Works matching DE "ETCHING"

Results: 1793

Precise Morphology Tailoring of Through Glass Vias Perforated by Selective Laser-Induced Etching on Fused Silica.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4150, doi. 10.1007/s11837-025-07151-2

By:

Liu, Jingli;
Yin, Chunyan;
Xia, Chenhui;
Ming, Xuefei;
Dou, Guangbin

Publication type:

Article

REVIEW ON CARBON DOT A NOVEL NANO MEDICINAL APPROACH: STRUCTURE, PROPERTIES & SYNTHESIS.

Published in:

Obstetrics & Gynaecology Forum, 2024, v. 34, n. 2, p. 230

By:

Mandal, Debdip;
Jana, Soma;
Dey, Avijit Kumar;
Sahoo, Anup Kumar;
Pahari, Sandip Kumar;
Debnath, Biplab

Publication type:

Article

ALTE BILDER NEU GENUTZT.

Published in:

Librarium: Zeitschrift der Schweizerischen Bibliophilen-Gesellschaft, 2025, n. 1, p. 34

By:

MOSER, ANDREAS

Publication type:

Article

ZnO Microtubes: Formation Mechanism and Whispering Gallery Mode Lasing.

Published in:

Crystallography Reports, 2025, v. 70, n. 1, p. 31, doi. 10.1134/S1063774524602685

By:

Tarasov, A. P.;
Zadorozhnaya, L. A.;
Nabatov, B. V.;
Kanevsky, V. M.

Publication type:

Article

Using wet chemistry for etching under-bump metal.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 89

By:

Beret, Marvin;
Solomon, Gary

Publication type:

Article

Laser etching for flip-chip de-bug and inverse stereolithography for MEMS.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 145

By:

Ehrlich, Daniel;
Silverman, Scott;
Aucoin, Richard;
Burns, Michael

Publication type:

Article

Pattern transfer into low dielectric constant materials by high-density plasma etching.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 125

By:

Oehrlein, Gottlieb S.;
Standaert, Theodorus E. F. M.;
Matsuo, Peter J.

Publication type:

Article

Etch challenges of low-k dielectrics.

Published in:

Solid State Technology, 1999, v. 42, n. 6, p. 71

By:

Morey, Ian;
Asthana, Ashish

Publication type:

Article

A novel resist and post-etch residue removal process using ozonated chemistry.

Published in:

Solid State Technology, 1998, v. 41, n. 12, p. 57

By:

Gendt, S. De;
Wauters, J.;
Heyns, M.

Publication type:

Article

Anhydrous HF etch reduces processing steps for DRAM capacitors.

Published in:

Solid State Technology, 1998, v. 41, n. 5, p. 71

By:

Chang, S.-L. Luke;
Hanestad, Ron;
Butterbaugh, Jeffery W.

Publication type:

Article

Preparation of super-hydrophobic surface on Al-Mg alloy substrate by electrochemical etching.

Published in:

Surface Engineering, 2019, v. 35, n. 5, p. 394, doi. 10.1080/02670844.2017.1421883

By:

Ning Ma;
Yang Chen;
Shuguo Zhao;
Jingchun Li;
Baofeng Shan;
Juhe Sun

Publication type:

Article

Preparation of durable underwater superoleophobic Ti6Al4V surfaces by electrochemical etching.

Published in:

Surface Engineering, 2016, v. 32, n. 2, p. 85, doi. 10.1080/02670844.2015.1108073

By:

Wang, L. L.;
Sun, Y. W.;
Gao, Y. Z.;
Guo, D. M.

Publication type:

Article

Plasma nitriding of AISI 2205 steel: effects of surface mechanical attrition treatment and chemical etching.

Published in:

Surface Engineering, 2016, v. 32, n. 1, p. 61, doi. 10.1080/02670844.2015.1112937

By:

Gatey, Atul M.;
Hosmani, Santosh S.;
Arya, Shashi B.;
Figueroa, Carlos A.;
Singh, Rajkumar P.

Publication type:

Article

TiAlCN/VCN nanolayer coatings suitable for machining of Al and Ti alloys deposited by combined high power impulse magnetron sputtering/unbalanced magnetron sputtering.

Published in:

Surface Engineering, 2010, v. 26, n. 8, p. 610, doi. 10.1179/026708408X336337

By:

Hovsepian, P. E.;
Ehiasarian, A. P.;
Petrov, I.

Publication type:

Article

Mechanism of grinding wheel surface reproduction in regular surface texture generation.

Published in:

Surface Engineering, 2008, v. 24, n. 3, p. 219, doi. 10.1179/174329408X282596

By:

Stepien, P.

