Works matching DE "ELECTRONIC packaging"

Results: 835

Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4206, doi. 10.1007/s11837-025-07268-4

By:

Shen, Yu-An;
Chen, Fang-Yu;
Gao, Ruhuna;
Ho, Cheng-En;
Nishikawa, Hiroshi;
Chen, Chih-Ming

Publication type:

Article

A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4226, doi. 10.1007/s11837-025-07201-9

By:

Singh, Amares;
Choo, Hui Leng;
Tan, Wei Hong;
Durairaj, Rajkumar;
Janasekaran, Shamini;
Saravanan, M. S. Senthil

Publication type:

Article

Thermally Conductive Naphthalene Epoxy Resin by Tailoring Flexible Chain Length and Liquid Crystal Structure.

Published in:

Angewandte Chemie, 2025, v. 137, n. 21, p. 1, doi. 10.1002/ange.202501459

By:

Wang, Shuangshuang;
Ruan, Kunpeng;
Guo, Yongqiang;
Kong, Jie;
Gu, Junwei

Publication type:

Article

Soldering and Bonding in Contemporary Electronic Device Packaging.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 2015, doi. 10.3390/ma18092015

By:

Li, Yuxuan;
Pan, Bei;
Ge, Zhenting;
Chen, Pengpeng;
Bi, Bo;
Yi, Xin;
Wu, Chaochao;
Wang, Ce

Publication type:

Article

Electrochemically deposited solder bumps for wafer-level packaging.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 83

By:

Solomon, Gary

Publication type:

Article

Advanced IC packaging: Markets and trends.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 44

By:

Winkler, Sandra

Publication type:

Article

Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.

Published in:

Solid State Technology, 2001, v. 44, n. 2, p. 97

By:

Parrini, Lorenzo

Publication type:

Article

Calcium Borate Flame Retardation System for Epoxy Molding Compounds.

Published in:

Polymer Engineering & Science, 2006, v. 46, n. 6, p. 799, doi. 10.1002/pen.20424

By:

Ishii, Toshiaki;
Kokaku, Hiroyoshi;
Nagai, Akira;
Nishita, Takafumi;
Kakimoto, Masasaki

Publication type:

Article

Transition Diagrams for a Liquid Crystalline Thermoset Containing a Rigid-Rod Epoxy.

Published in:

Polymer Engineering & Science, 2006, v. 46, n. 5, p. 623, doi. 10.1002/pen.20496

By:

Seunghyun Cho;
Douglas, Elliot P.;
Jun Young Lee

Publication type:

Article

Trailer dash [packaging].

Published in:

Electronics Systems & Software, 2006, v. 4, n. 4, p. 12, doi. 10.1049/ess:20060402

By:

Edwards, Chris

Publication type:

Article

Research Progress and Applications of Benzocyclobutene‐Based Functional Polymers.

Published in:

Macromolecular Chemistry & Physics, 2025, v. 226, n. 1, p. 1, doi. 10.1002/macp.202400338

By:

Wang, Qi;
Xie, Meng;
He, Yan;
Xue, Rui;
Guo, Jin;
Fu, Wenxin

Publication type:

Article

Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle Inks.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 43, p. 6834, doi. 10.1002/adfm.201401312

By:

Sadie, Jacob A.;
Subramanian, Vivek

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

A dual-scale elasto-viscoplastic self-consistent model for the cyclic behavior of polycrystalline materials considering combined nonlinear kinematic hardening.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 26050, doi. 10.1007/s10854-022-09294-3

By:

He, Xu;
Liu, Lu;
Yao, Yao

Publication type:

Article

Structure and properties of low-Ag SAC solders for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22668, doi. 10.1007/s10854-022-09091-y

By:

Lu, Xiao;
Zhang, Liang;
Xi, Wang;
Li, Mu-lan

Publication type:

Article

Indium thermal interface material microstructure as a function of thermal history and bonding metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22810, doi. 10.1007/s10854-022-09048-1

By:

McClure, Peter;
Wang, Yujia

Publication type:

Article

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22499, doi. 10.1007/s10854-022-09028-5

By:

Bashir, M. Nasir;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Quazi, M. M.;
Ali, Muhammad Mahmood;
Ahmed, Arslan;
Zaidi, Asad A.;
Soudagar, Manzoore Elahi M.;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Article

