Works about ELECTROLESS deposition
1
- Microchimica Acta, 2025, v. 192, n. 5, p. 1, doi. 10.1007/s00604-025-07064-6
- Li, Rui;
- Que, Wenzhong;
- Han, Haiyan;
- Shi, Honghui;
- Wang, Rongfeng;
- Qiu, Bin
- Article
2
- Surface Engineering, 2023, v. 39, n. 5, p. 613, doi. 10.1080/02670844.2023.2239027
- Razzaboni, L.;
- Casanova, L.;
- Pedeferri, M.;
- Ormellese, M.
- Article
3
- Surface Engineering, 2022, v. 38, n. 7-9, p. 725, doi. 10.1080/02670844.2022.2162564
- Yazdani, Sepehr;
- Chapon, Patrick;
- Dupont, Vedi;
- Vitry, Veronique
- Article
4
- Surface Engineering, 2022, v. 38, n. 6, p. 576, doi. 10.1080/02670844.2022.2142002
- Pawar, Karan;
- Dixit, Pradeep
- Article
5
- Surface Engineering, 2020, v. 36, n. 9, p. 936, doi. 10.1080/02670844.2019.1662225
- Lone, Shafaq Ashraf;
- Rahman, Atikur
- Article
6
- Surface Engineering, 2020, v. 36, n. 9, p. 929, doi. 10.1080/02670844.2019.1653010
- Gorji, M. R.;
- Sanjabi, S.;
- Edtmaier, C.
- Article
7
- Surface Engineering, 2019, v. 35, n. 10, p. 883, doi. 10.1080/02670844.2018.1539295
- Hadipour, Ali;
- Rahsepar, Mansour;
- Hayatdavoudi, Hadis
- Article
8
- Surface Engineering, 2017, v. 33, n. 5, p. 353, doi. 10.1080/02670844.2016.1248119
- Ru, J.;
- Jia, Y.;
- Jiang, Y.;
- Feng, J.;
- Zhou, R.;
- Hua, Y.;
- Wang, D.
- Article
9
- Surface Engineering, 2017, v. 33, n. 5, p. 348, doi. 10.1080/02670844.2016.1235007
- Yuan, Z.;
- Liang, S.;
- Zhuo, L.
- Article
10
- Surface Engineering, 2016, v. 32, n. 5, p. 391, doi. 10.1179/1743294415Y.0000000035
- Noori, H.;
- Mousavian, R. Taherzadeh;
- Khosroshahi, R. Azari;
- Brabazon, D.;
- Damadi, S. R.
- Article
11
- Surface Engineering, 2016, v. 32, n. 5, p. 385, doi. 10.1179/1743294415Y.0000000093
- Wang, Z. H.;
- Zhang, L. L.;
- Ni, H.;
- Wang, S. J.
- Article
12
- Surface Engineering, 2016, v. 32, n. 5, p. 372, doi. 10.1179/1743294415Y.0000000079
- Rahman, A.;
- Jayaganthan, R.
- Article
13
- Surface Engineering, 2015, v. 31, n. 6, p. 399, doi. 10.1179/1743294414Y.0000000430
- Hadipour, A.;
- M. Monirvaghefi, S.;
- Bahrololoom, M. E.
- Article
14
- Surface Engineering, 2015, v. 31, n. 6, p. 412, doi. 10.1179/1743294414Y.0000000422
- Liu, H.;
- Yao, H. L.;
- Thompson, G. E.;
- Liu, Z.;
- Harrison, G.
- Article
15
- Surface Engineering, 2015, v. 31, n. 3, p. 226, doi. 10.1179/1743294414Y.0000000373
- Wang, H.;
- Xie, M.;
- Zong, Q.;
- Liu, Z.;
- Huang, X.;
- Jin, Y.
- Article
16
- Surface Engineering, 2014, v. 30, n. 10, p. 709, doi. 10.1179/1743294414Y.0000000316
- Rahman, A.;
- Jayaganthan, R.;
- Sharma, J. V. N.
