Works matching DE "ELECTRODIFFUSION"
Results: 659
Chromatographic and electromigration analysis of rhenium compounds used in radiopharmacy.
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- Journal of Radioanalytical & Nuclear Chemistry, 2003, v. 258, n. 3, p. 627
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- Article
Electromigration of Copper in Lithographically-Defined Aluminum Nanowires.
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- Microscopy & Microanalysis, 2019, p. 2190, doi. 10.1017/S1431927618011431
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- Article
An Electrodiffusion Model Coupled with Fluid-Flow Effects for an On-Chip Electromembrane Extraction System.
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- Transport in Porous Media, 2022, v. 142, n. 1/2, p. 317, doi. 10.1007/s11242-021-01643-w
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- Article
Advection-Dispersive Mechanisms of Electrolyte Species in Porous Matrix.
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- Transport in Porous Media, 2014, v. 104, n. 2, p. 299, doi. 10.1007/s11242-014-0335-2
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- Article
Ultrafast colour displays.
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- Nature, 2001, v. 409, n. 6820, p. 575, doi. 10.1038/35054655
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- Article
Visualization of hydrogen migration in solids using switchable mirrors.
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- Nature, 1998, v. 394, n. 6694, p. 656, doi. 10.1038/29250
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- Article
Electrodiffusion of Radionuclides in Lava-Like Fuel-Containing Materials.
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- Materials Science, 2005, v. 41, n. 1, p. 47, doi. 10.1007/s11003-005-0130-x
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- Article
Pulsating motion of a liquid in capillaries under the influence of a force field.
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- Journal of Engineering Physics & Thermophysics, 2006, v. 79, n. 5, p. 857, doi. 10.1007/s10891-006-0176-0
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- Article
Destructive analysis of the nuclide composition of spent fuel of WWER-440, WWER-1000, and RBMK-1000 reactors.
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- Radiochemistry, 2008, v. 50, n. 4, p. 414, doi. 10.1134/S1066362208040152
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- Article
Математическое моделирование процесса переноса ионов через ионообменную мембрану
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- National Academy of Sciences of Armenia Reports / Doklady Nacionalnaâ Akademiâ Nauk Armenii, 2020, v. 120, n. 1, p. 52
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- Article
Drift of adatoms on the (111) silicon surface under electromigration conditions.
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- JETP Letters, 2011, v. 94, n. 2, p. 147, doi. 10.1134/S0021364011140128
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- Article
CORRELATION BETWEEN CRYSTAL ORIENTATION AND NANO-GAP FORMED BY ELECTRO MIGRATION.
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- Iranian Journal of Materials Science & Engineering, 2015, v. 12, n. 3, p. 1
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- Article
Exocytotic catecholamine release is not associated with cation flux through channels in the vesicle membrane but Na<sup>+</sup> influx through the fusion pore.
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- Nature Cell Biology, 2007, v. 9, n. 8, p. 915, doi. 10.1038/ncb1617
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- Article
高温高电流密度下 BGA 焊点电迁移损伤.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 11, p. 1264, doi. 10.11936/bjutxb2021040010
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- Publication type:
- Article
Montagem de uma célula universal para ensaios de permeação em membranas semipermeáveis sólidas em escala laboratorial.
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- Orbital: The Electronic Journal of Chemistry, 2011, v. 3, n. 4, p. 204
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- Article
Application of Phosphate and EDTA on As(V) Removal in Gold Mine Tailings by Electrokinetic Remediation.
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- EnvironmentAsia, 2020, v. 13, n. 3, p. 1, doi. 10.14456/ea.2020.37
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- Article
Influence of Externally Imposed and Internally Generated Electrical Fields on Grain Growth, Diffusional Creep, Sintering and Related Phenomena in Ceramics.
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- Journal of the American Ceramic Society, 2011, v. 94, n. 7, p. 1941, doi. 10.1111/j.1551-2916.2011.04652.x
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- Article
Refined Model of Electromigration of Ag/Pd Electrodes in Multilayer PZT Ceramics Under Extreme Humidity.
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- Journal of the American Ceramic Society, 2009, v. 92, n. 2, p. 405, doi. 10.1111/j.1551-2916.2008.02891.x
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- Article
Tomorrow's chip interconnects call for a new reliability test method.
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- EE: Evaluation Engineering, 2015, v. 54, n. 8, p. 20
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- Article
Identification of Microorganisms by Modern Analytical Techniques.
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- Journal of AOAC International, 2017, v. 100, n. 6, p. 1607, doi. 10.5740/jaoacint.17-0207
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- Article
Residual Stress Relaxation Induced by Mass Transport Through Interface of the Pd/SrTiO<sub>3</sub>.
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- Nanoscale Research Letters, 2010, v. 5, n. 4, p. 709, doi. 10.1007/s11671-010-9535-z
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- Article
New approach to the characterization of ion-exchange membranes using a set of model parameters.