The influences of GO-SHS hybrids on the mechanical and dielectric properties of EP composites.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 27, p. 21985, doi. 10.1007/s10854-022-08987-z

By:

Zhang, Hongda;
Zhou, Hong;
Ge, Jing;
Liu, Guolong;
Tu, Xuesong;
Jin, Liguo

Publication type:

Article

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4

By:

Wang, Fengyi;
Wang, Xinjie;
Xu, Kexin;
Wang, Jintao;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Polarizability and optical properties of TeO2–ZnO glass system doped with Nd2O3.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13493, doi. 10.1007/s10854-022-08284-9

By:

Awshah, Abdulbaset A. Abdulla;
Aliyu, Umar Sa'ad;
Kamari, Halimah Mohamed;
Geidam, Ibrahim Gana;
El-Mallawany, R.;
Hamza, Abdulkarim Muhammad;
Azis, Muhammad Noorazlan Abd;
Alazoumi, Salah Hassan

Publication type:

Article

Improved understanding of the enhancement of sintering of mixtures of Cu microparticles and sn nanoparticles for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11467, doi. 10.1007/s10854-022-08119-7

By:

Yang, Guannan;
Lin, Wei;
Lai, Haiqi;
Zhong, Chaobin;
Zhang, Yu;
Cui, Chengqiang

Publication type:

Article

Effects of different inhibitor on antioxidation of copper bonding wire at room temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10561, doi. 10.1007/s10854-022-08042-x

By:

He, Xiaokang;
Guo, Libin;
Gaosen, Gong;
Fengling, Su;
Zhu, Dachuan

Publication type:

Article

Microstructure and properties of Al-Si/Al-SiCp bilayer composite for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7811, doi. 10.1007/s10854-022-07932-4

By:

Zhou, Wei;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong

Publication type:

Article

Precipitation behavior and properties of Al–50Si–0.5X (X = Sc, La, Nb) alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7380, doi. 10.1007/s10854-022-07851-4

By:

Luo, Jing;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong;
Feng, Yan;
Wang, Xiaofeng

Publication type:

Article

Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3535, doi. 10.1007/s10854-021-07545-3

By:

Li, Yulong;
Deng, Xiang;
Lei, Min;
Li, Xuewen;
Ouyang, Hua

Publication type:

Article

Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3016, doi. 10.1007/s10854-021-07501-1

By:

Wu, Zih-You;
Wang, Tzu-Chia;
Wang, Yu-Ching;
Song, Rui-Wen;
Tsai, Su-Yueh;
Duh, Jenq-Gong

Publication type:

Article

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2259, doi. 10.1007/s10854-021-07437-6

By:

Wang, Xi;
Zhang, Liang;
Li, Mu-lan

Publication type:

Article

Recent advances on SnBi low-temperature solder for electronic interconnections.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22731, doi. 10.1007/s10854-021-06820-7

By:

Jiang, Nan;
Zhang, Liang;
Gao, Li-Li;
Song, Xiao-Guo;
He, Peng

Publication type:

Article

Structural, thermal and dielectric properties of low-alkali borosilicate glasses for electronic applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22629, doi. 10.1007/s10854-021-06747-z

By:

Akkasoglu, Ufuk;
Sengul, Sevgi;
Arslan, İkbal;
Ozturk, Bunyamin;
Cicek, Bugra

Publication type:

Article

Dielectric behavior discovered in electrically conductive thick film.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19605, doi. 10.1007/s10854-021-06481-6

By:

Chung, D. D. L.;
Bannon, Jonah T.;
Yang, Wenyi

Publication type:

Article

Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19543, doi. 10.1007/s10854-021-06473-6

By:

Wang, Cong;
Li, Chuanqiang;
Luo, Zhi;
Li, Ming;
Lin, Nai;
Ding, Kaiwen;
Man, Shu;
Duan, Ji'an

Publication type:

Article

Microstructure, properties, and corrosion resistance of as-cast Al-12Si-1.0Mn-0.6 Mg-xSc alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 10, p. 13279, doi. 10.1007/s10854-021-05892-9

By:

Yang, Weiwei;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong;
Guo, Fanghe;
Zhang, Zichen

Publication type:

Article

Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 9, p. 11944, doi. 10.1007/s10854-021-05824-7

By:

Chiang, Ping-Chen;
Shen, Yu-An;
Chen, Chih-Ming

Publication type:

Article

Preparation and sintering characteristics of nanosilver-tin core–shell paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 8, p. 11202, doi. 10.1007/s10854-021-05785-x

By:

Yang, Hui

Publication type:

Article

Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 2655, doi. 10.1007/s10854-020-04755-z

By:

Xu, Kai-kai;
Zhang, Liang;
Jiang, Nan

Publication type:

Article

Synergistic size and shape effect of dendritic silver nanostructures for low-temperature sintering of paste as die attach materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 323, doi. 10.1007/s10854-020-04783-9

By:

Fan, Jilei;
Li, Gang;
Rajavel, Krishnamoorthy;
Zhu, Pengli;
Sun, Rong;
Wong, Ching-Ping

Publication type:

Article

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22926, doi. 10.1007/s10854-020-04819-0

By:

Joo, Hong-Sub;
Lee, Choong-Jae;
Min, Kyung Deuk;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 23, p. 21335, doi. 10.1007/s10854-020-04646-3

By:

Dong, Chong;
Ma, Haoran;
Hussain, MuhammadMuzammal;
Sun, Liying;
Chen, Jun;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

SCF-NiFe2O4/epoxy composites with high thermal conductivity and electromagnetic interference resistance.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 23, p. 21325, doi. 10.1007/s10854-020-04644-5

By:

Liu, Houbao;
Fu, Renli;
Su, Xinqing;
Wang, He;
Wu, Binyong;
He, Qinjiang

Publication type:

Article

Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 19366, doi. 10.1007/s10854-020-04470-9

By:

Peng, Jian;
Fu, Liming;
Sun, Yanle;
Li, Ziyong;
Ji, Xinbo;
Shan, Aidang

Publication type:

Article

Optimization of process parameters of anodic aluminium oxide using an orthogonal array technique for thermal management applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 18706, doi. 10.1007/s10854-020-04412-5

By:

Sundararajan, Muralidharan;
Subramani, Shanmugan;
Devarajan, Mutharasu;
Jaafar, Mariatti

Publication type:

Article

Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8456, doi. 10.1007/s10854-020-03380-0

By:

Peng, Yang;
Mou, Yun;
Liu, Jiaxin;
Chen, Mingxiang

Publication type:

Article

Recent trends in Advanced Functional Semiconducting Materials (selected papers from the IMRC2019, Cancun, Mexico, 18–23 August 2019, Symposium on Advances in Functional Semiconducting Materials).

Published in:

2020

By:

Velumani, Subramaniam

Publication type:

Editorial

Mechanism and control of preferred Cu6Sn5 growth on single crystal (001)Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5966, doi. 10.1007/s10854-020-03150-y

By:

Ma, H. R.;
Dong, C.;
Chen, J.;
Wang, Y. P.;
Li, X. G.;
Ma, H. T.

Publication type:

Article

Effects of Cu and Mg alloying on the microstructure and properties of Al–12Si alloy prepared by spray forming.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5416, doi. 10.1007/s10854-020-03103-5

By:

Guo, Fanghe;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong;
Liu, Yuxuan;
Feng, Yan;
Wang, Xiaofeng

Publication type:

Article

Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu–15μm Sn–Cu sandwich structure.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 2862, doi. 10.1007/s10854-019-02831-7

By:

Yao, Peng;
Li, Xiaoyan

Publication type:

Article

Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm).

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2466, doi. 10.1007/s10854-019-02784-x

By:

Zhang, Liang;
Liu, Zhi-quan

Publication type:

Article

Preparation of AlSb thin films using aluminum–antimony alloying target by magnetron sputtering and its deliquescence prevention approach.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 1846, doi. 10.1007/s10854-019-02703-0

By:

Li, Minqiang;
Li, Bing;
Zeng, Guanggen;
Song, Huijin;
Yang, Ke;
Xiao, Rui

Publication type:

Article

Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 23, p. 20770, doi. 10.1007/s10854-019-02444-0

By:

Yu, Shuaishuai;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong;
Wu, Xiang;
Feng, Yan;
Wang, Xiaofeng

Publication type:

Article

Recent advances in nano-materials for packaging of electronic devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13855, doi. 10.1007/s10854-019-01790-3

By:

Zhang, Shuye;
Xu, Xiangyu;
Lin, Tiesong;
He, Peng

Publication type:

Article