- Article
17
- Surface Engineering, 2014, v. 30, n. 10, p. 747, doi. 10.1179/1743294414Y.0000000335
- Beigi Khosroshahi, N.;
- Azari Khosroshahi, R.;
- Taherzadeh Mousavian, R.;
- Brabazon, D.
- Article
18
- Surface Engineering, 2013, v. 29, n. 10, p. 767, doi. 10.1179/1743294413Y.0000000196
- Yu, Y. D.;
- Li, M. G.;
- Wei, G. Y.;
- Ge, H. L.
- Article
19
- Surface Engineering, 2013, v. 29, n. 4, p. 306, doi. 10.1179/1743294412Y.0000000085
- Alirezaei, S;
- Monirvaghefi, S M;
- Saatchi, A;
- Ürgen, M;
- Motallebzadeh, A
- Article
20
- Chemistry - A European Journal, 2023, v. 29, n. 13, p. 1, doi. 10.1002/chem.202203207
- Li, Huatong;
- Liu, Zhengqi;
- Wang, Lixia;
- Guo, Man;
- Isimjan, Tayirjan Taylor;
- Yang, Xiulin
- Article
21
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22862, doi. 10.1007/s10854-022-09056-1
- Vinotha, K.;
- Jayasutha, B.;
- Abel, M. John;
- Vinoth, K.
- Article
22
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 27, p. 21811, doi. 10.1007/s10854-022-08968-2
- Saka, Kubra;
- Gokcen, Dincer
- Article
23
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13012, doi. 10.1007/s10854-022-08243-4
- Liu, Hui-gen;
- Feng, Zhe-sheng;
- Wang, Kang;
- Lian, Ji-qing;
- Chen, Yuan-ming;
- Yang, Meng-yao;
- Wang, Yan
- Article
24
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7598, doi. 10.1007/s10854-022-07907-5
- Dail, Steven P.;
- Molina, Alex;
- Campbell, Ian E.;
- Mughal, Asad J.;
- Mohney, Suzanne E.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 22, p. 26412, doi. 10.1007/s10854-021-07020-z
- Zhang, Zhifei;
- Bai, Yang;
- He, Yi;
- Li, Hongjie;
- Fan, Yi;
- He, Teng
- Article
26
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21643, doi. 10.1007/s10854-021-06678-9
- Li, Ao;
- Peng, Zhijian;
- Fu, Xiuli
- Article
27
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17764, doi. 10.1007/s10854-021-06313-7
- Rezaga, Bethel Faith Y.;
- Balela, Mary Donnabelle L.
- Article
28
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16352, doi. 10.1007/s10854-020-04185-x
- Article
29
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8910, doi. 10.1007/s10854-020-03426-3
- Zhai, Jianyu;
- Cui, Ce;
- Ren, Erhui;
- Zhou, Mi;
- Guo, Ronghui;
- Xiao, Hongyan;
- Li, Ang;
- Jiang, Shouxiang;
- Qin, Wenfeng
- Article
30
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8165, doi. 10.1007/s10854-020-03289-8
- Wang, Yuefeng;
- Hong, Yan;
- Zhou, Guoyun;
- Wang, Xinhai;
- Song, Jianheng;
- He, Wei;
- Gao, Zhengping;
- Zhang, Weihua;
- Sun, Rui;
- Sun, Yukai;
- Ai, Kehua;
- Li, Qinghua
- Article
31
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12044, doi. 10.1007/s10854-019-01562-z
- Sun, Guangming;
- Wang, Zhaoqi;
- Huang, Jintian
- Article
32
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19578, doi. 10.1007/s10854-018-0089-7
- Liu, Chuanmei;
- Xu, Jiangtao;
- Liu, Zhengqin;
- Ning, Xin;
- Jiang, Shouxiang;
- Miao, Dagang
- Article
33
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6937, doi. 10.1007/s10854-018-8680-5
- Pun, Kelvin P. L.;
- Ali, Lafir;
- Kohtoku, Makoto;
- Cheung, Chee-Wah;
- Chan, Alan H. S.;
- Wong, C. P.
