Works matching DE "ELECTRONIC packaging materials"
Results: 5
Fabrication of SiC<sub>p</sub>/Cu-Al electronic packaging material by pressureless infiltration method.
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- Materials Science & Technology, 2013, v. 29, n. 3, p. 326, doi. 10.1179/1743284712Y.0000000152
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- Article
Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2430, doi. 10.1007/s10854-015-4042-8
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- Article
Microstructure and thermal expansion behavior of spray-formed Al-27Si alloy used for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4889, doi. 10.1007/s10854-014-2249-8
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- Article
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
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- Article
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2508, doi. 10.1007/s11664-012-2179-2
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- Article