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- Petroleum Chemistry, 2014, v. 54, n. 7, p. 515, doi. 10.1134/S0965544114070032
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- Article
Electrodialysis of solutions of tartaric acid and its salts.
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- Petroleum Chemistry, 2012, v. 52, n. 8, p. 609, doi. 10.1134/S0965544112080075
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- Publication type:
- Article
Resistive Switching in Memristors Based on Ge/Si(001) Epitaxial Layers.
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- Semiconductors, 2020, v. 54, n. 14, p. 1833, doi. 10.1134/S1063782620140109
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- Article
Electromigration Effect on Vacancy Islands Nucleation on Si(100) Surface during Sublimation.
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- Semiconductors, 2019, v. 53, n. 6, p. 795, doi. 10.1134/S106378261906023X
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- Article
Improved Performance of White Phosphorescent Organic Light-Emitting Diodes through a Mixed-Host Structure.
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- ETRI Journal, 2009, v. 31, n. 6, p. 642, doi. 10.4218/etrij.09.1209.0005
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- Article
Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10124-3
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- Publication type:
- Article
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z
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- Publication type:
- Article
Formation mechanism and reliability of preferred growth full Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compound interconnect on (011) Cu single-crystal substrate.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25274, doi. 10.1007/s10854-022-09234-1
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- Article
Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17877, doi. 10.1007/s10854-022-08651-6
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- Article
Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14240, doi. 10.1007/s10854-022-08352-0
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- Article
Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10297, doi. 10.1007/s10854-022-08018-x
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- Article
Long-term electrically stable silver nanowire composite transparent electrode under high current density.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 20919, doi. 10.1007/s10854-021-06386-4
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- Article
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17336, doi. 10.1007/s10854-021-06256-z
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- Article
Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22966, doi. 10.1007/s10854-020-04824-3
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- Article
Numerical simulation of time fractional Cable equations and convergence analysis.
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- Numerical Methods for Partial Differential Equations, 2018, v. 34, n. 5, p. 1556, doi. 10.1002/num.22225
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- Article
FTIR study of aquamarines after gamma irradiation, heat treatment and electrodiffusion.
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- REM - International Engineering Journal, 2017, v. 70, n. 3, p. 289, doi. 10.1590/0370-44672016700076
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- Article
Modeling the effect of insoluble corrosion products on pitting corrosion kinetics of metals.
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- NPJ Materials Degradation, 2019, v. 3, n. 1, p. N.PAG, doi. 10.1038/s41529-019-0090-5
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- Article
The new nanophysiology: regulation of ionic flow in neuronal subcompartments.
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- 2015
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- Publication type:
- journal article
粗锢电解过程中铅锡杂质电迁移规律研究.
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- Hydrometallurgy of China, 2022, v. 41, n. 2, p. 137, doi. 10.13355/j.cnki.sfyj.2022.02.009
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- Publication type:
- Article
Mitigating Particulates Emitted by Mosquito Coils Using Unipolar Ionisers: Implications to Deposition in Human Respiratory Tract System.
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- Indoor & Built Environment, 2013, v. 22, n. 2, p. 347, doi. 10.1177/1420326X11424769
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- Publication type:
- Article
Some features of the wall shear stress in a vertical tube around a small taylor bubble in an upward flow.
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- Technical Physics Letters, 2013, v. 39, n. 10, p. 870, doi. 10.1134/S1063785013100118
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- Article
Studying electromigration of melted inclusions in aluminum-silicon system.
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- Technical Physics Letters, 2011, v. 37, n. 6, p. 507, doi. 10.1134/S1063785011060125
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- Article
Determination of Underivatized Polyamines: A Review of Analytical Methods and Applications.
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- Analytical Letters, 2011, v. 44, n. 13, p. 2245, doi. 10.1080/00032719.2010.551686
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- Article
Investigation of Induced Peak Phenomenon in Capillary Electrophoresis with Electrochemiluminescence Detection.
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- Analytical Letters, 2007, v. 40, n. 18, p. 3457, doi. 10.1080/00032710701689065
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- Article
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study.
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- International Journal of Damage Mechanics, 2014, v. 23, n. 2, p. 203, doi. 10.1177/1056789513488396
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- Article
Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study.
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- International Journal of Damage Mechanics, 2013, v. 22, n. 8, p. 1127, doi. 10.1177/1056789513477668
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- Article
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses.
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- International Journal of Damage Mechanics, 2006, v. 15, n. 1, p. 41, doi. 10.1177/1056789506054311
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- Article
Mechanical Implications of High Current Densities in Flip-chip Solder Joints.
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- International Journal of Damage Mechanics, 2004, v. 13, n. 4, p. 335, doi. 10.1177/1056789504044282
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- Article
Damage Process of Polycrystalline LSI Conductor Due to Atom Migration Induced by Electric Current and Stress.
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- International Journal of Damage Mechanics, 2002, v. 11, n. 2, p. 113, doi. 10.1106/105678902023085
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- Article