Publication type:

Article

Process limitations of magnetically enhanced reactive ion etch equipment.

Published in:

Surface Engineering, 2006, v. 22, n. 4, p. 263, doi. 10.1179/174329406X122928

By:

Kim, B.;
Park, J. Y.;
Hong, S. J.

Publication type:

Article

Oxide via hole formation using magnetically enhanced reactive ion etching.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 469, doi. 10.1179/174329405X55348

By:

Kim, B.;
Park, J.

Publication type:

Article

Modelling Plasma Etching of AI Thin Films using Neural Network.

Published in:

Surface Engineering, 2004, v. 20, n. 6, p. 454, doi. 10.1179/026708404X1099

By:

Kim, B.;
Park, K. Y.;
Han, D.

Publication type:

Article

Morphological Properties of Nanocrystalline Silicon from p‐Type Bulk Silicon.

Published in:

Macromolecular Symposia, 2022, v. 401, n. 1, p. 1, doi. 10.1002/masy.202100306

By:

Al‐Kadumi, Ahmed K.;
AL‐Baghdadi, M.

Publication type:

Article

Organic‐Inorganic Hybrid Crystal‐Assisted Etching of Nickel Foam for the Collectively Exhaustive Electrochemical Performance of Oxygen Evolution Reaction.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 52, p. 1, doi. 10.1002/chem.202301469

By:

Thangasamy, Pitchai;
He, Rong;
Chen, Xinqi;
Yu, Kunpeng;
Randriamahazaka, Hyacinthe;
Chen, Zheng;
Luo, Hongmei;
Zhou, Xiao‐Dong;
Zhou, Meng

Publication type:

Article

Shape Transformation via Etching and Regrowth: A Systematic Study of Pd Nanocrystals with Different Shapes and Twin Structures.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 48, p. 1, doi. 10.1002/chem.202301465

By:

Lv, Tian;
Liu, Maochang;
Zhou, Siyu;
Xia, Younan

Publication type:

Article

Real-Time Optical Detection of Stabilized Artificial G-Quadruplexes Under Confined Conditions.

Published in:

Angewandte Chemie, 2013, v. 125, n. 48, p. 12829, doi. 10.1002/ange.201306230

By:

Rusu, Bogdan George;
Cunin, Frédérique;
Barboiu, Mihail

Publication type:

Article

The Stoichiometry of Electroless Silicon Etching in Solutions of V2O5 and HF.

Published in:

Angewandte Chemie, 2013, v. 125, n. 26, p. 6863, doi. 10.1002/ange.201300755

By:

Kolasinski, Kurt W.;
Barclay, William B.

Publication type:

Article

Scaling the Aspect Ratio of Nanoscale Closely Packed Silicon Vias by MacEtch: Kinetics of Carrier Generation and Mass Transport.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 12, p. n/a, doi. 10.1002/adfm.201605614

By:

Kim, Jeong Dong;
Mohseni, Parsian K.;
Balasundaram, Karthik;
Ranganathan, Srikanth;
Pachamuthu, Jayavel;
Coleman, James J.;
Li, Xiuling

Publication type:

Article

Void Engineering in Metal-Organic Frameworks via Synergistic Etching and Surface Functionalization.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 32, p. 5827, doi. 10.1002/adfm.201601193

By:

Hu, Ming;
Ju, Yi;
Liang, Kang;
Suma, Tomoya;
Cui, Jiwei;
Caruso, Frank

Publication type:

Article

Direct Imprinting of Porous Silicon via Metal-Assisted Chemical Etching.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 17, p. 2929, doi. 10.1002/adfm.201505153

By:

Azeredo, Bruno P.;
Lin, Yu‐Wei;
Avagyan, Arik;
Sivaguru, Mayandi;
Hsu, Keng;
Ferreira, Placid

Publication type:

Article

Porous Silicon Nanodiscs for Targeted Drug Delivery.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 7, p. 1137, doi. 10.1002/adfm.201403414

By:

Alhmoud, Hashim;
Delalat, Bahman;
Elnathan, Roey;
Cifuentes‐Rius, Anna;
Chaix, Arnaud;
Rogers, Mary‐Louise;
Durand, Jean‐Olivier;
Voelcker, Nicolas H.

Publication type:

Article

Micropattern Formation by Molecular Migration via UV-induced Dehydration of Block Copolymers.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 19, p. 2801, doi. 10.1002/adfm.201302812

By:

Okada, Kenji;
Tokudome, Yasuaki;
Makiura, Rie;
Konstas, Kristina;
Malfatti, Luca;
Innocenzi, Plinio;
Ogawa, Hiroki;
Kanaya, Toshiji;
Falcaro, Paolo;
Takahashi, Masahide

Publication type:

Article

Nanomembranes: Exfoliation of Threading Dislocation-Free, Single-Crystalline, Ultrathin Gallium Nitride Nanomembranes (Adv. Funct. Mater. 16/2014).

