Works matching DE "ELECTRIC insulators %26 insulation"
1
- IEEJ Transactions on Electrical & Electronic Engineering, 2025, v. 20, n. 7, p. 1045, doi. 10.1002/tee.24267
- Gao, Haili;
- Hu, Jianzhong;
- Wu, Wei;
- Tong, Chao;
- Li, Min;
- Zhuang, Yufeng
- Article
2
- Energies (19961073), 2025, v. 18, n. 11, p. 2932, doi. 10.3390/en18112932
- Chen, Junsheng;
- Wang, Peng
- Article
3
- Mechanics of Advanced Materials & Structures, 2025, v. 32, n. 12, p. 2886, doi. 10.1080/15376494.2024.2386394
- Qi, Hui;
- Qu, Enxiang;
- Guo, Jing;
- Chu, Fuqing;
- Yuan, Shangqi
- Article
4
- Molecules, 2025, v. 30, n. 10, p. 2107, doi. 10.3390/molecules30102107
- Cordoba, Aldo;
- Vargas-Coronado, Rossana Faride;
- Velázquez-Castillo, Rodrigo;
- Cauich-Rodríguez, Juan Valerio;
- Esquivel, Karen
- Article
5
- Applied Sciences (2076-3417), 2025, v. 15, n. 10, p. 5327, doi. 10.3390/app15105327
- Kampik, Marian;
- Cichy, Adam
- Article
6
- Nature Communications, 2025, v. 16, n. 1, p. 1, doi. 10.1038/s41467-025-60118-4
- Seo, Hyeonyeob;
- Lee, Gun-Hee;
- Park, Jiwoo;
- Kim, Dong-Yeong;
- Son, Yeonzu;
- Kim, Semin;
- Nam, Kum Seok;
- Yang, Congqi;
- Won, Joonhee;
- Bae, Jae-Young;
- Kim, Hyunjun;
- Kang, Seung-Kyun;
- Park, Steve;
- Kang, Jiheong;
- Park, Seongjun
- Article
7
- Journal of Materials Science & Engineering (1673-2812), 2025, v. 43, n. 2, p. 210, doi. 10.14136/j.cnki.issn1673-2812.2025.02.006
- CHEN Hao;
- TIAN Zhengbo;
- ZHANG Yang;
- WAN Shuai;
- SUN Qixun;
- WU Zhongkui
- Article
8
- Polymers (20734360), 2025, v. 17, n. 10, p. 1308, doi. 10.3390/polym17101308
- Article
9
- Energies (19961073), 2025, v. 18, n. 10, p. 2583, doi. 10.3390/en18102583
- Alqtish, Mohammad;
- Di Fatta, Alessio;
- Rizzo, Giuseppe;
- Akbar, Ghulam;
- Li Vigni, Vincenzo;
- Imburgia, Antonino;
- Ala, Guido;
- Candela, Roberto;
- Romano, Pietro
- Article
10
- Coatings (2079-6412), 2025, v. 15, n. 5, p. 555, doi. 10.3390/coatings15050555
- Lu, Linfei;
- Tan, Yipeng;
- Gao, Hang;
- Fu, Chiung Kuei;
- Yao, Lingmin;
- Deng, Qinglin
- Article
11
- Soft Materials, 2011, v. 9, n. 1, p. 44, doi. 10.1080/1539445X.2010.525445
- Damaceanu, Mariana-Dana;
- Rusu, Radu-Dan;
- Musteata, Valentina-Elena;
- Bruma, Maria
- Article
12
- Pertanika Journal of Social Sciences & Humanities, 2017, v. 25 S, p. 167
- Sánchez, Ricardo B.;
- Ahmad, Sabarinah S.;
- Zeevaert Alcantara, Leonardo B.;
- Flores, Arturo Valeriano
- Article
13
- Solid State Technology, 2000, v. 43, n. 12, p. 32
- Article
14
- Journal of Electronic Materials, 2025, v. 54, n. 6, p. 4874, doi. 10.1007/s11664-024-11692-8
- Zheng, Weigang;
- Ma, Yiling;
- Geng, Lina;
- Zhang, Zhongrui;
- Tang, Hong;
- Fan, Qirui
- Article
15
- Journal of Electronic Materials, 2025, v. 54, n. 1, p. 859, doi. 10.1007/s11664-024-11610-y
- Boumous, Samira;
- Boumous, Zouhir;
- Latreche, Samia;
- Habeeb, Majeed Ali;
- Fellah, Mamoun;
- Lamiri, Leila;
- Avramov, Pavel V.;
- El-Hiti, Gamal A.