- Article
34
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 22, p. 16618, doi. 10.1007/s10854-017-7572-4
- Guo, Ronghui;
- Jing, Xiaoli;
- Peng, Linghui;
- Lan, Jianwu;
- Jiang, Shouxiang;
- Yan, Wanqi
- Article
35
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 11358, doi. 10.1007/s10854-017-6929-z
- Di, Lizhi;
- Zhai, Tong;
- Duan, Guojie;
- Zhang, Fang;
- Yang, De'an
- Article
36
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9766, doi. 10.1007/s10854-015-3647-2
- Wang, Fengwei;
- Cui, Chengqiang;
- Wang, Jing
- Article
37
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3530, doi. 10.1007/s10854-015-2865-y
- Zhou, Ruihua;
- Chen, Huiyu;
- Xu, Chunju;
- Hou, Xin;
- Liu, Guilin;
- Liu, Yaqing
- Article
38
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 957, doi. 10.1007/s10854-013-1670-8
- Kumar, Sunil;
- Kang, T.;
- Khan, P.;
- Kumar, Sanjeev;
- Goyal, Manju;
- Choubey, Ravi
- Article
39
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 4938, doi. 10.1007/s10854-013-1501-y
- Article
40
- International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 9/10, p. 4611, doi. 10.1007/s00170-024-13199-2
- Omoegun, Olumide;
- Fayomi, Ojo;
- Ayoola, Ayodeji;
- Agboola, Oluranti
- Article
41
- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 9/10, p. 5839, doi. 10.1007/s00170-021-08240-7
- Chen, Zhibin;
- Qiu, Mingbo;
- Zhao, Jinchao;
- Qin, Yan;
- Guo, Chuangchaung;
- Wan, Rong
- Article
42
- International Journal of Advanced Manufacturing Technology, 2019, v. 103, n. 5-8, p. 1959, doi. 10.1007/s00170-019-03684-4
- Taha-Tijerina, Jaime;
- Aviña-Camarena, Karla;
- Torres-Sánchez, Roal;
- Dominguez-Ríos, Carlos;
- Maldonado-Cortes, Demófilo
- Article
43
- International Journal of Advanced Manufacturing Technology, 2018, v. 94, n. 1-4, p. 1327, doi. 10.1007/s00170-017-0940-7
- Liu, Yang;
- Zhao, Wenxiang;
- Zhou, Tianfeng;
- Liu, Xin;
- Wang, Xibin
- Article
44
- Strength of Materials, 2019, v. 51, n. 2, p. 280, doi. 10.1007/s11223-019-00074-9
- Huang, R. X.;
- Ma, Z.;
- Dong, W. Z.;
- Shen, Y.;
- Du, F. M.;
- Xu, J.;
- Jin, M.
- Article
45
- Regenerative Biomaterials, 2022, v. 9, p. 1, doi. 10.1093/rb/rbac013
- Liang, Xinjin;
- Zhang, Shuai;
- Gadd, Geoffrey Michael;
- McGrath, John;
- Rooney, David W;
- Zhao, Qi
- Article
46
- Electroplating & Finishing, 2023, v. 42, n. 19, p. 1, doi. 10.19289/j.1004-227x.2023.19.001
- Article
47
- Electroplating & Finishing, 2023, v. 42, n. 7, p. 16, doi. 10.19289/j.1004-227x.2023.07.003
- CHEN Haixin;
- LIU Ninghua;
- DENG Zhengping;
- TIAN Zhibin
- Article
48
- Electroplating & Finishing, 2023, v. 42, n. 5, p. 1, doi. 10.19289/j.1004-227x.2023.05.001
- Article
49
- Electroplating & Finishing, 2023, v. 42, n. 3, p. 7, doi. 10.19289/j.1004-227x.2023.03.002
- Article
50
- Electroplating & Finishing, 2022, v. 41, n. 21, p. 1510, doi. 10.19289/j.1004-227x.2022.21.004
- 程熠;
- 宋晅;
- 朱皓;
- 赵文霞;
- 回凯宏;
- 李鑫巍;
- 刘欣;
- 陈怀军
- Article