Published in:

Advanced Functional Materials, 2014, v. 24, n. 16, p. 2412, doi. 10.1002/adfm.201470104

By:

ElAfandy, Rami T.;
Majid, Mohammed A.;
Ng, Tien Khee;
Zhao, Lan;
Cha, Dongkyu;
Ooi, Boon S.

Publication type:

Article

Efficient Si Nanowire Array Transfer via Bi-Layer Structure Formation Through Metal-Assisted Chemical Etching.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 13, p. 1949, doi. 10.1002/adfm.201303180

By:

Moon, Taeho;
Chen, Lin;
Choi, Shinhyun;
Kim, Chunjoong;
Lu, Wei

Publication type:

Article

Colloidal Surface Assemblies: Nanotechnology Meets Bioinspiration.

Published in:

Advanced Functional Materials, 2014, v. 23, n. 36, p. 4529, doi. 10.1002/adfm.201203885

By:

Kraus, Tobias;
Brodoceanu, Daniel;
Pazos‐Perez, Nicolas;
Fery, Andreas

Publication type:

Article

Nanowires: Decoupling Diameter and Pitch in Silicon Nanowire Arrays Made by Metal-Assisted Chemical Etching (Adv. Funct. Mater. 1/2014).

Published in:

Advanced Functional Materials, 2014, v. 24, n. 1, p. 105, doi. 10.1002/adfm.201470005

By:

Yeom, Junghoon;
Ratchford, Daniel;
Field, Christopher R.;
Brintlinger, Todd H.;
Pehrsson, Pehr E.

Publication type:

Article

Decoupling Diameter and Pitch in Silicon Nanowire Arrays Made by Metal-Assisted Chemical Etching.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 1, p. 106, doi. 10.1002/adfm.201301094

By:

Yeom, Junghoon;
Ratchford, Daniel;
Field, Christopher R.;
Brintlinger, Todd H.;
Pehrsson, Pehr E.

Publication type:

Article

Properties enhancement of TiO2 nanorod thin film using hydrochloric acid etching treatment method.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16348, doi. 10.1007/s10854-022-08526-w

By:

Ahmad Ramli, Shazleen;
Mohamad, Fariza;
Anizam, A. G. A.;
Ahmad, M. K.;
Ahmad, Norazlina;
Mohd Ismail, Anis Zafirah;
Mohamad Arifin, Nurliyana;
Maarof, Nurul Amiera Shahida;
Nurhaziqah, A. M. S.;
Saputri, D. G.;
Muhd Nor, Nik Hisyamudin;
Masanobu, Izaki

Publication type:

Article

In situ X-ray photoelectron spectroscopy study: effect of inert Ar sputter etching on the core-level spectra of the CVD-grown tri-layer MoS2 thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 11, p. 8741, doi. 10.1007/s10854-021-06798-2

By:

Jayaseelan, V.;
Kalaiezhily, R. K.;
Shinde, Nitin Babu;
Kamala Bharathi, K.;
Navaneethan, M.;
Eswaran, Senthil Kumar

Publication type:

Article

Advanced damage-free neutral beam etching technology to texture Si wafer with honeycomb pattern for broadband light trapping in photovoltaics.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27449, doi. 10.1007/s10854-021-07121-9

By:

Sekhar, Halubai;
Fukuda, Tetsuo;
Kubota, Tomohiro;
Rahman, Mohammad Maksudur;
Takato, Hidetaka;
Kondo, Michio;
Samukawa, Seiji

Publication type:

Article

Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16481, doi. 10.1007/s10854-021-06205-w

By:

Chen, Li;
Yu, Daquan

Publication type:

Article

A comparative study between thermal etching and liquid exfoliation of bulk graphitic carbon nitride to nanosheets for the photocatalytic degradation of a model environmental pollutant, Rhodamine B.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 687, doi. 10.1007/s10854-020-04849-8

By:

Rono, Nicholas;
Kibet, Joshua K.;
Martincigh, Bice S.;
Nyamori, Vincent O.