- Article
16
- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6403, doi. 10.1007/s11664-024-11285-5
- Tu, Xuesong;
- Zhou, Hong;
- Chi, Hao;
- Zhou, Jian
- Article
17
- Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2309, doi. 10.1007/s11664-024-11007-x
- Gan, Lihong;
- Zheng, Zhipeng;
- Liu, Yinchen;
- Zhao, Jun;
- Yan, Min;
- Wang, Zhibin;
- Xiong, Tongqiang;
- Feng, Bo
- Article
18
- Surface Engineering, 2012, v. 28, n. 8, p. 564, doi. 10.1179/1743294412Y.0000000029
- Sundar, R;
- Kumar, H;
- Kaul, R;
- Ranganathan, K;
- Tiwari, P;
- Kukreja, L M;
- Oak, S M
- Article
19
- Surface Engineering, 2011, v. 27, n. 8, p. 557, doi. 10.1179/174329411X13092681464923
- Smurov, Igor;
- Ulianitsky, Vladimir
- Article
20
- Surface Engineering, 2011, v. 27, n. 5, p. 389, doi. 10.1179/1743294410Y.0000000024
- Article
21
- Surface Engineering, 2005, v. 21, n. 3, p. 249, doi. 10.1179/174329405X50118
- Article
22
- Surface Engineering, 2003, v. 19, n. 6, p. 410, doi. 10.1179/026708403225010136
- Amaral, M.;
- Oliveira, F. J.;
- Belmonte, M.;
- Fernandes, A. J. S.;
- Costa, F. M.;
- Silva, R. F.
- Article
23
- Doklady Biochemistry & Biophysics, 2004, v. 398, n. 1-6, p. 268, doi. 10.1023/B:DOBI.0000046634.18547.a0
- Kullyev, A. P.;
- Parshikov, A. F.;
- Georgiev, P. G.;
- Gruzdeva, N. M.
- Article
24
- Doklady Biochemistry & Biophysics, 2004, v. 398, n. 1-6, p. 282, doi. 10.1023/B:DOBI.0000046637.82724.d0
- Mel'nik, E. S.;
- Georgiev, P. G.;
- Golovnin, A. K.
- Article
25
- Chemistry - A European Journal, 2020, v. 26, n. 58, p. 13295, doi. 10.1002/chem.202002487
- Lei, Feifei;
- Cao, Yuqing;
- Fu, Yifang;
- Li, Yunliang;
- Wang, Runwei;
- Qiu, Shilun;
- Zhang, Zongtao
- Article
26
- Angewandte Chemie, 2016, v. 128, n. 29, p. 8545, doi. 10.1002/anie.201600517
- Cai, Qiran;
- Mateti, Srikanth;
- Yang, Wenrong;
- Jones, Rob;
- Watanabe, Kenji;
- Taniguchi, Takashi;
- Huang, Shaoming;
- Chen, Ying;
- Li, Lu Hua
- Article
27
- Angewandte Chemie, 2015, v. 127, n. 48, p. 14490, doi. 10.1002/ange.201507328
- Zhao, Shanyu;
- Malfait, Wim J.;
- Demilecamps, Arnaud;
- Zhang, Yucheng;
- Brunner, Samuel;
- Huber, Lukas;
- Tingaut, Philippe;
- Rigacci, Arnaud;
- Budtova, Tatiana;
- Koebel, Matthias M.
