Modeling CMP for copper dual damascene interconnects.
- Published in:
- Solid State Technology, 2000, v. 43, n. 6, p. 111
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- Publication type:
- Article
Works matching DE "ELECTROMETALLURGY of copper"
Results: 15
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Synthesis and characterization of copper telluride nanowires via template-assisted dc electrodeposition route.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 8, p. 995, doi. 10.1007/s10854-010-0249-x
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- Publication type:
- Article
3
Survey of plateau behaviour in the cyclic stress-strain curve of copper single crystals.
- Published in:
- Philosophical Magazine Letters, 1999, v. 79, n. 9, p. 715, doi. 10.1080/095008399176760
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- Publication type:
- Article
4
Influence of Particle Velocity of Copper on Emitter Contact by Cold-Spray Method.
- Published in:
- Journal of Thermal Spray Technology, 2016, v. 25, n. 3, p. 465, doi. 10.1007/s11666-015-0349-5
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- Publication type:
- Article
5
Spectroscopic diagnostics for an electrical discharge plasma in a liquid.
- Published in:
- Journal of Applied Spectroscopy, 2009, v. 76, n. 6, p. 856, doi. 10.1007/s10812-010-9274-z
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- Publication type:
- Article
6
Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates.
- Published in:
- Journal of Materials Science, 1999, v. 34, n. 2, p. 277, doi. 10.1023/A:1004497304095
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- Publication type:
- Article
7
IMPORTANCE OF EXTERNAL ELECTRIC FIELD IN DEVELOPMENT OF ELECTROCATALYSIS PROMOTION INTERNAL MICRO-ELECTROLYSIS FOR COPPER(II) REMOVAL.
- Published in:
- Oxidation Communications, 2016, v. 39, n. 1-I, p. 291
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- Publication type:
- Article
8
The effect of thiourea, l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition.
- Published in:
- Journal of Applied Electrochemistry, 2013, v. 43, n. 12, p. 1185, doi. 10.1007/s10800-013-0596-4
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- Publication type:
- Article
9
The influence of citrate and tartrate on the electrodeposition and surface morphology of Cu-Ni layers.
- Published in:
- Journal of Applied Electrochemistry, 2011, v. 41, n. 4, p. 415, doi. 10.1007/s10800-010-0251-2
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- Publication type:
- Article
10
Application of MPE Model to Iron Ore Sintering, Ironmaking and Steelmaking Processes.
- Published in:
- Steel Research International, 2015, v. 86, n. 6, p. 612, doi. 10.1002/srin.201400359
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- Publication type:
- Article
11
Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface.
- Published in:
- Materials (1996-1944), 2014, v. 7, n. 11, p. 7366, doi. 10.3390/ma7117366
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- Publication type:
- Article
12
Electrowinning of Copper in a Lab-Scale Squirrel-Cage Cell with Anion Membrane.
- Published in:
- AIChE Journal, 2005, v. 51, n. 8, p. 2273, doi. 10.1002/aic.10476
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- Publication type:
- Article
13
Lead-Free Bumping Using an Alternating Electromagnetic Field.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 663, doi. 10.1007/s11664-009-0722-6
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- Publication type:
- Article
14
The Construction of a New Integrative Vector with a New Selective Marker of Copper Resistance for Glycerol Producer Candida glycerinogenes.
- Published in:
- Current Microbiology, 2012, v. 64, n. 4, p. 357, doi. 10.1007/s00284-011-0075-2
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- Publication type:
- Article
15
Validation of electrolyte conductivity models in industrial copper electrorefining.
- Published in:
- Minerals & Metallurgical Processing, 2018, v. 35, n. 3, p. 117, doi. 10.19150/mmp.8460
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- Publication type:
- Article