Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging.
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- Journal of Electronic Materials, 2019, v. 48, n. 2, p. 1286, doi. 10.1007/s11664-018-6771-y
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Works matching DE "ELECTRONIC packaging equipment"
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Simulation of capacity and cost for the planning of future process chains.
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- International Journal of Production Research, 2012, v. 50, n. 21, p. 6122, doi. 10.1080/00207543.2012.661889
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3
Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly.
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- Advanced Materials & Processes, 2011, v. 169, n. 6, p. 32
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- Article