Works matching DE "ELECTRONIC packaging"
Results: 794
Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
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- Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1592, doi. 10.1007/s11664-025-11738-5
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- Article
mRpostman: An IMAP Client for R.
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- Journal of Open Research Software, 2024, v. 12, n. 1, p. 1, doi. 10.5334/jors.480
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- Article
Using Grey Whitening Functions in Control Charts — A Case Study of IC Packaging.
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- Journal of Grey System, 2012, v. 24, n. 1, p. 49
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- Article
Using Grey Control Charts in Surface Mounting Technology.
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- Journal of Grey System, 2010, v. 22, n. 2, p. 167
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- Article
Miniature World.
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- Innovation, 2004, v. 4, n. 3, p. 28
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- Article
Controllable Self‐Assembly of Carbon Nanotubes on Ammonium Polyphosphate as a Game‐Changer for Flame Retardancy and Thermal Conductivity in Epoxy Resin.
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- Macromolecular Rapid Communications, 2024, v. 45, n. 20, p. 1, doi. 10.1002/marc.202400356
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- Article
Material removal characterization during axial ultrasonic vibration grinding SiC<sub>p</sub>/Al composites with a single diamond grain.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 11/12, p. 5267, doi. 10.1007/s00170-024-14457-z
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- Article
In-Mold Electronics on Poly(Lactic Acid): towards a more sustainable mass production of plastronic devices.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 5/6, p. 2643, doi. 10.1007/s00170-023-10878-4
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- Article
Warpage and residual stress analyses of post-mold cure process of IC packages.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 3/4, p. 1017, doi. 10.1007/s00170-022-10436-4
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- Article
Formation mechanism and mechanical performance of ultrasonic-assisted soldered joints of SiC<sub>p</sub>/2024Al composites at low temperature.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 123, n. 5/6, p. 2195, doi. 10.1007/s00170-022-10307-y
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- Article
Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3427, doi. 10.1007/s00170-021-08622-x
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- Article
Parametric study of warpage in PBGA packages.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 107, n. 9/10, p. 4213, doi. 10.1007/s00170-020-05256-3
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- Article
Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 9-12, p. 3235, doi. 10.1007/s00170-018-1819-y
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- Article
Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer.
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- International Journal of Advanced Manufacturing Technology, 2017, v. 92, n. 9-12, p. 4073, doi. 10.1007/s00170-017-0490-z
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- Article
On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays.
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- Transport in Porous Media, 2018, v. 125, n. 2, p. 173, doi. 10.1007/s11242-018-1112-4
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- Article
Effect of SiC Content on Properties of Aluminum Matrix Composite Materials.
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- Bulletin of the Chinese Ceramic Society, 2024, v. 43, n. 6, p. 2256
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- Article
Improved thermal management of power cells with adding cooling path from collector to ground.
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- Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 9, p. 513, doi. 10.1049/el.2019.0364
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- Article
Measurement of thermophysical properties of particulate-filled polymer composites.
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- High Temperatures - High Pressures, 2008, v. 37, n. 1, p. 21
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- Article
Room temperature wafer bonding through conversion of polysilazane into SiO2.
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- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-51800-6
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- Article
Topic modeling in density functional theory on citations of condensed matter electronic structure packages.
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- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-38551-6
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- Article
General Approach of Retailer's Credit Period and Ordering Policy for Non-Instantaneous Deteriorating Items having Ramp-Type Demand Pattern.
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- Journal of Supply Chain Management Systems, 2020, v. 9, n. 2/3, p. 20
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- Article
Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging.
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- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 3/4, p. 197, doi. 10.1515/ijnsns-2012-0063
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- Article
LOGIXPRO Based SCADA Simulations Model for Packaging System in Dry ICE Plant.
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- International Journal of Electrical & Computer Engineering (2088-8708), 2015, v. 5, n. 3, p. 443
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- Article
Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards.
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- Aerospace (MDPI Publishing), 2024, v. 11, n. 7, p. 562, doi. 10.3390/aerospace11070562
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- Article
Effectiveness of Critical-Strain-Based Methodology Considering Elastic Mode Vibration of Mechanical Housing of Electronics.
