, 2020, v. 139, n. 7, p. 1, doi. 10.1007/s00214-020-02616-w

By:

Rahma, Omklsoum M.;
Chen, Hongshan

Publication type:

Article

Investigation of Al-Si-Cu-Zn-Y-Base Alloy Powders Prepared by Ultrasonic Gas Atomization for Brazing of an Al-Base Alloy.

Published in:

Strength of Materials, 2021, v. 53, n. 4, p. 591, doi. 10.1007/s11223-021-00321-y

By:

Sheng, L. Y.;
Zhao, H.

Publication type:

Article

Influence of Tantalum Addition on Microstructure and Mechanical Properties of the Nial-Based Eutectic Alloy.

Published in:

Strength of Materials, 2017, v. 49, n. 1, p. 109, doi. 10.1007/s11223-017-9848-6

By:

Sheng, L.;
Du, B.;
Lai, C.;
Guo, J.;
Xi, T.

Publication type:

Article

Surface tension of lead-bismuth eutectic melts with lithium.

Published in:

High Temperature, 2016, v. 54, n. 6, p. 815, doi. 10.1134/S0018151X16050011

By:

Alchagirov, B.;
Dyshekova, F.

Publication type:

Article

Monitoring and control of the oxygen content in heavy liquid-metal coolants for anticorrosion protection of steels.

Published in:

High Temperature, 2016, v. 54, n. 4, p. 564, doi. 10.1134/S0018151X16040015

By:

Askhadullin, R.;
Martynov, P.;
Rachkov, V.;
Legkikh, A.;
Storozhenko, A.;
Ul'yanov, V.;
Gulevskiy, V.

Publication type:

Article

An experimental investigation of the density and thermal expansion of advanced materials and heat-transfer agents of liquid-metal systems of fusion reactor: Lead-lithium eutectic.

Published in:

High Temperature, 2006, v. 44, n. 6, p. 829, doi. 10.1007/s10740-006-0100-5

By:

Stankus, S.;
Khairulin, R.;
Mozgovoi, A.

Publication type:

Article

The density of a liquid-metal heat-transfer agent on the basis of lead-bismuth eutectic at high temperatures.

Published in:

High Temperature, 2006, v. 44, n. 2, p. 306, doi. 10.1007/s10740-006-0038-7

By:

Stankus, S.;
Khairulin, R.;
Mozgovoi, A.;
Roshchupkin, V.;
Pokrasin, M.

Publication type:

Article

The Structure-Thermodynamic State and the Mechanism of Crystallization of Gallium-Based Melts.

Published in:

High Temperature, 2005, v. 43, n. 5, p. 700, doi. 10.1007/s10740-005-0114-4

By:

Prokhorenko, S.

Publication type:

Article