Works matching DE "ELECTRONIC packaging"
Results: 802
Aerosolized liquid phase reaction method: an approach for the continuous preparation of highly dispersed copper nanoparticles.
- Published in:
- Journal of Nanoparticle Research, 2025, v. 27, n. 2, p. 1, doi. 10.1007/s11051-025-06221-5
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- Publication type:
- Article
Research progress on copper-carbon/carbon composites.
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- Composite Interfaces, 2025, v. 32, n. 3, p. 321, doi. 10.1080/09276440.2024.2417160
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- Publication type:
- Article
Poly(ether-ketone)/silica nanocomposites: Storage modulus and hardness.
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- High Performance Polymers, 2025, v. 37, n. 2, p. 78, doi. 10.1177/09540083241308192
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- Publication type:
- Article
A Review on the Additive Manufacturing of W-Cu Composites.
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- Metals (2075-4701), 2025, v. 15, n. 2, p. 197, doi. 10.3390/met15020197
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- Publication type:
- Article
Coatings for Advanced Devices.
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- Coatings (2079-6412), 2025, v. 15, n. 2, p. 219, doi. 10.3390/coatings15020219
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- Publication type:
- Article
Toughened Bamboo-Fiber-Modified Epoxy Resin: A Novel Polymer Coating for Superior Interfacial Compatibility.
- Published in:
- Coatings (2079-6412), 2025, v. 15, n. 2, p. 181, doi. 10.3390/coatings15020181
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- Publication type:
- Article
Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 858, doi. 10.3390/ma18040858
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- Publication type:
- Article
Electrochemically deposited solder bumps for wafer-level packaging.
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- Solid State Technology, 2001, v. 44, n. 4, p. 83
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- Publication type:
- Article
Advanced IC packaging: Markets and trends.
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- Solid State Technology, 2001, v. 44, n. 4, p. 44
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- Publication type:
- Article
Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 97
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- Publication type:
- Article
Miniature World.
- Published in:
- Innovation, 2004, v. 4, n. 3, p. 28
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- Publication type:
- Article
autodE: Automated Calculation of Reaction Energy Profiles— Application to Organic and Organometallic Reactions.
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- Angewandte Chemie, 2021, v. 133, n. 8, p. 4312, doi. 10.1002/ange.202011941
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- Publication type:
- Article
Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle Inks.
- Published in:
- Advanced Functional Materials, 2014, v. 24, n. 43, p. 6834, doi. 10.1002/adfm.201401312
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- Publication type:
- Article
Inclusion interaction and effective material properties in a particle-filled composite material system.
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- Journal of Materials Science, 2011, v. 46, n. 1, p. 101, doi. 10.1007/s10853-010-4844-2
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- Publication type:
- Article
An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis.
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- Journal of Materials Science, 2011, v. 46, n. 1, p. 263, doi. 10.1007/s10853-010-4976-4
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- Publication type:
- Article
A review of mechanical properties of lead-free solders for electronic packaging.
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- Journal of Materials Science, 2009, v. 44, n. 5, p. 1141, doi. 10.1007/s10853-008-3125-9
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- Publication type:
- Article
Three-dimensional (3D) modeling of the thermoelastic behavior of woven glass fiber-reinforced resin matrix composites.
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- Journal of Materials Science, 2008, v. 43, n. 19, p. 6468, doi. 10.1007/s10853-008-2982-6
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- Publication type:
- Article
Standardization of a shear test method for lead-free solder paste chip joints.
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- Journal of Materials Science, 2007, v. 42, n. 17, p. 7451, doi. 10.1007/s10853-007-1627-5
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- Publication type:
- Article
Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization.
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- Journal of Materials Science, 2007, v. 42, n. 13, p. 5239, doi. 10.1007/s10853-006-1234-x
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- Publication type:
- Article
Reaction kinetics and mechanical properties in the reactive brazing of copper to aluminum nitride.
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- Journal of Materials Science, 2006, v. 41, n. 21, p. 7197, doi. 10.1007/s10853-006-0920-z
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- Publication type:
- Article
新型低温无铅焊料的研究进展.
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- Precious Metals / Guijinshu, 2022, v. 43, p. 42
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- Publication type:
- Article
Review of microstructure and properties of low temperature lead-free solder in electronic packaging.
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- Science & Technology of Advanced Materials, 2020, v. 21, n. 1, p. 689, doi. 10.1080/14686996.2020.1824255
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- Publication type:
- Article
Thermally enhanced polyolefin composites: fundamentals, progress, challenges, and prospects.
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- Science & Technology of Advanced Materials, 2020, v. 21, n. 1, p. 737, doi. 10.1080/14686996.2020.1820306
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- Publication type:
- Article
Reliability issues of lead-free solder joints in electronic devices.
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- Science & Technology of Advanced Materials, 2019, v. 20, n. 1, p. 876, doi. 10.1080/14686996.2019.1640072
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- Publication type:
- Article
Structure and properties of Sn-Cu lead-free solders in electronics packaging.