Publication type:

Article

Selective wet etching in fabricating SiGe nanowires with TMAH solution for gate-all-around MOSFETs.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22478, doi. 10.1007/s10854-020-04748-y

By:

Cheng, Xiaohong;
Li, Yongliang;
Liu, Haoyan;
Zan, Ying;
Lu, Yihong;
Zhang, Qingzhu;
Li, Junjie;
Du, Anyan;
Wu, Zhenhua;
Luo, Jun;
Wang, Wenwu

Publication type:

Article

Enhancement of electrochemical detection of Pb2+ by sensor based on track-etched membranes modified with interpolyelectrolyte complexes.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20368, doi. 10.1007/s10854-020-04556-4

By:

Korolkov, Ilya V.;
Zhumanazar, Nurdaulet;
Gorin, Yevgeniy G.;
Yeszhanov, Arman B.;
Zdorovets, Maxim V.

Publication type:

Article

Investigation on the formation technique of SiGe Fin for the high mobility channel FinFET device.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5854, doi. 10.1007/s10854-019-02661-7

By:

Zhao, Zhiqian;
Cheng, Xiaohong;
Li, Yongliang;
Zan, Ying;
Liu, Haoyan;
Wang, Guilei;
Du, Anyan;
Li, Junjie;
Zhang, Qingzhu;
Xu, Gaobo;
Ma, Xueli;
Wang, Xiaolei;
Yang, Hong;
Xu, Jing;
Luo, Jun;
Li, JunFeng;
Yin, Huaxiang;
Wang, Wenwu

Publication type:

Article

Surface modification influenced properties of silicon nanowires grown by Ag assisted chemical etching with ECR hydrogen plasma treatment.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 1904, doi. 10.1007/s10854-019-02709-8

By:

Madhavi, Karanam;
Ghosh, Monalisa;
Mohan Rao, G.;
Padma Suvarna, R.

Publication type:

Article

Study of selective isotropic etching Si1−xGex in process of nanowire transistors.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 134, doi. 10.1007/s10854-019-02269-x

By:

Li, Junjie;
Wang, Wenwu;
Li, Yongliang;
Zhou, Na;
Wang, Guilei;
Kong, Zhenzhen;
Fu, Jianyu;
Yin, Xiaogen;
Li, Chen;
Wang, Xiaolei;
Yang, Hong;
Ma, Xueli;
Han, Jianghao;
Zhang, Jing;
Wei, Yijun;
Hu, Tairan;
Yang, Tao;
Li, Junfeng;
Yin, Huaxiang;
Zhu, Huilong

Publication type:

Article

Microscale pattern etch of 4H–SiC by inductively coupled plasma.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18788, doi. 10.1007/s10854-019-02232-w

By:

Zhuang, Shiwei;
Tang, Jiale;
Gu, Zhiqiang;
Che, Dongchen;
Hu, Dongdong;
Chen, Lu;
Xu, Kaidong

Publication type:

Article

An 18.9% efficient black silicon solar cell achieved through control of pretreatment of Ag/Cu MACE.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8667, doi. 10.1007/s10854-019-01189-0

By:

Zhang, Pengfei;
Sun, Hengchao;
Tao, Ke;
Jia, Rui;
Su, Guoyu;
Dai, Xiaowan;
Jin, Zhi;
Liu, Xinyu

Publication type:

Article

Thermal decomposition followed by acid etching to synthesize Fe3O4@C for lithium storage.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 91, doi. 10.1007/s10854-018-0267-7

By:

Wei, Denghu;
Jiao, Ranran;
Xu, Leilei;
Cong, Xianling;
Wang, Shuangshuang;
Li, Wenzhi;
Tao, Xuquan;
Gao, Xiang;
Zeng, Suyuan

Publication type:

Article

Enhanced photoelectrochemical performance of black Si electrode by forming a pn junction.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 20734, doi. 10.1007/s10854-018-0214-7

By:

Jia, Chenchen;
Gu, Xiuquan;
Zhao, Yulong;
Wang, Linmeng;
Qiang, Yinghuai

Publication type:

Article

Synthesis and characterization of n-type lightly doped mesoporous silicon nanowires through 1-MACE, influence of etching solution temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6470, doi. 10.1007/s10854-018-8628-9

By:

Ashrafabadi, Somaye;
Eshghi, Hosein

Publication type:

Article

Texturization of ZnO:Al surface by reactive ion etching in SF6/Ar, CHF3/Ar plasma for application in thin film silicon solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6206, doi. 10.1007/s10854-018-8596-0

By:

Das, Gourab;
Bose, Sukanta;
Sharma, Jayasree R.;
Mukhopadhyay, Sumita;
Barua, Asok K.

Publication type:

Article

Structural and optical properties of electrochemically etched p-type GaAs surfaces: influence of HF presence in the etching electrolyte.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 22, p. 16818, doi. 10.1007/s10854-017-7597-8

By:

Naddaf, M.

Publication type:

Article