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- Aerospace (MDPI Publishing), 2023, v. 10, n. 11, p. 974, doi. 10.3390/aerospace10110974
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- Article
Experimental Evaluation of Vibrational Stability of SOPs in Aerospace Industry Using PCB Strain Effectiveness of a PCB-Strain-Based Design Methodology.
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- Aerospace (MDPI Publishing), 2023, v. 10, n. 6, p. 516, doi. 10.3390/aerospace10060516
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- Article
New Version of High-Damping PCB with Multi-Layered Viscous Lamina.
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- Aerospace (MDPI Publishing), 2021, v. 8, n. 8, p. 202, doi. 10.3390/aerospace8080202
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- Article
Synergistic Toughening of Epoxy-Copper Interface Using a Thiol-Based Coupling Layer.
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- Journal of Adhesion Science & Technology, 2011, v. 25, n. 16, p. 2081, doi. 10.1163/016942410X544875
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- Article
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1593, doi. 10.1163/156856108X320519
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- Article
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1631, doi. 10.1163/156856108X325055
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- Article
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1659, doi. 10.1163/156856108X320528
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- Article
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1673, doi. 10.1163/156856108X320537
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- Article
Drop Test Performance of Isotropic Electrically Conductive Adhesives.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1699, doi. 10.1163/156856108X320546
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- Article
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1717, doi. 10.1163/156856108X320555
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- Article
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1733, doi. 10.1163/156856108X320564
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- Article
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 14, p. 1757, doi. 10.1163/156856108X320573
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- Article
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 13, p. 1355, doi. 10.1163/156856108X309512
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- Article
Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 8/9, p. 853, doi. 10.1163/156856108X305444
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- Article
Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film.
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- Journal of Adhesion Science & Technology, 2007, v. 21, n. 11, p. 1071, doi. 10.1163/156856107782105918
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- Article
Investigation of moisture diffusion in electronic packages by molecular dynamics simulation.
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- Journal of Adhesion Science & Technology, 2006, v. 20, n. 16, p. 1937, doi. 10.1163/156856106779116588
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- Article
A multi-scale method to investigate delamination in electronic packages.
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- Journal of Adhesion Science & Technology, 2006, v. 20, n. 10, p. 1061, doi. 10.1163/156856106777890608
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- Article
An energy-based failure criterion for delamination initiation in electronic packaging.
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- Journal of Adhesion Science & Technology, 2005, v. 19, n. 15, p. 1375, doi. 10.1163/156856105774784349
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- Publication type:
- Article
Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive.
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- Journal of Adhesion Science & Technology, 2005, v. 19, n. 8, p. 659, doi. 10.1163/1568561054890471
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- Article
TeraChem: A graphical processing unit‐accelerated electronic structure package for large‐scale ab initio molecular dynamics.
- Published in:
- WIREs: Computational Molecular Science, 2021, v. 11, n. 2, p. 1, doi. 10.1002/wcms.1494
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- Article
Cover Image, Volume 11, Issue 2.
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- WIREs: Computational Molecular Science, 2021, v. 11, n. 2, p. 1, doi. 10.1002/wcms.1523
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- Article
THE FUTURE OF ACTIVE AND INTELLIGENT PACKAGING INDUSTRY.
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- LogForum, 2013, v. 9, n. 2, p. 103
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- Article
Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R.
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- International Journal for Simulation & Multidisciplinary Design Optimization, 2022, v. 13, p. 1, doi. 10.1051/smdo/2021038
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- Article
Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag.
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- International Journal for Simulation & Multidisciplinary Design Optimization, 2019, v. 10, p. 1, doi. 10.1051/smdo/2019013
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- Article
Tracing food packaging contamination: an electronic nose applied to leftover food.
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- Food Additives & Contaminants. Part A: Chemistry, Analysis, Control, Exposure & Risk Assessment, 2019, v. 36, n. 11, p. 1748, doi. 10.1080/19440049.2019.1653498
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- Article
Major Pharmaceutical Conferences and Courses: February 2024 to March 2024.
- Published in:
- 2023
- Publication type:
- Proceeding