Works matching DE "ELECTRONICS packaging"
Results: 20
Present and future thermal interface materials for electronic devices.
- Published in:
- International Materials Reviews, 2018, v. 63, n. 1, p. 1, doi. 10.1080/09506608.2017.1296605
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- Article
ROGERS CORPORATION: Advanced Circuit Materials.
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- Microwave Journal, 2008, v. 51, n. 7, p. 202
- Publication type:
- Article
Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests.
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- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1129, doi. 10.1007/s11664-007-0186-5
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- Article
Influence of Pad Shape on Self-Alignment in Electronic Packaging.
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- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 411, doi. 10.1007/BF02690527
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- Publication type:
- Article
Effect of current density on the pulsed co-electrodeposition of nanocrystalline nickel-copper alloys.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 6, p. 88, doi. 10.1007/s11837-010-0095-6
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- Article
Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics Assembly.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 3, p. 108, doi. 10.4071/imaps.460769
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- Article
Eutectic Zn-Al Die Attachment for Higher T<sub>j</sub> SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.
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- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 2, p. 59, doi. 10.4071/imaps.373
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- Article
Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite.
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- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 2, p. 54, doi. 10.4071/imaps.371
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- Article
Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 1, p. 16, doi. 10.4071/1551-4897-7.1.16
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- Article
Reliability behavior of lead-free solder joints in electronic components.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y
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- Article
CRADA--Army Research Laboratory/University of Maryland.
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- Quality & Reliability Engineering International, 1995, v. 11, n. 5, p. 389
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- Article
Handbook of Electronic Package Design (Book).
- Published in:
- 1992
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- Publication type:
- Book Review
Update on the CALCE Center for Electronic Packaging.
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- Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 189
- Publication type:
- Article
SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING.
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- Progress in Electromagnetics Research, 2013, v. 141, p. 201, doi. 10.2528/pier13040214
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- Article
VISCO-ELASTIC AND PLASTIC SINGULAR BEHAVIORS OF AN INTERFACE CORNER IN ELECTRONIC PACKAGES.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2008, v. 22, n. 31/32, p. 6265, doi. 10.1142/S0217979208051893
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- Article
A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles.
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- Fibers, 2019, v. 7, n. 2, p. 12, doi. 10.3390/fib7020012
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- Article
Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders.
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- Journal of Electronic Materials, 2017, v. 46, n. 1, p. 64, doi. 10.1007/s11664-016-4854-1
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- Article
Laser Drop on Demand Micro Joining − Analytic Process Model to Quantify Braze Absorptance and Cumulative Energy Balance.
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- Advanced Engineering Materials, 2018, v. 20, n. 12, p. N.PAG, doi. 10.1002/adem.201800421
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- Article
Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection.
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- Heat Transfer Engineering, 2018, v. 39, n. 4, p. 353, doi. 10.1080/01457632.2017.1305834
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- Article
Optimal Ground Tube Length for Cooling of Electronics Shelters.
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- Heat Transfer Engineering, 2005, v. 26, n. 10, p. 8, doi. 10.1080/01457630500248513
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- Publication type:
- Article