- Article
28
- Angewandte Chemie, 2014, v. 126, n. 39, p. 10562, doi. 10.1002/ange.201405123
- Kobayashi, Yuri;
- Saito, Tsuguyuki;
- Isogai, Akira
- Article
29
- Angewandte Chemie, 2014, v. 126, n. 25, p. 6543, doi. 10.1002/ange.201403530
- Zhuang, Awei;
- Li, Jia-Jun;
- Wang, You-Cheng;
- Wen, Xin;
- Lin, Yue;
- Xiang, Bin;
- Wang, Xiaoping;
- Zeng, Jie
- Article
30
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14061, doi. 10.1007/s10854-019-01771-6
- Nazir, M. Tariq;
- Phung, B. T.;
- Li, Shengtao;
- Akram, Shakeel;
- Mehmood, M. Ali;
- Yeoh, Guan. H.;
- Hussain, Shahid
- Article
31
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 6491, doi. 10.1007/s10854-019-00954-5
- Alptekin, Sebahaddin;
- Altındal, Şemsettin
- Article
32
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1531, doi. 10.1007/s10854-018-0424-z
- Li, Jialong;
- Yin, Jinghua;
- Feng, Yu;
- Liu, Yuanyuan;
- Zhao, He;
- Li, Yanpeng;
- Zhu, Congcong;
- Su, Bo;
- Yue, Dong;
- Liu, Xiaoxu
- Article
33
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 14267, doi. 10.1007/s10854-018-9560-8
- Weng, Ling;
- Wang, HeBing;
- Zhang, Xiaorui;
- Liu, Lizhu;
- Zhang, Hexin
- Article
34
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13526, doi. 10.1007/s10854-018-9480-7
- El-Mehalawy, N.;
- Awaad, M.;
- Eliyan, T.;
- Abd-Allah, M. A.;
- Naga, S. M.
- Article
35
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 617, doi. 10.1007/s10854-016-5566-2
- Duangchan, Sethavut;
- Koishikawa, Yusuke;
- Shirahama, Ryouya;
- Oishi, Koichiro;
- Baba, Akiyoshi;
- Matsumoto, Satoshi;
- Hasegawa, Masataka
- Article
36
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3448, doi. 10.1007/s10854-013-1269-0
- Markondeya Raj, P.;
- Sharma, Himani;
- Samtani, Saurabh;
- Mishra, Dibyajat;
- Nair, Vijay;
- Tummala, Rao
- Article
37
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 694, doi. 10.1007/s10854-010-0198-4
- Medgyes, Bálint;
- Illés, Balázs;
- Berényi, Richárd;
- Harsányi, Gábor
- Article
38
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, p. 355, doi. 10.1007/s10854-008-9621-5
- Jun Jie Wang;
- Wen-Hsi Lee;
- Jia Chung Ho;
- Tang Shiang Hu
- Article
39
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 73, doi. 10.1007/s10854-007-9558-0
- Edelman, Piotr;
- Wilson, Marshall;
- D’Amico, John;
- Savtchouk, Alexandre;
- Lagowski, Jacek
- Article
40
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 285, doi. 10.1007/s10854-007-9513-0
- Claudio, Gianfranco;
- Calnan, Sonya;
- Bass, Kevin;
- Boreland, Matt
- Article
41
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 915, doi. 10.1007/s10854-008-9713-2
- Wu, Mo;
- Alivov, Y. I.;
- Morkoç, Hadis
- Article
42
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 894, doi. 10.1007/s10854-008-9623-3
- Article
43
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 902, doi. 10.1007/s10854-008-9679-0
- Tyagi, Hitender Kumar;
- George, P. J.
- Article
44
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 810, doi. 10.1007/s10854-007-9454-7
- Matsuura, Hideharu;
- Takahashi, Miyuki;
- Nagata, Shunji;
- Taniguchi, Kazuo
- Article
45
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 161, doi. 10.1007/s10854-007-9301-x
- Hayama, K.;
- Takakura, K.;
- Ohyama, H.;
- Rafí, J. M.;
- Mercha, A.;
- Simoen, E.;
- Claeys, C.
- Article
46
- Journal of Materials Science Letters, 2003, v. 22, n. 23, p. 1689, doi. 10.1023/B:JMSL.0000004650.99686.96
- Zhang, X. Y.;
- Chen, Y. J.;
- Zhang, Y. L.
- Article
47
- Cellulose, 2022, v. 29, n. 5, p. 2795, doi. 10.1007/s10570-021-04344-1
- Nemoto, Junji;
- Nakamata, Keiichi
- Article
48
- Cellulose, 2022, v. 29, n. 2, p. 1081, doi. 10.1007/s10570-021-04338-z
- Jusner, Paul;
- Bacher, Markus;
- Simon, Jonas;
- Bausch, Florian;
- Khaliliyan, Hajar;
- Schiehser, Sonja;
- Sumerskii, Ivan;
- Schwaiger, Elisabeth;
- Potthast, Antje;
- Rosenau, Thomas
- Article
49
- Cellulose, 2021, v. 28, n. 18, p. 11533, doi. 10.1007/s10570-021-04237-3
- Fernández-Diego, C.;
- Carrascal, I. A.;
- Ortiz, A.;
- Fernández, I.;
- Ferreño, D.;
- Diego, S.;
- Casado, A.
- Article