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- Science & Technology of Advanced Materials, 2019, v. 20, n. 1, p. 421, doi. 10.1080/14686996.2019.1591168
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- Publication type:
- Article
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions.
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- Science & Technology of Advanced Materials, 2015, v. 16, n. 3, p. 1, doi. 10.1088/1468-6996/16/3/033505
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- Publication type:
- Article
Capacitive sensor supporting multiple touch switches using a resistor string.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2015, v. 23, n. 5, p. 1326, doi. 10.3906/elk-1304-149
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- Publication type:
- Article
2D Boron Nitride Nanosheets for Smart Thermal Management and Advanced Dielectrics.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 25, p. 1, doi. 10.1002/admi.202200610
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- Publication type:
- Article
Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite.
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- Advanced Materials Interfaces, 2021, v. 8, n. 1, p. 1, doi. 10.1002/admi.202001423
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- Publication type:
- Article
Materials Technology for Environmentally Green Micro-electronic Packaging.
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- Intel Technology Journal, 2008, v. 12, n. 1, p. 1, doi. 10.1535/itj.1201.01
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- Publication type:
- Article
Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages.
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- Journal of Engineering & Technological Sciences, 2016, v. 48, n. 6, p. 700, doi. 10.5614/j.eng.technol.sci.2016.48.6.5
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- Publication type:
- Article
The Research of the Possibilities and Application of the AutoCAD Software Package for Creating Electronic Versions of Textbooks for “Engineering and Computer Graphics” Course.
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- TEM Journal, 2020, v. 9, n. 3, p. 1141, doi. 10.18421/TEM93-40
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- Publication type:
- Article
Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.
- Published in:
- Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935
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- Publication type:
- Article
Low dielectric resins derived from hyperbranched carbosilane oligmers functionalized by benzocyclobutene groups.
- Published in:
- Designed Monomers & Polymers, 2021, v. 24, n. 1, p. 362, doi. 10.1080/15685551.2021.2003556
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- Publication type:
- Article
Laser Drop on Demand Micro Joining for High Temperature Wire Bonding Applications – System Technology And Mechanical Joint Performance.
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- Journal of Laser Micro / Nanoengineering, 2017, v. 12, n. 3, p. 239, doi. 10.2961/jlmn.2017.03.0012
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- Publication type:
- Article
ABSTRACTS.
- Published in:
- 2012
- Publication type:
- Abstract
Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry.
- Published in:
- Sustainability (2071-1050), 2022, v. 14, n. 23, p. 15730, doi. 10.3390/su142315730
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- Publication type:
- Article
THERMAL ANALYSIS OF PROPOSED HEAT SINK DESIGN UNDER NATURAL CONVECTION FOR THE THERMAL MANAGEMENT OF ELECTRONICS.
- Published in:
- Thermal Science, 2022, v. 26, n. 2B, p. 1487, doi. 10.2298/TSCI210402307H
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- Publication type:
- Article
TRAINING CALENDAR.
- Published in:
- 2024
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- Publication type:
- Calendar
THE ELECTRONICS RESURGENCE INITIATIVE 2.0 FOR U.S. SEMICONDUCTOR MANUFACTURING.
- Published in:
- Electronic Device Failure Analysis, 2024, v. 26, n. 1, p. 2, doi. 10.31399/asm.edfa.2024-1.p002
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- Publication type:
- Article
BACKSIDE ILLUMINATED TDI CAMERA.
- Published in:
- 2023
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- Publication type:
- Product Review
TRAINING CALENDAR.
- Published in:
- Electronic Device Failure Analysis, 2021, v. 23, n. 3, p. 44
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- Publication type:
- Article
SECURITY ASSESSMENT OF IC PACKAGING AGAINST OPTICAL ATTACKS.
- Published in:
- Electronic Device Failure Analysis, 2021, v. 23, n. 2, p. 4, doi. 10.31399/asm.edfa.2021-2.p004
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- Publication type:
- Article
ISTFA 2014 SAMPLE PREP/3-D PACKAGE USER'S GROUP.
- Published in:
- 2015
- Publication type:
- Proceeding
3-D ICs with TSVs: The Hard Work Continues.
- Published in:
- 2013
- By:
- Publication type:
- Proceeding
Training Calendar.
- Published in:
- Electronic Device Failure Analysis, 2013, v. 15, n. 3, p. 40
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- Publication type:
- Article
Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere‐reinforced epoxy composite for electronic packaging application.
- Published in:
- Polymer Composites, 2019, v. 40, n. 7, p. 2573, doi. 10.1002/pc.25050
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- Publication type:
- Article
Graphite tube woven fabric/boron nitride/polymer composite with enhanced thermal conductivity and electric isolation.
- Published in:
- Polymer Composites, 2019, v. 40, p. E1808, doi. 10.1002/pc.25168
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- Publication type:
- Article
Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review.
- Published in:
- Polymer Composites, 2017, v. 38, n. 4, p. 803, doi. 10.1002/pc.23641
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- Publication type:
- Article
Microwave and Millimeter- Wave Electronic Packaging.
- Published in:
- 2014
- Publication type:
- Book Review