Works matching DE "ELECTRONICS packaging"

Results: 21

Reliability behavior of lead-free solder joints in electronic components.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y

By:

Zhang, Liang;
Han, Ji-guang;
He, Cheng-wen;
Guo, Yong-huan

Publication type:

Article

SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING.

Published in:

Progress in Electromagnetics Research, 2013, v. 141, p. 201, doi. 10.2528/pier13040214

By:

Sung-Mao Wu;
Ren-Fang Hsu;
Po-Hui Yu

Publication type:

Article

Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 3, p. 108, doi. 10.4071/imaps.460769

By:

Iyer, Rajiv L.;
Santos, Daryl L.

Publication type:

Article

Eutectic Zn-Al Die Attachment for Higher T<sub>j</sub> SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.

Published in:

Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 2, p. 59, doi. 10.4071/imaps.373

By:

Satoshi Tanimoto;
Kohei Matsui;
Yusuke Zushi;
Shinji Sato;
Yoshinori MurakamiA;
Masato Takamori;
Takashi Iseki

Publication type:

Article

Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite.

Published in:

Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 2, p. 54, doi. 10.4071/imaps.371

By:

Faqir, M.;
Pomeroy, J. W.;
Batten, T.;
Mrotzek, T.;
Knippscheer, S.;
Vendier, O.;
Rochette, S.;
Massiot, M.;
Letteron, L.;
Desmarres, J. M.;
Courtade, F.;
Kuball, M.

Publication type:

Article

Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications.

Published in:

Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 1, p. 16, doi. 10.4071/1551-4897-7.1.16

By:

Ramesham, Rajeshuni

Publication type:

Article

Present and future thermal interface materials for electronic devices.

Published in:

International Materials Reviews, 2018, v. 63, n. 1, p. 1, doi. 10.1080/09506608.2017.1296605

By:

Razeeb, Kafil M.;
Dalton, Eric;
Cross, Graham Lawerence William;
Robinson, Anthony James

Publication type:

Article

Laser Drop on Demand Micro Joining − Analytic Process Model to Quantify Braze Absorptance and Cumulative Energy Balance.

Published in:

Advanced Engineering Materials, 2018, v. 20, n. 12, p. N.PAG, doi. 10.1002/adem.201800421

By:

Stein, Stefan;
Schaumberger, Kerstin;
Frick, Thomas;
Roth, Stephan;
Schmidt, Michael

Publication type:

Article

A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles.

Published in:

Fibers, 2019, v. 7, n. 2, p. 12, doi. 10.3390/fib7020012

By:

Nashed, Mohamad-Nour;
Hardy, Dorothy Anne;
Hughes-Riley, Theodore;
Dias, Tilak

Publication type:

Article

Optimal Ground Tube Length for Cooling of Electronics Shelters.

Published in:

Heat Transfer Engineering, 2005, v. 26, n. 10, p. 8, doi. 10.1080/01457630500248513

By:

vargas, J.V. C.;
Ordonez, J.C.;
Zamfirescu, C.;
Campos, M.C.;
Bejan, A.

Publication type:

Article

VISCO-ELASTIC AND PLASTIC SINGULAR BEHAVIORS OF AN INTERFACE CORNER IN ELECTRONIC PACKAGES.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2008, v. 22, n. 31/32, p. 6265, doi. 10.1142/S0217979208051893

By:

XU, JIN-QUAN;
ZHENG, HUIMIAO;
ZHU, HONGLAI

Publication type:

Article

ROGERS CORPORATION: Advanced Circuit Materials.

Published in:: Microwave Journal, 2008, v. 51, n. 7, p. 202
Publication type:: Article

Effect of current density on the pulsed co-electrodeposition of nanocrystalline nickel-copper alloys.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 6, p. 88, doi. 10.1007/s11837-010-0095-6

By:

Agarwal, Mansi;
Kumar, Vinod;
Malladi, S. R. K.;
Balasubramaniam, R.;
Balani, Kantesh

Publication type:

Article

PMUTs for Handwriting Recognition.

Published in:

Integrated Ferroelectrics, 2005, v. 69, n. 1, p. 341, doi. 10.1080/10584580590899306

By:

Yi Yang;
Tian-Ling Ren;
Yi-Ping Zhu;
Xiao-Ming Wu;
Ning-Xin Zhang;
Li-Tian Liu

Publication type:

Article

Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection.

Published in:

Heat Transfer Engineering, 2018, v. 39, n. 4, p. 353, doi. 10.1080/01457632.2017.1305834

By:

Baïri, Abderrahmane;
Haddad, Oriana;
Guinart, Jean-Pascal;
Adeyeye, Kemi;
Alilat, Nacim

Publication type:

Article

Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 1, p. 64, doi. 10.1007/s11664-016-4854-1

By:

Falakzaadeh, F.;
Mehryar, R.

Publication type:

Article

Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1129, doi. 10.1007/s11664-007-0186-5

By:

Yanghua Xia;
Chuanyan Lu;
Xiaoming Xie

Publication type:

Article

Influence of Pad Shape on Self-Alignment in Electronic Packaging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 3, p. 411, doi. 10.1007/BF02690527

By:

Ahn, Do H.;
Jihye Lee;
Yoo, Choong D.;
Yong-Seog Kim

Publication type:

Article

CRADA--Army Research Laboratory/University of Maryland.

Published in:: Quality & Reliability Engineering International, 1995, v. 11, n. 5, p. 389
Publication type:: Article

Handbook of Electronic Package Design (Book).

Published in:

1992

By:

O'Connor, P. D. T.

Publication type:

Book Review

Update on the CALCE Center for Electronic Packaging.

Published in:: Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 189
Publication type:: Article